会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 11. 发明授权
    • Molding material, process for producing molded article, and molded article
    • 成型材料,成型品的制造方法以及成型品
    • US06635712B1
    • 2003-10-21
    • US09856180
    • 2001-06-05
    • Takuma AoyamaAkihiko Okada
    • Takuma AoyamaAkihiko Okada
    • C08L2300
    • C08L25/06C08L2205/02C08L2666/04C08L2666/06
    • There are disclosed a molding material which is used for molding a styrenic polymer and which is capable of affording moldings that are excellent in solvent resistance and mechanical strength even when produced at a molding temperature almost same as that of ordinary atactic polystyrene, namely at a resin temperature of 260° C. or lower, dispensing with a melt kneading step; a process for producing a molding by molding the above molding material, which process enables to shorten molding cycle time and curtail the producton cost; and the moldings produced thereby. The molding material comprises a dry blend of 10 to 95% by weight of a (A) styrenic polymer having atactic configuration and 2 to 90% by weight of a (B) styrenic polymer having a melting point of 250° C. or lower, a weight average molecular weight of at most 200,000 and mainly syndiotactic configuration.
    • 公开了一种用于模制苯乙烯聚合物的成型材料,并且即使在与通常的无规立构聚苯乙烯的成型温度几乎相同时,即在树脂上也能够提供耐溶剂性和机械强度优异的模制品 温度260℃以下,分配熔融捏合工序; 通过模制上述成型材料来制造模制品的方法,该方法能够缩短模制周期时间并减少产品成本; 和由此制成的模制品。 成型材料包含10至95重量%的具有无规形状的(A)苯乙烯聚合物和2至90重量%的熔点为250℃或更低的(B)苯乙烯聚合物的干混物, 重均分子量最多为200,000,主要是间同立构。
    • 12. 发明授权
    • Styrene resin composition and method of manufacturing the same, and method of manufacturing styrene resin molded products
    • 苯乙烯树脂组合物及其制造方法以及苯乙烯树脂成型体的制造方法
    • US06469098B1
    • 2002-10-22
    • US09661314
    • 2000-09-13
    • Akihiko OkadaTakuma Aoyama
    • Akihiko OkadaTakuma Aoyama
    • C08L7112
    • C08L25/06C08L53/02C08L71/12C08L2205/02C08L2666/04C08L2666/02
    • Disclosed is a resin composition containing the following components (A), and (B) or optionally, (C), (D), and (E): (A) an atactic polystyrene or a mixture of an atactic polystyrene and a rubber-like elastic substance: 30 to 95 parts by weight; (B) a syndiotactic polystyrene having a melting point of not higher than 255° C.: 70 to 5 parts by weight; (C) a polyphenylene ether having an intrinsic viscosity of 0.5 deciliter/g or less as measured in chloroform at 25° C.; (D) an inorganic filler; and (E) a polymer having compatibility or affinity with components (A) and (B) and having a polar group. The styrene resin composition exhibits improved solvent resistance and remarkable impact resistance. The composition of the invention is produced by kneading the components within a resin temperature range between the melting point of component (B) and 270° C. Resin molded products are manufactured through use of the styrene resin composition by adjusting the resin temperature during molding to fall within the range from the melting point of component (B) to 270° C.
    • 公开了含有下列组分(A)和(B)或任选的(C),(D)和(E):(A)的无规立构聚苯乙烯或无规聚苯乙烯与橡胶 - 弹性体:30〜95重量份;(B)熔点不高于255℃的间同立构聚苯乙烯:70〜5重量份;(C)特性粘度为0.5分升的聚苯醚 / g以下,在25℃的氯仿中测定;(D)无机填料; 和(E)与组分(A)和(B)具有相容性或亲和性且具有极性基团的聚合物。 苯乙烯树脂组合物表现出改进的耐溶剂性和显着的耐冲击性。 本发明的组合物通过在树脂温度范围内在组分(B)的熔点和270℃之间的树脂温度范围内捏合来制备。树脂模制产品通过使用苯乙烯树脂组合物通过调节模塑过程中的树脂温度而制备成 落在组分(B)的熔点到270℃的范围内。
    • 13. 发明授权
    • Styrene-based resin composition
    • 苯乙烯类树脂组合物
    • US06469081B1
    • 2002-10-22
    • US09537414
    • 2000-03-29
    • Shinji ChinoAkihiko OkadaNobuyuki Satoh
    • Shinji ChinoAkihiko OkadaNobuyuki Satoh
    • C08L5302
    • C08L23/02C08K7/14C08L23/00C08L23/0815C08L23/10C08L23/16C08L25/06C08L35/06C08L51/00C08L51/003C08L51/04C08L51/06C08L53/00C08L53/02C08L53/025C08L55/00C08L71/12C08L91/00C08L2205/02C08L2205/03C08L2205/035H05K1/032Y10S525/905C08L2666/24C08L2666/04C08L2666/02C08L2666/14
    • Disclosed is a syndiotactic, polystyrenic resin composition comprising (A) 100 parts by weight of a component composed of (a) from 10 to 98% by weight of a styrene-based polymer having a syndiotactic configuration and (b) from 2 to 90% by weight of a polyolefin, (B) from 0.5 to 50 parts by weight of a styrene-olefin copolymer having a styrene content of from 40 to 85% by weight, and optionally (C) from 0.5 to 10.0 parts by weight, relative to 100 parts by weight of the component (a) of (A), of a polyphenylene ether (having an intrinsic viscosity in chloroform at 25° C. of 0.4 dl/g or higher) and/or (D) from 0 to 200 parts by weight, relative to 100 parts by weight of the component (b) of (A), of a styrene-olefin copolymer having a styrene content of from 5 to 35% by weight and/or (E) from 0 to 200 parts by weight, relative to 100 parts by weight of the component (b) of (A), of at least one selected from paraffinic oils, paraffinic waxes, mineral oils and siloxanic oils. The composition may optionally contain (F), from 0.5 to 350 parts by weight, relative to 100 parts by weight of the resin components, of an inorganic filler and (G) from 0.1 to 10 parts by weight, relative to the same, of a polymer which is miscible with or has an affinity for the component (a) of (A) and which has a polar group. The composition can be formed into articles having good heat resistance, a high modulus of elasticity and good toughness. In addition, the articles are advantageous in that their surface layers are hardly peeled.
    • 公开了间同立构的聚苯乙烯树脂组合物,其包含(A)100重量份由(a)10至98重量%的具有间同立构构型的苯乙烯基聚合物和(b)2-90重量% 的(B)0.5〜50重量份苯乙烯含量为40〜85重量%的苯乙烯 - 烯烃共聚物,(C)为0.5〜10.0重量份,相对于 100重量份的(A)成分(a)的聚苯醚(在25℃的氯仿中的特性粘度为0.4dl / g以上)和/或(D)为0〜200份 ,相对于(A)成分(b)100重量份,苯乙烯含量为5〜35重量%的苯乙烯 - 烯烃共聚物和/或(E)0〜200重量份的苯乙烯 - 相对于100重量份的(A)成分(b),选自石蜡油,石蜡,矿物油和硅氧烷油中的至少一种。 相对于100重量份的树脂组分,无机填充剂和(G)相对于相同的组分,可以任选地含有(F)0.5〜350重量份,(G)为0.1〜10重量份 与(A)的组分(a)混溶或具有亲和性且具有极性基团的聚合物。 该组合物可以形成具有良好耐热性,高弹性模量和良好韧性的制品。 另外,制品的表面层很难剥离是有利的。
    • 20. 发明授权
    • Switching mechanism and disk array apparatus having the switching mechanism
    • 具有切换机构的切换机构和盘阵列装置
    • US06381675B1
    • 2002-04-30
    • US09256290
    • 1999-02-24
    • Akihiko Okada
    • Akihiko Okada
    • G06F1200
    • G06F11/2089
    • The present invention enables to obtain a data transfer at a high rate, at a reasonable cost, and with a high reliability. The disk array system according to the present invention includes: a plurality of arrayed disk apparatuses 8a to 8f for writing/reading a data; a plurality of array controllers 2a, 2b for controlling writing/reading a data to/from the disk apparatuses 8a to 8f according to an instruction from a host computer; and a switching mechanism 1 connected to each of the disk apparatuses 8a to 8f, for establishing an exclusive connection between the array controllers 2a, 2b and the disk apparatuses 8a to 8f. When one of the array controller 2a, 2b has acquired from the other array controllers 2a, 2b a control authority over all or one of the disk apparatuses 8a to 8f according to an instruction from a host computer, the array controller having the control authority controls the switching mechanism 1 to establish a connection between the array controller and the disk apparatuses. Means for this connection is also provided in the system.
    • 本发明能够以合理的成本,高可靠性获得高速率的数据传输。根据本发明的磁盘阵列系统包括:多个阵列盘装置8a至8f,用于写入/读取 数据; 多个阵列控制器2a,2b,用于根据来自主计算机的指令控制向/从盘装置8a至8f的读/写数据; 以及连接到每个盘装置8a至8f的切换机构1,用于在阵列控制器2a,2b和盘装置8a至8f之间建立专用连接。 当阵列控制器2a,2b中的一个阵列控制器2a,2b根据来自主计算机的指令,从其他阵列控制器2a,2b获得了一个控制权限到所有或一个盘装置8a至8f,该阵列控制器具有控制权控制 切换机构1,用于建立阵列控制器与盘装置之间的连接。 用于该连接的装置也在系统中提供。