专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明申请

US20090194860A1 Chip Housing Having Reduced Induced Vibration 有权
标题翻译：降低感应振动的芯片外壳
公开(公告)号：US20090194860A1
公开(公告)日：2009-08-06
申请号：US12226999
申请日：2007-03-21
申请人： Martin Holzmann , Frieder Haag , Michael Knauss , Florian Grabmaier
发明人： Martin Holzmann , Frieder Haag , Michael Knauss , Florian Grabmaier
IPC分类号： H01L23/12
CPC分类号： B81B7/0058 , B81B2201/0235 , B81B2201/0242 , B81B2203/053
摘要： A premold housing for accommodating a chip structure includes a first part of the housing which is connected to the chip structure as well as connected in an elastically deflectable manner to an additional part of the housing which is fastened to the support structure bearing the entire housing. A mechanism is provided for damping the deflection of the first part of the housing which is connected to the chip structure.
摘要翻译：用于容纳芯片结构的预制外壳包括壳体的第一部分，其连接到芯片结构，并且以可弹性偏转的方式连接到紧固到支撑整个壳体的支撑结构的外壳的附加部分。提供了一种用于阻尼壳体的连接到芯片结构的第一部分的偏转的机构。

12. 发明申请

US20070040230A1 Micromechanical component 有权
标题翻译：微机械部件
公开(公告)号：US20070040230A1
公开(公告)日：2007-02-22
申请号：US11493702
申请日：2006-07-24
申请人： Frank Reichenbach , Frieder Haag , Arnd Kaelberer
发明人： Frank Reichenbach , Frieder Haag , Arnd Kaelberer
IPC分类号： H01L29/82
CPC分类号： B81C1/00333 , H01L21/565 , H01L23/16 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2924/00014 , H01L2924/00
摘要： A micromechanical component has a structure such that a material flow is guided from at least one preferred direction for the purpose of uniformly enveloping the micromechanical component.
摘要翻译：微机械部件具有使得材料流从至少一个优选方向引导以便均匀地包封微机械部件的结构。

13. 发明授权

US08198130B2 Chip module and method for producing a chip module having plains of extensions for chip and substrate 有权
标题翻译：芯片模块和用于制造芯片模块的方法，该芯片模块具有用于芯片和衬底的延伸平面
公开(公告)号：US08198130B2
公开(公告)日：2012-06-12
申请号：US12721785
申请日：2010-03-11
申请人： Stefan Finkbeiner , Frieder Haag , Hans-Peter Baer
发明人： Stefan Finkbeiner , Frieder Haag , Hans-Peter Baer
IPC分类号： H01L21/00
CPC分类号： H01L21/568 , B81B7/0074 , B81C2203/0154 , G01R33/0206 , H01L21/561 , H01L23/3107 , H01L24/96 , H01L25/0655 , H01L25/16 , H01L2224/04105 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/181 , H01L2924/00
摘要： A chip module having a substrate and at least one chip connected to the substrate is provided, the substrate featuring a first main plane of extension and the chip featuring a second main plane of extension, and an acute angle being provided between the first main plane of extension and the second main plane of extension, and the substrate also comprising a mold housing.
摘要翻译：提供了一种具有基板和至少一个连接到该基板的芯片的芯片模块，该基板具有第一主平面延伸部分，该芯片具有第二主平面延伸部分，并且锐角设置在第一主平面延伸部分和第二主延伸平面，并且基板还包括模具壳体。

14. 发明申请

US20090027861A1 Enclosure including an electrical module 有权
标题翻译：外壳包括电气模块
公开(公告)号：US20090027861A1
公开(公告)日：2009-01-29
申请号：US12217301
申请日：2008-07-02
申请人： Christian Ohl , Frieder Haag , Juergen Kurle , Ingbert Gerngross
发明人： Christian Ohl , Frieder Haag , Juergen Kurle , Ingbert Gerngross
IPC分类号： H05K7/00
CPC分类号： H05K5/0078 , H01L2924/181 , H01L2924/00012
摘要： A module includes an electrical component having an inner enclosure which surrounds the electrical component and which has first electrical contact means at least on one outer side; having an outer enclosure in the interior of which the inner enclosure is situated, the outer enclosure having second electrical contact means, the second electrical contact means extending from the interior to at least one outer side of the outer enclosure. The first and second contact means are interconnected.
摘要翻译：模块包括电气部件，其具有围绕电气部件的内部外壳，并且具有至少一个外侧上的第一电接触装置; 在其内部具有外壳的外壳中，外壳具有第二电接触装置，第二电接触装置从内部延伸到外壳的至少一个外侧。第一和第二接触装置相互连接。

15. 发明申请

US20070272993A1 Optical Sensor Assemblage and Corresponding Manufacturing Method 有权
标题翻译：光学传感器组合及相应的制造方法
公开(公告)号：US20070272993A1
公开(公告)日：2007-11-29
申请号：US10561635
申请日：2004-05-15
申请人： Frieder Haag , Ronny Ludwig
发明人： Frieder Haag , Ronny Ludwig
IPC分类号： H01L31/0203
CPC分类号： G01J5/12 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/10253 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention creates an optical sensor assemblage, in particular a thermopile sensor assemblage, comprising a sensor chip assemblage (10; 10′) having an optically transparent irradiation region (OB; OB′), a mounting region (RB; RB′) surrounding the latter, and a wire-bond region (BB); an optically isolating mounting frame (MLF; MLF′) having a chip receiving region (DP; DP′) and a plurality of connector elements (AB-AB′″); and an optically isolating packaging device (MV-MV′″); the sensor chip assemblage (10; 10′) being joined in the mounting region (RB; RB′) to the chip receiving region (LB; LB′), and in the wire-bond region (BB) to one or more of the connector elements (AB-AB′″); the chip receiving region (DP, DP′) having a window (F; F′) disposed in such a way that at least a portion of the optical irradiation region (OB; OB′) is not covered by the chip receiving region (DP; DP′); and the packaging device (MV-MV′″) surrounding the sensor chip assemblage (10; 10′) and the mounting frame (MLF; MLF′) in such a way that optical radiation can enter the sensor chip assemblage (10; 10′) substantially only through the window (F; F′).
摘要翻译：本发明创建了一种光学传感器组件，特别是热电堆传感器组件，其包括具有光学透明的辐射区域（OB; OB'）的传感器芯片组件（10; 10'），围绕后者和引线键合区域（BB）; 具有芯片接收区域（DP; DP'）和多个连接器元件（AB-AB“）的光学隔离安装框架（MLF; MLF'）; 和光隔离包装装置（MV-MV“'）; 所述传感器芯片组合件（10; 10'）在所述安装区域（RB; RB'）中连接到所述芯片接收区域（LB; LB'），并且所述导线接合区域（BB）中的一个或多个连接器元件（AB-AB“'）; 具有窗口（F; F'）的芯片接收区域（DP，DP'）以使得光学照射区域（OB; OB'）的至少一部分未被芯片接收区域（DP）覆盖的方式 ; DP'）; 以及围绕传感器芯片组件（10; 10'）和安装框架（MLF; MLF'）的包装装置（MV-MV“），使得光学辐射可以进入传感器芯片组件（10; 10' '）基本上仅通过窗口（F; F'）。

16. 发明申请

US20070232095A1 QFN housing having optimized connecting surface geometry 有权
标题翻译： QFN外壳具有优化的连接表面几何形状
公开(公告)号：US20070232095A1
公开(公告)日：2007-10-04
申请号：US11731054
申请日：2007-03-30
申请人： Anton Doering , Stefan Mueller , Frieder Haag , Christoph Gahn
发明人： Anton Doering , Stefan Mueller , Frieder Haag , Christoph Gahn
IPC分类号： H05K1/00
CPC分类号： H05K3/3442 , H01L23/3107 , H01L23/49541 , H01L24/48 , H01L2224/05073 , H01L2224/05647 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/19043 , H01L2924/351 , H05K2201/09427 , H05K2201/10727 , Y02P70/613 , H01L2224/45099 , H01L2924/00
摘要： A semiconductor system or sensor system in a housing which is butt-joined to a printed circuit board by soldering, at least some of the connecting surfaces not being soldered over their entire area, the connecting surfaces which are not soldered over their entire area being fixedly soldered in a first surface region to a section of a printed conductor, and in a second surface region the connecting surfaces not being fixedly connected to the printed circuit board, the securely soldered surface regions being situated closer to the semiconductor or sensor structure to be contacted than are the surface regions which are not fixedly connected to the printed circuit board.
摘要翻译：壳体中的半导体系统或传感器系统，其通过焊接对接于印刷电路板，至少一些连接表面未被焊接在其整个区域上，未被焊接在其整个区域上的连接表面被固定在第一表面区域焊接到印刷导体的一部分，并且在第二表面区域中，连接表面未固定地连接到印刷电路板，安全焊接的表面区域位于更接近待接触的半导体或传感器结构没有固定地连接到印刷电路板的表面区域。

17. 发明授权

US06955975B2 Method for joining a silicon plate to a second plate 失效
标题翻译：将硅板接合到第二板的方法
公开(公告)号：US06955975B2
公开(公告)日：2005-10-18
申请号：US10433525
申请日：2002-09-05
申请人： Frank Reichenbach , Frank Fischer , Ralf Hausner , Frieder Haag , Eckhard Graf , Markus Lutz
发明人： Frank Reichenbach , Frank Fischer , Ralf Hausner , Frieder Haag , Eckhard Graf , Markus Lutz
IPC分类号： B29C65/16 , B29C65/60 , B81C1/00 , H01L21/20 , H01L21/58 , H01L21/60 , H01L21/762 , H01L21/30 , H01L21/46
CPC分类号： B29C65/1635 , B29C65/1612 , B29C65/1683 , B29C65/608 , B29C66/1122 , B29C66/12421 , B29C66/472 , B29C66/53461 , B29C66/71 , B29C66/712 , B29C66/7392 , B29K2083/00 , B29L2031/756 , B81C1/00269 , B81C1/00357 , B81C2201/019 , B81C2203/019 , H01L21/2007 , H01L21/76251 , H01L24/83 , H01L2224/80224 , H01L2224/80365 , H01L2224/80379 , H01L2224/804 , H01L2224/80488 , H01L2224/83224 , H01L2224/834 , H01L2224/83424 , H01L2224/83447 , H01L2224/83466 , H01L2224/83471 , H01L2224/83487 , H01L2224/8349 , H01L2224/83801 , H01L2924/01029 , H01L2924/09701 , H01L2924/12042 , H01L2924/01014 , H01L2924/00014 , H01L2924/00
摘要： A method for joining a silicon plate to a second plate, a laser beam being directed through the silicon plate at the second plate. In the process, the wavelength of the laser beam is selected in such a way that only a negligibly small amount of energy is absorbed in the silicon plate. A strongly absorbent material is hotmelted by the laser beam's energy and then produces a bond between the silicon plate and the second plate.
摘要翻译：一种用于将硅板接合到第二板的方法，激光束被引导通过硅板在第二板。在该过程中，激光束的波长以这样一种方式选择，即在硅板中仅吸收可忽略的少量能量。强吸收性材料被激光束的能量热熔化，然后在硅板和第二板之间产生粘结。

18. 发明授权

US06872911B2 Welding method 有权
标题翻译：焊接方法
公开(公告)号：US06872911B2
公开(公告)日：2005-03-29
申请号：US10482568
申请日：2002-06-12
申请人： Kurt Weiblen , Christian Ohl , Oliver Kohn , Frieder Haag , Michael Honer
发明人： Kurt Weiblen , Christian Ohl , Oliver Kohn , Frieder Haag , Michael Honer
IPC分类号： B23K26/244 , B29C35/08 , B29C65/00 , B29C65/16 , B23K26/20 , B32B31/00
CPC分类号： B29C66/3282 , B23K26/244 , B29C65/1612 , B29C65/1635 , B29C66/112 , B29C66/114 , B29C66/116 , B29C66/12445 , B29C66/1282 , B29C66/12821 , B29C66/1284 , B29C66/1286 , B29C66/322 , B29C66/53461 , B29C66/542 , B29C66/73921 , B29C66/8322 , B29C2035/0822 , B29K2995/0027
摘要： A method is proposed for welding a first component part to a second component part, the energy to melt melting regions being supplied by a laser beam. In this context, the laser beam is directed through the first component part, which is made of a nonabsorbing material, to the second component part. The second component part is made of a material which strongly absorbs laser beam. At least one stop is provided outside melting regions.
摘要翻译：提出了一种将第一组分部分焊接到第二组分部分的方法，熔融熔化区域的能量由激光束提供。在这种情况下，激光束被引导通过由非吸收材料制成的第一组分部分到第二组分部分。第二部件由强烈吸收激光束的材料制成。熔融区域外至少设有一个停止点。

19. 发明授权

US08835222B2 Method for producing a two-chip assembly and corresponding two-chip assembly 有权
标题翻译：双芯片组装方法和相应的双芯片组装方法
公开(公告)号：US08835222B2
公开(公告)日：2014-09-16
申请号：US13623244
申请日：2012-09-20
申请人： Mathias Bruendel , Frieder Haag , Jens Frey , Rolf Speicher , Juergen Fritz , Lutz Rauscher
发明人： Mathias Bruendel , Frieder Haag , Jens Frey , Rolf Speicher , Juergen Fritz , Lutz Rauscher
IPC分类号： H01L21/00 , B81C1/00 , H01L21/56 , H01L21/50 , H01L23/48 , H01L23/00 , H01L23/544 , H01L21/768
CPC分类号： H01L23/48 , B81B2207/012 , B81B2207/096 , B81C1/00238 , B81C2203/0154 , B81C2203/0792 , H01L21/50 , H01L21/561 , H01L21/76898 , H01L23/544 , H01L24/11 , H01L24/13 , H01L24/17 , H01L24/81 , H01L24/92 , H01L24/94 , H01L24/97 , H01L2223/54426 , H01L2223/54466 , H01L2224/0401 , H01L2224/09181 , H01L2224/13025 , H01L2224/131 , H01L2224/13101 , H01L2224/16145 , H01L2224/16146 , H01L2224/16235 , H01L2224/17181 , H01L2224/9202 , H01L2224/94 , H01L2224/97 , H01L2924/01012 , H01L2924/1433 , H01L2924/1461 , H01L2924/181 , H01L2224/81 , H01L2924/014 , H01L2924/00014 , H01L2224/11 , H01L2924/00
摘要： A method for producing a two-chip assembly includes: providing a wafer having a first thickness, which wafer has a front side and a back side, a first plurality of first chips being provided on the front side of the wafer; attaching a second plurality of second chips on the front side of the wafer, so that every first chip is joined in each instance to a second chip and forms a corresponding two-chip pair; forming a cohesive mold package on the front side of the wafer, so that the second chips are packaged; thinning the wafer from the back side to a second thickness which is less than the first thickness; forming vias from the back side to the second chips; and separating the two-chip pairs into corresponding two-chip assemblies.
摘要翻译：一种用于制造双芯片组件的方法包括：提供具有第一厚度的晶片，该晶片具有前侧和后侧，在晶片的前侧设置有第一多个第一芯片; 在晶片的前侧附加第二多个第二芯片，使得每个第一芯片在每种情况下都连接到第二芯片并形成相应的双芯片对; 在所述晶片的前侧形成粘结的模具包，使得所述第二芯片被包装; 将晶片从背面变薄至小于第一厚度的第二厚度; 从后侧到第二芯片形成通孔; 并将两芯片对分离成相应的双芯片组件。

20. 发明申请

US20120061860A1 Method for Constructing an Electrical Circuit, and Electrical Circuit 有权
标题翻译：构建电路的方法和电路
公开(公告)号：US20120061860A1
公开(公告)日：2012-03-15
申请号：US13232088
申请日：2011-09-14
申请人： Tjalf Pirk , Juergen Butz , Axel Franke , Frieder Haag , Heribert Weber , Arnim Hoechst , Sonja Knies
发明人： Tjalf Pirk , Juergen Butz , Axel Franke , Frieder Haag , Heribert Weber , Arnim Hoechst , Sonja Knies
IPC分类号： H01L21/56 , H01L23/28
CPC分类号： H01L23/3121 , H01L21/561 , H01L21/568 , H01L23/5389 , H01L23/58 , H01L24/24 , H01L24/96 , H01L25/0655 , H01L2224/04105 , H01L2224/24137 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/19107 , H01L2924/3511 , H01M6/40 , H01M10/0436 , H01M10/0525 , Y02E60/122 , Y02P70/54 , H01L2924/00
摘要： A method for constructing an electrical circuit that includes at least one semiconductor chip encapsulated with a potting compound is disclosed. The method includes applying a galvanic layer arrangement for forming an electrochemical element on an element of the electrical circuit including the at least one semiconductor chip.
摘要翻译：公开了一种构造电路的方法，该电路包括至少一个用封装化合物封装的半导体芯片。该方法包括在包括至少一个半导体芯片的电路的元件上施加用于形成电化学元件的电偶层布置。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式