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1. 发明授权

US08934222B2 Split- and collapsible-top hat frame height reduction features 有权
标题翻译：分体式和折叠式顶帽减框功能
公开(公告)号：US08934222B2
公开(公告)日：2015-01-13
申请号：US11862249
申请日：2007-09-27
申请人： William P. Kostenko , Steven C. McIntosh , Budy D. Notohardjono , John G. Torok , Howard P. Welz
发明人： William P. Kostenko , Steven C. McIntosh , Budy D. Notohardjono , John G. Torok , Howard P. Welz
IPC分类号： H05K5/00 , H05K7/00 , G11B33/02 , E04G3/00 , A47B96/06 , H05K7/14
CPC分类号： H05K7/1488 , Y10T29/49826 , Y10T74/1555
摘要： An enhanced computer assembly and related method is provided that enables easy shipment and installation of such computing systems. In one embodiment a split top hat design is provided that can be removed. The removable split hat comprises a receiving member and an inner member that are secured to the frame in a manner that can be easily removed. In an alternate embodiment, a collapsible top hat is provided which adjusts the height of the assembly from a first to a second position. The collapsible feature has an upper portion that is connected to a plurality of pivoted side members that are capable of collapsing onto themselves.
摘要翻译：提供了一种增强的计算机组件和相关方法，其使得能够容易地装运和安装这样的计算系统。在一个实施例中，提供可以移除的分体式顶帽设计。可拆卸的分体帽包括容纳构件和内部构件，其以能够容易地移除的方式固定到框架。在替代实施例中，提供可折叠的顶帽，其将组件的高度从第一位置调整到第二位置。可折叠特征具有连接到能够折叠到自身上的多个枢转侧部构件的上部。

2. 发明授权

US06921272B2 Method and apparatus for providing positive contact force in an electrical assembly 失效
标题翻译：在电气组件中提供正接触力的方法和装置
公开(公告)号：US06921272B2
公开(公告)日：2005-07-26
申请号：US10435917
申请日：2003-05-12
申请人： John S. Corbin, Jr. , William P. Kostenko , John J. Loparco , Budy D. Notohardjono , John G. Torok
发明人： John S. Corbin, Jr. , William P. Kostenko , John J. Loparco , Budy D. Notohardjono , John G. Torok
IPC分类号： H01R12/16 , H01R13/24 , H01R12/00
CPC分类号： H01R12/7076 , H01L2224/16 , H01L2224/45144 , H01L2224/73253 , H01L2924/01079 , H01L2924/16152 , H01R13/24 , H01L2924/00
摘要： An electrical contact assembly includes a first module having a first set of electrical contacts, a second module having a second set of electrical contacts, a shape-generating module, and a clamping arrangement. The second set of electrical contacts is aligned with the first set of electrical contacts and the shape-generating module is arranged to impart a shape to the second module such that the second set of electrical contacts is driven toward the first set of electrical contacts. The clamping arrangement is arranged to clamp the first, the second, and the shape-generating modules together, thereby resulting in a positive contact force between the first and second sets of electrical contacts. The positive contact force is equal to or greater than a predefined value.
摘要翻译：电触头组件包括具有第一组电触点的第一模块，具有第二组电触点的第二模块，形状产生模块和夹紧装置。第二组电触头与第一组电触头对准，并且形状产生模块被布置成赋予第二模块形状，使得第二组电触点朝向第一组电触点驱动。夹持装置被布置成将第一，第二和形状发生模块夹在一起，从而导致第一和第二组电触点之间的正接触力。正接触力等于或大于预定值。

3. 发明授权

US06829145B1 Separable hybrid cold plate and heat sink device and method 有权
标题翻译：可分离混合冷板和散热装置及方法
公开(公告)号：US06829145B1
公开(公告)日：2004-12-07
申请号：US10671263
申请日：2003-09-25
申请人： Joseph P. Corrado , Gary F. Goth , Randall G. Kemink , William P. Kostenko , Budy D. Notohardjono
发明人： Joseph P. Corrado , Gary F. Goth , Randall G. Kemink , William P. Kostenko , Budy D. Notohardjono
IPC分类号： H05K720
CPC分类号： H01L23/4006 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： An apparatus and method of cooling of an electronic module. The apparatus and method include a heat sink thermally coupled to the module, and a fastener configured to alter a clamping force therebetween as a result of the heat sink and the module formed of materials having a higher coefficient of thermal expansion (CTE) than the fastener.
摘要翻译：一种冷却电子模块的装置和方法。该装置和方法包括热耦合到模块的散热器，以及紧固件，其被配置为由于散热器和由具有比紧固件更高的热膨胀系数（CTE）的材料形成的模块）改变其间的夹紧力。

4. 发明授权

US07651890B2 Method and apparatus for prevention of solder corrosion 失效
标题翻译：防止焊料腐蚀的方法和装置
公开(公告)号：US07651890B2
公开(公告)日：2010-01-26
申请号：US11532329
申请日：2006-09-15
申请人： Gary F. Goth , William P. Kostenko , John J. Loparco , Prabjit Singh , John G. Torok
发明人： Gary F. Goth , William P. Kostenko , John J. Loparco , Prabjit Singh , John G. Torok
IPC分类号： H01L23/26
CPC分类号： H01L23/26 , H01L23/3672 , H01L25/0655 , H01L2224/16225 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/1433 , H01L2924/15311 , H01L2224/0401
摘要： Disclosed a multi-chip module with solder corrosion prevention including one or more chips connected to a substrate by soldering, the substrate disposed on a printed circuit board. The multi-chip module also includes a quantity of molecular sieve desiccant, and a first cover to contain the one or more chips, the substrate, and the molecular sieve desiccant, the first cover having a seal to the printed circuit board.
摘要翻译：公开了一种具有焊料防腐蚀性的多芯片模块，包括通过焊接连接到衬底的一个或多个芯片，该衬底设置在印刷电路板上。多芯片模块还包括一定数量的分子筛干燥剂，以及包含一个或多个芯片，基底和分子筛干燥剂的第一盖，第一盖具有与印刷电路板的密封。

5. 发明申请

US20080067696A1 METHOD AND APPARATUS FOR PREVENTION OF SOLDER CORROSION 失效
标题翻译：防止焊锡腐蚀的方法和装置
公开(公告)号：US20080067696A1
公开(公告)日：2008-03-20
申请号：US11532329
申请日：2006-09-15
申请人： Gary F. Goth , William P. Kostenko , John J. Loparco , Prabjit Singh , John G. Torok
发明人： Gary F. Goth , William P. Kostenko , John J. Loparco , Prabjit Singh , John G. Torok
IPC分类号： H01L23/52
CPC分类号： H01L23/26 , H01L23/3672 , H01L25/0655 , H01L2224/16225 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/1433 , H01L2924/15311 , H01L2224/0401
摘要： Disclosed a multi-chip module with solder corrosion prevention including one or more chips connected to a substrate by soldering, the substrate disposed on a printed circuit board. The multi-chip module also includes a quantity of molecular sieve desiccant, and a first cover to contain the one or more chips, the substrate, and the molecular sieve desiccant, the first cover having a seal to the printed circuit board.
摘要翻译：公开了一种具有焊料防腐蚀性的多芯片模块，包括通过焊接连接到衬底的一个或多个芯片，该衬底设置在印刷电路板上。多芯片模块还包括一定数量的分子筛干燥剂，以及包含一个或多个芯片，基底和分子筛干燥剂的第一盖，第一盖具有与印刷电路板的密封。

6. 发明申请

US20080067651A1 METHOD AND APPARATUS FOR PREVENTION OF SOLDER CORROSION UTILIZING FORCED AIR 审中-公开
标题翻译：防止使用强制空气的焊接腐蚀的方法和装置
公开(公告)号：US20080067651A1
公开(公告)日：2008-03-20
申请号：US11532396
申请日：2006-09-15
申请人： Gary F. Goth , William P. Kostenko , John J. Loparco , Prabjit Singh , John G. Torok
发明人： Gary F. Goth , William P. Kostenko , John J. Loparco , Prabjit Singh , John G. Torok
IPC分类号： H01L21/00
CPC分类号： H01L23/562 , H01L23/041 , H01L23/053 , H01L24/16 , H01L24/32 , H01L25/0655 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/16152 , H01L2224/0401
摘要： Disclosed is a multi-chip module with solder corrosion prevention including one or more chips connected to a substrate by soldering, the substrate situated on a printed circuit board. The multi-chip module also includes a molecular sieve desiccant chamber containing a quantity of molecular sieve desiccant and a first cover to contain the one or more chips, the substrate, and the molecular sieve desiccant, the first cover having a seal to the printed circuit board. The molecular sieve desiccant chamber is connected to the first cover via a first fluid pathway and a second fluid pathway.
摘要翻译：公开了一种具有焊料防腐蚀的多芯片模块，包括通过焊接连接到基板的一个或多个芯片，位于印刷电路板上的基板。多芯片模块还包括含有一定数量的分子筛干燥剂的分子筛干燥剂室和含有一个或多个碎片的第一盖子，基底和分子筛干燥剂，第一盖子具有印刷电路的密封板。分子筛干燥剂室经由第一流体路径和第二流体路径连接到第一盖。

7. 发明授权

US07119433B2 Packaging for enhanced thermal and structural performance of electronic chip modules 有权
标题翻译：用于增强电子芯片模块的热和结构性能的封装
公开(公告)号：US07119433B2
公开(公告)日：2006-10-10
申请号：US10869524
申请日：2004-06-16
申请人： John S. Corbin, Jr. , Gary F. Goth , Dales M. Kent , William P. Kostenko , Roger R. Schmidt , John G. Torok
发明人： John S. Corbin, Jr. , Gary F. Goth , Dales M. Kent , William P. Kostenko , Roger R. Schmidt , John G. Torok
IPC分类号： H01L23/34 , H01L23/12
CPC分类号： H01L23/367 , H01L23/433 , H01L2924/0002 , H01L2924/00
摘要： In an integrated circuit packaging structure, such as in a SCM, DCM, or MCM, a method and apparatus for increasing heat spreader size and thus thermal performance is disclosed. The packaging structure includes a first substrate; an electronic device operably coupled to a top surface defining the first substrate; a heat spreader having a first surface operably coupled to a top surface defining the electronic device and an opposite second surface in thermal communication with a second substrate; and a frame defining an opening therethrough. The frame is further defined by an inwardly extending ledge configured to allow the heat spreader to extend at least to a peripheral edge defining a perimeter of the first substrate. In an exemplary embodiment, the second substrate includes one of a heat sink, cooling plate, thermal spreader, heat pipe, thermal hat, package lid, or other cooling member.
摘要翻译：在诸如在SCM，DCM或MCM中的集成电路封装结构中，公开了一种用于增加散热器尺寸并因此提高散热性能的方法和装置。包装结构包括第一基板; 电子设备，其可操作地耦合到限定所述第一基板的顶表面; 散热器具有可操作地耦合到限定电子设备的顶表面的第一表面和与第二基板热连通的相对的第二表面; 以及限定穿过其中的开口的框架。框架进一步由向内延伸的凸缘限定，该凸缘构造成允许散热器至少延伸至限定第一基板的周边的周边边缘。在示例性实施例中，第二基板包括散热器，冷却板，散热器，热管，散热帽，封装盖或其它冷却构件中的一个。

8. 发明授权

US06785133B2 High density modular input/output package in a data processing system 失效
标题翻译：数据处理系统中的高密度模块化输入/输出封装
公开(公告)号：US06785133B2
公开(公告)日：2004-08-31
申请号：US10256605
申请日：2002-09-27
申请人： Dennis R. Barringer , Philip M. Corcoran , William P. Kostenko , Edward J. Seminaro
发明人： Dennis R. Barringer , Philip M. Corcoran , William P. Kostenko , Edward J. Seminaro
IPC分类号： H05K500
CPC分类号： H05K7/20727 , G06F1/18 , G06F1/20 , H05K7/1461
摘要： An I/O subsystem for providing a high density modular input/output package in a data processing system. The I/O subsystem includes an enclosure having a midplane assembly in the center portion. The enclosure includes electrical components including redundant power supplies, air moving units and DASD carriers having DASD drives assemblies therein in the front portion of the enclosure, and planar boards having PCI card assemblies slidably mounted thereon in the rear portion of the enclosure. The mid plane includes multiconductor power buses for distribution of power from the power supplies to the electrical components of the I/O subsystem.
摘要翻译： I / O子系统，用于在数据处理系统中提供高密度模块化输入/输出包。 I / O子系统包括在中心部分具有中平面组件的外壳。外壳包括电气部件，包括冗余电源，空气移动单元和在外壳前部具有DASD驱动组件的DASD载体，以及具有可滑动地安装在外壳后部的PCI卡组件的平面板。中间平面包括用于将电力从电源分配到I / O子系统的电气部件的多导体电力总线。

9. 发明申请

US20130328400A1 CONTROLLING A FAULT-TOLERANT ARRAY OF CONVERTERS 有权
标题翻译：控制转换器的容错阵列
公开(公告)号：US20130328400A1
公开(公告)日：2013-12-12
申请号：US13592553
申请日：2012-08-23
申请人： Daniel J. Barus , Kevin R. Covi , William P. Kostenko , Jack P. Lee , Peter A. Wendling
发明人： Daniel J. Barus , Kevin R. Covi , William P. Kostenko , Jack P. Lee , Peter A. Wendling
IPC分类号： H02J4/00
CPC分类号： H02J5/00 , G06F1/263 , G06F1/28 , G06F1/305 , Y10T307/50 , Y10T307/62
摘要： A redundant path power subsystem comprises a plurality of phase regulators in a multi-phase power converter. The plurality of phase regulators comprises at least N+2 phase regulators. N phases are sufficient to serve an electrical load coupled with the redundant path power subsystem. The redundant path power subsystem also comprises a plurality of power supplies, and a plurality of input and control paths between the plurality of power supplies and the plurality of phase regulators. The plurality of input and control paths comprises a plurality of multiplexing logic devices and a plurality of phase controllers. The plurality of phase controllers is operable to control the plurality of phase regulators. The plurality of multiplexing logic devices is operable to multiplex control signals from the plurality of power supplies and a microprocessor for the plurality of phase controllers.
摘要翻译：冗余路径功率子系统包括多相功率转换器中的多个相位调节器。多个相位调节器至少包括N + 2相位调节器。 N个相位足以用于与冗余路径功率子系统耦合的电负载。冗余路径功率子系统还包括多个电源，以及多个电源和多个相位调节器之间的多个输入和控制路径。多个输入和控制路径包括多个复用逻辑器件和多个相位控制器。多个相位控制器可操作以控制多个相位调节器。多个复用逻辑器件可操作用于复用来自多个电源的控制信号和多个相位控制器的微处理器。

10. 发明授权

US08514575B2 Multimodal cooling apparatus for an electronic system 有权
标题翻译：用于电子系统的多模式冷却装置
公开(公告)号：US08514575B2
公开(公告)日：2013-08-20
申请号：US12947293
申请日：2010-11-16
申请人： Gary F. Goth , William P. Kostenko , Robert K. Mullady , Allan C. Vandeventer
发明人： Gary F. Goth , William P. Kostenko , Robert K. Mullady , Allan C. Vandeventer
IPC分类号： H05K7/20
CPC分类号： H05K7/20781 , F28D15/00 , F28D2021/0031
摘要： An apparatus is provided for cooling an electronic system, which includes one or more electronic components across which air passing through the system flows. A cooling unit provides, via a coolant loop, system coolant to cool the electronic component(s), and to an air-to-liquid heat exchanger is coupled to the coolant loop downstream of the electronic component(s) to cool, in primary, liquid-cooling mode, air passing through the system. In primary, liquid-cooling mode, the cooling unit provides cooled system coolant to cool the electronic component(s), and provides system coolant to the air-to-liquid heat exchanger to cool at least a portion of air passing through the electronic system, and in a secondary, air-cooling mode, system coolant flows from cooling the electronic component(s) to the air-to-liquid heat exchanger for rejecting, via the system coolant, heat from the electronic component(s) to air passing across the air-to-liquid heat exchanger.
摘要翻译：提供了一种用于冷却电子系统的装置，该电子系统包括一个或多个电子部件，穿过该系统的空气流过该电子部件。冷却单元通过冷却剂回路提供系统冷却剂以冷却电子部件，并且空气 - 液体热交换器被耦合到电子部件下游的冷却剂回路，以在初级，液冷模式，空气通过系统。在主要的液体冷却模式中，冷却单元提供冷却的系统冷却剂以冷却电子部件，并且向空气 - 液体热交换器提供系统冷却剂，以冷却通过电子系统的至少一部分空气，并且在次级空气冷却模式中，系统冷却剂从冷却电子部件到空气到液体热交换器流动，以便经由系统冷却剂从电子部件排出到通过的空气横跨空气对液体的热交换器。

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