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11. 发明申请

US20100061153A1 Refresh Method for a Non-volatile Memory 审中-公开
标题翻译：非易失性存储器的刷新方法
公开(公告)号：US20100061153A1
公开(公告)日：2010-03-11
申请号：US12344288
申请日：2008-12-26
申请人： Ching-Fang Yen , Che-Heng Lai , Chih-Yuan Cheng
发明人： Ching-Fang Yen , Che-Heng Lai , Chih-Yuan Cheng
IPC分类号： G11C16/06
CPC分类号： G11C16/3418 , G11C16/3431
摘要： A refresh method for a non-volatile memory for preventing disturb phenomenon includes dividing a plurality of sectors of a block of the non-volatile memory into a plurality of groups, determining a first group of the plurality of groups according to a first value when a first sector of the plurality of sectors is performed an erase operation, and reading and rewriting data of sectors of the first group.
摘要翻译：用于防止干扰现象的非易失性存储器的刷新方法包括：将非易失性存储器的块的多个扇区划分成多个组，当根据第一个值确定多个组中的第一组时，执行多个扇区中的第一扇区的擦除操作，以及读取和重写第一组的扇区的数据。

12. 外观设计

USD509194S1 Thermal module 失效
公开(公告)号：USD509194S1
公开(公告)日：2005-09-06
申请号：US29196438
申请日：2003-12-31
申请人： Chi-Chang Lin , Chih-Yuan Cheng , Heng-Tsung Wang
设计人： Chi-Chang Lin , Chih-Yuan Cheng , Heng-Tsung Wang

13. 发明授权

US09371117B2 Rescue system for semi-sealed marine vessels 有权
标题翻译：半密封船只救援系统
公开(公告)号：US09371117B2
公开(公告)日：2016-06-21
申请号：US14253882
申请日：2014-04-16
申请人： Chih-Yuan Cheng
发明人： Chih-Yuan Cheng
IPC分类号： B63B43/12
CPC分类号： B63B43/12 , B63B2043/126
摘要： Disclosed is a rescue system for semi-sealed marine vessels, which includes a rescue unit and a backup rescue machine. The rescue unit is installed in a vessel compartment and includes an air bag, a canister containing compressed gas, a needle valve, and a flow control valve for employing the physical property that air has a specific gravity smaller than water, whereby when water leaks into the vessel compartment, through pressing down the needle valve, the compressed air is supplied into the air bag for inflating and expanding the air bag to get floating on the seawater inside the vessel compartment and occupy the internal space of the vessel compartment. The backup rescue machine includes an air compressor and at least a diversion valve to supplement a great amount of high-pressure gas to the vessel compartment for preventing water leaking into the vessel compartment.
摘要翻译：公开了一种半密封船舶救援系统，其中包括救援单元和备用救援机。救援单元安装在容器隔室中，包括气囊，包含压缩气体的罐，针阀和流量控制阀，用于使用比重小于水的空气的物理性质，由此当水泄漏容器隔室通过按压针阀，将压缩空气供应到气囊中，用于使气囊膨胀和膨胀，以浮动在容器隔室内的海水上并占据容器隔室的内部空间。备用救援机器包括一个空气压缩机和至少一个分流阀，以补充大量的高压气体到容器隔室，以防止水泄漏到容器隔室中。

14. 发明授权

US08026603B2 Interconnect structure of an integrated circuit and manufacturing method thereof 有权
标题翻译：集成电路的互连结构及其制造方法
公开(公告)号：US08026603B2
公开(公告)日：2011-09-27
申请号：US11408072
申请日：2006-04-21
申请人： Yung-Yu Hsu , Chih-Yuan Cheng , Shyi-Ching Liau , Min-Lin Lee , Ra-Min Tain , Rong-Chang Feng
发明人： Yung-Yu Hsu , Chih-Yuan Cheng , Shyi-Ching Liau , Min-Lin Lee , Ra-Min Tain , Rong-Chang Feng
IPC分类号： H01L23/52
CPC分类号： H01L24/12 , H01L23/49811 , H01L24/11 , H01L24/16 , H01L24/90 , H01L2224/1147 , H01L2224/11902 , H01L2224/13099 , H01L2224/1411 , H01L2224/16105 , H01L2224/16106 , H01L2224/16237 , H01L2224/81193 , H01L2224/81194 , H01L2224/81385 , H01L2224/81899 , H01L2924/01006 , H01L2924/014 , H01L2924/14 , H01L2924/351 , H05K3/326 , H05K2201/0373 , H05K2201/209 , H01L2924/00
摘要： An interconnect structure of an integrated circuit and manufacturing method therefore are provided, relating to an interconnect structure of flexible packaging. The interconnect structure includes a first and a second conductive pads. A plurality of tiny and conductive first pillars is respectively formed on the first and second pads. With different densities and thicknesses of the first and second pillars, a contact strength can be generated when the pillars interconnecting with each other, such that the pillars are connected closely. Furthermore, the interconnect structure can also be used to connect with fibers made of conductive materials. Moreover, the higher the density of the pillars, the stronger the contact strength. And, electronic substrates and active or passive electronic elements can be stuck on the other side of each pad. Therefore, the interconnect structure can maintain flexibility and have high reliability without being enhanced by any thermosetting polymer.
摘要翻译：因此，提供了与柔性包装的互连结构相关的集成电路和制造方法的互连结构。互连结构包括第一和第二导电焊盘。多个微小且导电的第一支柱分别形成在第一和第二垫上。当第一和第二支柱具有不同的密度和厚度时，当支柱互相连接时，可以产生接触强度，使得支柱紧密连接。此外，互连结构也可以用于与由导电材料制成的纤维连接。此外，支柱的密度越高，接触强度越强。并且，电子基板和有源或无源电子元件可以卡在每个垫的另一侧上。因此，互连结构可以保持柔性并且具有高可靠性，而不会被任何热固性聚合物增强。

15. 发明申请

US20100224983A1 SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：半导体封装结构及其制造方法
公开(公告)号：US20100224983A1
公开(公告)日：2010-09-09
申请号：US12625848
申请日：2009-11-25
申请人： Min-Lung Huang , Chih-Yuan Cheng
发明人： Min-Lung Huang , Chih-Yuan Cheng
IPC分类号： H01L23/36 , H01L23/48 , H01L21/78
CPC分类号： H01L24/96 , H01L21/568 , H01L21/6835 , H01L23/3128 , H01L23/4334 , H01L24/97 , H01L2221/68331 , H01L2224/12105 , H01L2224/97 , H01L2924/01033 , H01L2924/15311 , H01L2924/181 , H01L2924/00
摘要： A manufacturing method of a semiconductor package structure includes the following steps. Firstly, a carrier having an adhesion tape is provided. Next, a plurality of chips are disposed on the adhesion tape. Then, a molding compound is dispensed on the adhesion tape, so that the molding compound covers the chips. Afterwards, a heat spreader is disposed on a plurality of chips. Then, the molding compound is solidified as an encapsulant to fix the heat spreader on the chips. After that, the carrier and the adhesion tape are removed to expose the active surfaces of the chips. Then, a redistribution layer is formed adjacent to the active surfaces of the chips. Next, a plurality of solder balls are disposed on the redistribution layer. Lastly, a plurality of packages are formed by cutting the redistribution layer, the encapsulant and the heat spreader according to the positions of the chip.
摘要翻译：半导体封装结构的制造方法包括以下步骤。首先，提供具有粘合带的载体。接下来，在粘合带上设置多个芯片。然后，在粘合带上分配模塑料，使得模塑料覆盖芯片。之后，将散热器设置在多个芯片上。然后，将模塑料作为密封剂固化，将散热器固定在芯片上。之后，移除载体和粘合带以暴露芯片的活性表面。然后，在芯片的有源表面附近形成再分布层。接下来，在再分配层上设置多个焊球。最后，通过根据芯片的位置切割再分配层，密封剂和散热器来形成多个封装。

16. 发明申请

US20100067295A1 Refresh Method for a Non-volatile Memory 有权
标题翻译：非易失性存储器的刷新方法
公开(公告)号：US20100067295A1
公开(公告)日：2010-03-18
申请号：US12329626
申请日：2008-12-07
申请人： Ching-Fang Yen , Che-Heng Lai , Chih-Yuan Cheng
发明人： Ching-Fang Yen , Che-Heng Lai , Chih-Yuan Cheng
IPC分类号： G11C16/00 , G11C16/06 , G11C7/00
CPC分类号： G11C16/10 , G11C16/3431
摘要： A refresh method for a non-volatile memory for preventing disturb phenomenon includes reading data of a memory unit of the non-volatile memory at a first time point within a predefined period and storing the data in a buffer, determining whether data of the memory unit and data of the buffer are identical at a second time point within the predefined period, so as to generate a determination result, and refreshing the memory unit according to the determination result.
摘要翻译：用于防止干扰现象的非易失性存储器的刷新方法包括在预定时间段内的第一时间点读取非易失性存储器的存储器单元的数据，并将数据存储在缓冲器中，确定存储器单元的数据并且缓冲器的数据在预定时间段内的第二时间点相同，以便产生确定结果，并根据确定结果刷新存储器单元。

17. 发明申请

US20050040895A1 [LOW POWER CONSUMPTION CIRCUIT AND DELAY CIRCUIT THEREOF] 审中-公开
标题翻译： [低功耗电路及其延迟电路]
公开(公告)号：US20050040895A1
公开(公告)日：2005-02-24
申请号：US10710764
申请日：2004-08-02
申请人： Hong-Gee Fang , Wen-Chieh Lee , Chih-Yuan Cheng
发明人： Hong-Gee Fang , Wen-Chieh Lee , Chih-Yuan Cheng
IPC分类号： H03B5/24 , H03K3/012 , H03K3/03 , H03L7/00
CPC分类号： H03K3/0315 , H03K3/012
摘要： A low power consumption oscillation circuit and a delay circuit thereof are disclosed. The circuit comprises an enable circuit, an oscillator delay circuit and a feedback control network. The enable circuit is adapted for receiving an enable signal and performing an initial oscillation. The enable circuit outputs an initial oscillation signal according to a feedback control signal. The oscillator delay circuit is coupled to the enable circuit and is adapted for alternately generating a high and a low level oscillation signals according to the initial oscillation signal. The feedback control network is coupled to the oscillator delay circuit and is adapted for integrating the high and the low level oscillation signals to generate a feedback control signal and outputting the feedback control signal to the enable the circuit for activating next oscillation.
摘要翻译：公开了一种低功耗振荡电路及其延迟电路。该电路包括使能电路，振荡器延迟电路和反馈控制网络。使能电路适于接收使能信号并执行初始振荡。使能电路根据反馈控制信号输出初始振荡信号。振荡器延迟电路耦合到使能电路，适用于根据初始振荡信号交替产生高电平和低电平的振荡信号。反馈控制网络耦合到振荡器延迟电路，适用于对高电平和低电平振荡信号进行积分以产生反馈控制信号，并将反馈控制信号输出到启动下一个振荡电路。

18. 发明申请

US20150298777A1 RESCUE SYSTEM FOR SEMI-SEALED MARINE VESSELS 审中-公开
标题翻译：半密封船用救生系统
公开(公告)号：US20150298777A1
公开(公告)日：2015-10-22
申请号：US14253882
申请日：2014-04-16
申请人： Chih-Yuan Cheng
发明人： Chih-Yuan Cheng
IPC分类号： B63B43/12
CPC分类号： B63B43/12 , B63B2043/126
摘要： Disclosed is a rescue system for semi-sealed marine vessels, which includes a rescue unit and a backup rescue machine The rescue unit is installed in a vessel compartment and includes an air bag, a canister containing compressed gas, a needle valve, and a flow control valve for employing the physical property that air has a specific gravity smaller than water, whereby when water leaks into the vessel compartment, through pressing down the needle valve, the compressed air is supplied into the air bag for inflating and expanding the air bag to get floating on the seawater inside the vessel compartment and occupy the internal space of the vessel compartment. The backup rescue machine includes an air compressor and at least a diversion valve to supplement a great amount of high-pressure gas to the vessel compartment for preventing water leaking into the vessel compartment.
摘要翻译：本发明公开了一种半密封船舶救援系统，包括救援单元和备用救援机组救援单元安装在船只舱内，包括气囊，包含压缩气体的罐，针阀和流量用于采用空气比重小于水的物理性质的控制阀，由此当水泄漏到容器隔室中时，通过按压针阀，将压缩空气供应到气囊中，以使气囊膨胀和膨胀漂浮在船只舱内的海水上，并占据船只舱的内部空间。备用救援机器包括一个空气压缩机和至少一个分流阀，以补充大量的高压气体到容器隔室，以防止水泄漏到容器隔室中。

19. 发明申请

US20090294947A1 CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：芯片包装结构及其制造方法
公开(公告)号：US20090294947A1
公开(公告)日：2009-12-03
申请号：US12464873
申请日：2009-05-13
申请人： Ra-Min Tain , Yu-Lin Chao , Shu-Jung Yang , Rong-Chang Fang , Wei Li , Chih-Yuan Cheng , Ming-Che Hsieh
发明人： Ra-Min Tain , Yu-Lin Chao , Shu-Jung Yang , Rong-Chang Fang , Wei Li , Chih-Yuan Cheng , Ming-Che Hsieh
IPC分类号： H01L23/34 , H01L21/50 , H01L25/11
CPC分类号： H01L25/105 , H01L23/3128 , H01L25/0657 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2225/0652 , H01L2225/06541 , H01L2225/06589 , H01L2225/1023 , H01L2225/1058 , H01L2225/1094 , H01L2924/10253 , H01L2924/15311 , H01L2924/00014 , H01L2924/00
摘要： A chip package structure includes a substrate, a chip, a thermal conductive layer, a plurality of signal contacts, and a molding compound. The substrate includes a plurality of first thermal conductive vias, a connecting circuit, and a plurality of signal vias electrically connected to the connecting circuit, and the substrate has a chip disposing region. The chip is disposed on the chip disposing region of the substrate and electrically connected to the signal vias through the connecting circuit. The thermal conductive layer is disposed over the substrate, connected to the first thermal conductive vias, and located above the chip disposing region. Besides, the thermal conductive layer has first openings exposing the signal vias. The signal contacts are respectively disposed in the first openings and connected to the signal vias. The molding compound encapsulates the chip.
摘要翻译：芯片封装结构包括衬底，芯片，导热层，多个信号触点和模塑料。衬底包括多个第一导热通孔，连接电路和电连接到连接电路的多个信号通孔，并且衬底具有芯片布置区域。芯片设置在基板的芯片布置区域上，并通过连接电路与信号通孔电连接。导热层设置在衬底上，连接到第一导热通孔，并且位于芯片布置区域的上方。此外，导热层具有暴露信号通孔的第一开口。信号触点分别设置在第一开口中并连接到信号通路。模塑料封装芯片。

20. 外观设计

USD510325S1 Thermal module 失效
公开(公告)号：USD510325S1
公开(公告)日：2005-10-04
申请号：US29196460
申请日：2003-12-31
申请人： Chi-Chang Lin , Chih-Yuan Cheng , Heng-Tsung Wang
设计人： Chi-Chang Lin , Chih-Yuan Cheng , Heng-Tsung Wang

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