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11. 发明授权

US07083477B1 Providing mechanical support for modular interconnect systems 失效
标题翻译：为模块化互连系统提供机械支持
公开(公告)号：US07083477B1
公开(公告)日：2006-08-01
申请号：US11193822
申请日：2005-07-29
申请人： William Louis Brodsky , Michael F. Scanlon , John G. Torok
发明人： William Louis Brodsky , Michael F. Scanlon , John G. Torok
IPC分类号： H01R9/22
CPC分类号： H01R12/52 , H01R12/727
摘要： A connector system includes a first connector assembly that is electrically connected to wiring on a first printed wiring board and a second connector assembly that is electrically connected to wiring on a second printed wiring board. Each connector assembly includes a number of connector modules that are joined together in a predetermined array such as a row. In one of the connector assemblies, the row also includes one or more actuation modules. The actuation module or modules are engaged by an actuator mechanism to force the connector assemblies into mating engagement or to draw them apart.
摘要翻译：连接器系统包括电连接到第一印刷线路板上的布线的第一连接器组件和与第二印刷线路板上的布线电连接的第二连接器组件。每个连接器组件包括多个连接器模块，其以诸如行的预定阵列连接在一起。在一个连接器组件中，该行还包括一个或多个致动模块。致动模块或模块通过致动器机构接合以迫使连接器组件配合接合或将它们分开。

12. 发明授权

US06462271B2 Capping structure for electronics package undergoing compressive socket actuation 失效
公开(公告)号：US06462271B2
公开(公告)日：2002-10-08
申请号：US09748829
申请日：2000-12-27
申请人： Jeffrey T. Coffin , Michael J. Ellsworth, Jr. , Lewis S. Goldmann , John G. Torok
发明人： Jeffrey T. Coffin , Michael J. Ellsworth, Jr. , Lewis S. Goldmann , John G. Torok
IPC分类号： H05K720
CPC分类号： H01L24/72 , H01L2023/4087 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/14 , H01L2924/1433 , H01L2924/19041 , H05K7/1061
摘要： A capping structure and capping method are presented for an electronics package having a substrate and one or more electronics devices disposed on the substrate. The capping structure includes a capping plate sized to cover the electronics device(s) disposed on the substrate, and two or more force transfer pins. The force transfer pins are disposed between the capping plate and the substrate so that when a force is applied to the capping plate or the substrate, the force is transferred therebetween via the force transfer pins. Various capping plate and pin configurations are presented.

13. 发明授权

US08934222B2 Split- and collapsible-top hat frame height reduction features 有权
标题翻译：分体式和折叠式顶帽减框功能
公开(公告)号：US08934222B2
公开(公告)日：2015-01-13
申请号：US11862249
申请日：2007-09-27
申请人： William P. Kostenko , Steven C. McIntosh , Budy D. Notohardjono , John G. Torok , Howard P. Welz
发明人： William P. Kostenko , Steven C. McIntosh , Budy D. Notohardjono , John G. Torok , Howard P. Welz
IPC分类号： H05K5/00 , H05K7/00 , G11B33/02 , E04G3/00 , A47B96/06 , H05K7/14
CPC分类号： H05K7/1488 , Y10T29/49826 , Y10T74/1555
摘要： An enhanced computer assembly and related method is provided that enables easy shipment and installation of such computing systems. In one embodiment a split top hat design is provided that can be removed. The removable split hat comprises a receiving member and an inner member that are secured to the frame in a manner that can be easily removed. In an alternate embodiment, a collapsible top hat is provided which adjusts the height of the assembly from a first to a second position. The collapsible feature has an upper portion that is connected to a plurality of pivoted side members that are capable of collapsing onto themselves.
摘要翻译：提供了一种增强的计算机组件和相关方法，其使得能够容易地装运和安装这样的计算系统。在一个实施例中，提供可以移除的分体式顶帽设计。可拆卸的分体帽包括容纳构件和内部构件，其以能够容易地移除的方式固定到框架。在替代实施例中，提供可折叠的顶帽，其将组件的高度从第一位置调整到第二位置。可折叠特征具有连接到能够折叠到自身上的多个枢转侧部构件的上部。

14. 发明授权

US08589608B2 Logic node connection system 失效
标题翻译：逻辑节点连接系统
公开(公告)号：US08589608B2
公开(公告)日：2013-11-19
申请号：US13035926
申请日：2011-02-26
申请人： William L. Brodsky , Eric J. McKeever , John G. Torok
发明人： William L. Brodsky , Eric J. McKeever , John G. Torok
IPC分类号： G06F13/00 , H05K1/00 , H01R12/00
CPC分类号： G06F13/409
摘要： A system to mate logic nodes may include a connector to secure at least one of an inter-nodal circuit and a fabric bus, where the inter-nodal circuit provides communications between any connected logic nodes, and the fabric bus provides logical connections to a first logic node and any other logic node. The system may also include an element carried by the connector configured to provide an appropriate actuation force to mate the connector and at least one of the inter-nodal circuit and the fabric bus.
摘要翻译：用于配合逻辑节点的系统可以包括用于保护节点间电路和结构总线中的至少一个的连接器，其中节点间电路提供任何连接的逻辑节点之间的通信，并且所述结构总线提供到第一逻辑节点和任何其他逻辑节点。该系统还可以包括由连接器承载的元件，其被配置为提供适当的致动力以使连接器和节点间线路和织物总线中的至少一个配合。

15. 发明申请

US20120221760A1 SYSTEM TO OPERATIONALLY CONNECT LOGIC NODES 有权
标题翻译：系统操作连接LOGIC NODES
公开(公告)号：US20120221760A1
公开(公告)日：2012-08-30
申请号：US13035924
申请日：2011-02-26
申请人： William L. Brodsky , Eric J. McKeever , John G. Torok
发明人： William L. Brodsky , Eric J. McKeever , John G. Torok
IPC分类号： G06F13/36
CPC分类号： G06F13/4217
摘要： A system to operationally connect logic nodes may include an inter-nodal circuit to provide communications between any connected logic nodes. The system may also include a fabric bus that may be physically separate from the inter-nodal circuit, the fabric bus may provide logical connections restricted to any two connected logic nodes. The system may further include a clock circuit carried by the inter-nodal circuit that controls both the inter-nodal circuit and the fabric bus.
摘要翻译：用于操作地连接逻辑节点的系统可以包括节点间电路以提供任何连接的逻辑节点之间的通信。该系统还可以包括可以在物理上与节点间电路分离的结构总线，结构总线可以提供限于任何两个连接的逻辑节点的逻辑连接。该系统还可以包括由节点间电路承载的时钟电路，其控制节间电路和织物总线。

16. 发明授权

US08079481B2 Integrated frame and central electronic complex structure 失效
标题翻译：集成框架和中央电子复合结构
公开(公告)号：US08079481B2
公开(公告)日：2011-12-20
申请号：US11262051
申请日：2005-10-28
申请人： Shawn M. Canfield , John J. Loparco , Budy D. Notohardjono , John G. Torok
发明人： Shawn M. Canfield , John J. Loparco , Budy D. Notohardjono , John G. Torok
IPC分类号： H05K7/14
CPC分类号： H05K7/183
摘要： A cabinet assembly is provided that can be quickly assembled and disassembled inside side racks used for the purpose of housing computer systems. The assembly comprises a plurality of side plates that can be secured to inside rack sides, preferably through flexible flanges, a plurality of top and bottom plates that can be secured to the side plates, and a mid-plate is disposed substantially horizontally between the top and bottom plates. Alternately, the assembly can also comprise at least one rear plate that can be secured to the side plates to provide a third side for the assembly. The rear plates having openings designed to allow for front to back air flow ventilation. The assembly can also have at least one divider plate, and preferably a plurality of divider plates, that can be secured to the top and bottom and/or mid-plate(s). In such a case, the divider plates are disposed above and/or below the mid-plate and preferably each have an upper divider plate and a lower divider plate.
摘要翻译：提供了一个柜组件，可以在用于容纳计算机系统的侧面机架内部快速组装和拆卸。组件包括多个侧板，其可以优选地通过柔性凸缘固定在机架侧面内;多个顶板和底板可固定到侧板，中间板基本上水平地设置在顶部和底板。或者，组件还可以包括至少一个后板，其可固定到侧板以提供用于组件的第三侧。后板具有设计成允许前后气流通风的开口。组件还可以具有至少一个分隔板，并且优选地多个分隔板，其可以固定到顶部和底部和/或中间板。在这种情况下，分隔板设置在中板的上方和/或下方，并且优选地各自具有上分隔板和下分隔板。

17. 发明授权

US07987587B2 Method of forming solid vias in a printed circuit board 失效
标题翻译：在印刷电路板中形成固体通孔的方法
公开(公告)号：US07987587B2
公开(公告)日：2011-08-02
申请号：US12043994
申请日：2008-03-07
申请人： Wiren Dale Becker , Michael Ford McAllister , Alan Daniel Stigliani , John G. Torok
发明人： Wiren Dale Becker , Michael Ford McAllister , Alan Daniel Stigliani , John G. Torok
IPC分类号： H05K3/02 , H05K3/10
CPC分类号： H05K3/4069 , H05K3/4015 , H05K3/4038 , H05K2201/0187 , H05K2201/0305 , H05K2203/0165 , H05K2203/043 , H05K2203/0763 , H05K2203/1147 , Y10T29/49155 , Y10T29/49158 , Y10T29/49163 , Y10T29/49165 , Y10T29/49211
摘要： A method is described by which an electrical path is created between layers on a printed circuit board (PCB) without the use of plated through holes (PTH). Through the use of a liquid solder or conductive epoxy injection fixture, a conductive path is created in pre-drilled holes forming an electrical connection between internal PCB metal layers and surface mounted components without the creation of parasitic stubs on the signal nets.
摘要翻译：描述了一种在不使用电镀通孔（PTH）的情况下在印刷电路板（PCB）上的层之间形成电路径的方法。通过使用液体焊料或导电环氧树脂注射夹具，在预钻孔中形成导电路径，形成内部PCB金属层和表面安装元件之间的电连接，而不会在信号网上产生寄生短截线。

18. 发明授权

US07766684B2 Connector actuation mechanism 失效
标题翻译：连接器致动机构
公开(公告)号：US07766684B2
公开(公告)日：2010-08-03
申请号：US12035595
申请日：2008-02-22
申请人： Dennis R. Barringer , William L. Brodsky , Francesco Chiarella , John J. Loparco , Michael F. Scanlon , John G. Torok
发明人： Dennis R. Barringer , William L. Brodsky , Francesco Chiarella , John J. Loparco , Michael F. Scanlon , John G. Torok
IPC分类号： H01R13/62
CPC分类号： H05K7/1407
摘要： A mechanism for electrically connecting a first electronic component to a second electronic component. The mechanism includes an actuating member disposed in the first electronic component including a first connector half and an actuation screw having a head and a threaded end. The actuation screw is located in the first electronic component wherein rotation of the actuation screw urges the actuating member in a direction substantially perpendicular to an axis of the actuation screw thereby engaging the first connector half to a second connector half disposed in the second electronic component. A method for electrically connecting a first electronic component to a second electronic component includes rotating an actuation screw disposed in the first electronic component and in operable communication with an actuating member disposed in the first electronic component, the actuating member including a first connector half. The actuating member is urged in a direction substantially perpendicular to an axis of the actuation screw by the rotation of the actuation screw and the first connector half is engaged to a second connector half disposed in the second electronic component.
摘要翻译：一种用于将第一电子部件电连接到第二电子部件的机构。该机构包括设置在第一电子部件中的致动部件，其包括第一连接器半部和具有头部和螺纹端部的致动螺钉。致动螺钉位于第一电子部件中，其中致动螺杆的旋转沿着基本上垂直于致动螺钉的轴线的方向推动致动构件，从而将第一连接器半部接合到设置在第二电子部件中的第二连接器半体。用于将第一电子部件电连接到第二电子部件的方法包括旋转设置在第一电子部件中的致动螺钉，并且与设置在第一电子部件中的致动部件可操作地连通，致动部件包括第一连接器半部。致动构件通过致动螺钉的旋转而沿着基本上垂直于致动螺钉的轴线的方向被推动，并且第一连接器半部被接合到设置在第二电子部件中的第二连接器半体上。

19. 发明申请

US20090223710A1 Method of Forming Solid Vias in a Printed Circuit Board 失效
标题翻译：在印刷电路板中形成固体通孔的方法
公开(公告)号：US20090223710A1
公开(公告)日：2009-09-10
申请号：US12043994
申请日：2008-03-07
申请人： Wiren Dale Becker , Michael Ford McAllister , Alan Daniel Stigliani , John G. Torok
发明人： Wiren Dale Becker , Michael Ford McAllister , Alan Daniel Stigliani , John G. Torok
IPC分类号： H05K1/11 , H05K3/10
CPC分类号： H05K3/4069 , H05K3/4015 , H05K3/4038 , H05K2201/0187 , H05K2201/0305 , H05K2203/0165 , H05K2203/043 , H05K2203/0763 , H05K2203/1147 , Y10T29/49155 , Y10T29/49158 , Y10T29/49163 , Y10T29/49165 , Y10T29/49211
摘要： A method is described by which an electrical path is created between layers on a printed circuit board (PCB) without the use of plated through holes (PTH). Through the use of a liquid solder or conductive epoxy injection fixture, a conductive path is created in pre-drilled holes forming an electrical connection between internal PCB metal layers and surface mounted components without the creation of parasitic stubs on the signal nets.
摘要翻译：描述了一种在不使用电镀通孔（PTH）的情况下在印刷电路板（PCB）上的层之间形成电路径的方法。通过使用液体焊料或导电环氧树脂注射夹具，在预钻孔中形成导电路径，形成内部PCB金属层和表面安装元件之间的电连接，而不会在信号网上产生寄生短截线。

20. 发明申请

US20080067696A1 METHOD AND APPARATUS FOR PREVENTION OF SOLDER CORROSION 失效
标题翻译：防止焊锡腐蚀的方法和装置
公开(公告)号：US20080067696A1
公开(公告)日：2008-03-20
申请号：US11532329
申请日：2006-09-15
申请人： Gary F. Goth , William P. Kostenko , John J. Loparco , Prabjit Singh , John G. Torok
发明人： Gary F. Goth , William P. Kostenko , John J. Loparco , Prabjit Singh , John G. Torok
IPC分类号： H01L23/52
CPC分类号： H01L23/26 , H01L23/3672 , H01L25/0655 , H01L2224/16225 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/1433 , H01L2924/15311 , H01L2224/0401
摘要： Disclosed a multi-chip module with solder corrosion prevention including one or more chips connected to a substrate by soldering, the substrate disposed on a printed circuit board. The multi-chip module also includes a quantity of molecular sieve desiccant, and a first cover to contain the one or more chips, the substrate, and the molecular sieve desiccant, the first cover having a seal to the printed circuit board.
摘要翻译：公开了一种具有焊料防腐蚀性的多芯片模块，包括通过焊接连接到衬底的一个或多个芯片，该衬底设置在印刷电路板上。多芯片模块还包括一定数量的分子筛干燥剂，以及包含一个或多个芯片，基底和分子筛干燥剂的第一盖，第一盖具有与印刷电路板的密封。

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