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11. 发明专利

JP2009117718A Adhesive sheet for dicing 审中-公开
标题翻译：胶粘片
公开(公告)号：JP2009117718A
公开(公告)日：2009-05-28
申请号：JP2007291254
申请日：2007-11-08
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： TERADA YOSHIO , HASHIMOTO HIROKUNI , ASAI FUMITERU
IPC分类号： H01L21/301 , C09J7/02 , C09J9/02
摘要： PROBLEM TO BE SOLVED: To provide an adhesive sheet for dicing which allows an electric conduction inspection even in the condition that a semiconductor wafer or a semiconductor chip formed by dicing a semiconductor wafer is laminated, and can prevent deformation (warpage) and damage of the semiconductor wafer, and occurrence of flaws and scratches on the rear surface, and a manufacturing method of a semiconductor device using the same.
SOLUTION: In the adhesive sheet for dicing 10 in which an adhesive agent layer 3 is provided on a substrate film 1, conductive particles 5 are contained in the adhesive agent layer 3 and the substrate film 1 is composed of a conductive fiber, whereby an electric conduction path is formed between the adhesive agent layer 3 and the substrate film 1.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种切割用粘合片，即使在通过层叠形成半导体晶片的半导体晶片或半导体芯片的条件下，也能够进行导电检查，并且能够防止变形（翘曲）和半导体晶片的损坏以及后表面的缺陷和划痕的发生以及使用其的半导体器件的制造方法。解决方案：在基片1上设置粘合剂层3的切割用粘合片10中，在粘合剂层3中含有导电粒子5，基片1由导电性纤维构成，由此在粘合剂层3和基底膜1之间形成导电路径。版权所有（C）2009，JPO＆INPIT

12. 发明专利

JP2009114394A Adhesive sheet for inspection 有权
标题翻译：粘合片用于检查
公开(公告)号：JP2009114394A
公开(公告)日：2009-05-28
申请号：JP2007291252
申请日：2007-11-08
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： TERADA YOSHIO , HASHIMOTO HIROKUNI , ASAI FUMITERU
IPC分类号： C09J7/02 , C09J9/02 , C09J11/04 , C09J201/00 , H01L21/301 , H01R11/01
CPC分类号： G01R1/0735 , B32B7/12 , B32B27/08 , B32B27/18 , B32B27/281 , B32B27/283 , B32B27/30 , B32B27/32 , B32B27/322 , B32B27/36 , B32B27/40 , B32B2255/205 , B32B2262/106 , B32B2264/102 , B32B2264/104 , B32B2264/108 , B32B2307/202 , B32B2307/516 , B32B2307/518 , C09J7/38 , C09J9/02 , C09J2201/36 , C09J2201/602 , C09J2203/326 , G01R31/2853 , H01L21/67132 , H01L21/67253
摘要： PROBLEM TO BE SOLVED: To provide an adhesive sheet for inspection that permits an electric conduction test even in a state where a semiconductor wafer or a semiconductor chip formed by dicing a semiconductor wafer is laminated thereon and can prevent deformation (warpage) or breakage of a semiconductor wafer, or generation of flaws or scratches on the back surface in the inspection, and a method of manufacturing a semiconductor device using the same. SOLUTION: The adhesive sheet for inspection comprises a substrate film and an adhesive layer formed thereon, where the substrate film and the adhesive layer are electroconductive and an electric conduction path is formed between them. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供即使在将半导体晶片切割形成的半导体晶片或半导体芯片层压在其上并且可以防止变形（翘曲）的状态下进行导电测试的检查用粘合片，在检查中，半导体晶片的破损或背面的缺陷或划痕的产生，以及使用该半导体晶片的半导体器件的制造方法。解决方案：用于检查的粘合片包括基底膜和形成在其上的粘合剂层，其中基底膜和粘合剂层是导电的并且在它们之间形成导电路径。版权所有（C）2009，JPO＆INPIT

13. 发明专利

JP2009070890A Method of cleaning substrate treatment apparatus 有权
标题翻译：清洗基质处理装置的方法
公开(公告)号：JP2009070890A
公开(公告)日：2009-04-02
申请号：JP2007235241
申请日：2007-09-11
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： TERADA YOSHIO , NAMIKAWA AKIRA
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a method of cleaning a substrate treatment apparatus by using a cleaning transfer member, wherein the cleaning transfer member has an adhesive force necessary for a pasted object, can remove foreign substances of sub-micron level without causing contamination on a cleaning portion, is excellent in heat resistance, exhibits a sufficient adhesive force and a coagulation force even at a high temperature, can be easily peeled off without causing remaining adhesive when being peeled off from the pasted object after being used, and can be re-used after being used. SOLUTION: In this method of cleaning a substrate treatment apparatus by using a cleaning transfer member, the cleaning transfer member is provided with an aggregation layer of oblique columnar structures each protruding with an elevation angle of COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过使用清洁转印部件清洁基板处理装置的方法，其中清洁转印部件具有粘贴对象所需的粘合力，可以在没有导致清洁部分的污染，耐热性优异，即使在高温下也显示出足够的粘合力和凝固力，在使用后从被粘贴物体剥离而不会残留粘合剂容易地剥离，并且使用后可重新使用。解决方案：在通过使用清洁转印部件清洁基板处理装置的这种方法中，清洁转印部件设置有倾斜柱状结构的聚集层，每个倾斜的柱状结构从与表面形成的角度<90° 转印部件，纵横比≥1，清洗处理结束后使用清洗转印部件。版权所有（C）2009，JPO＆INPIT

14. 发明专利

JP2008258492A Adhesive sheet for manufacturing semiconductor device 有权
标题翻译：用于制造半导体器件的粘合片
公开(公告)号：JP2008258492A
公开(公告)日：2008-10-23
申请号：JP2007100636
申请日：2007-04-06
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： TERADA YOSHIO , KONDO HIROYUKI , OKEYUI TAKUJI
IPC分类号： H01L21/56 , H01L23/50
CPC分类号： H01L24/97 , H01L24/73 , H01L2224/32245 , H01L2224/45 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/85207 , H01L2224/92247 , H01L2224/97 , H01L2924/10253 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/18165 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide an adhesive sheet for manufacturing a semiconductor device, by which a sufficient tensile storage elastic modulus can be maintained even under an elevated temperature and a light peeling is possible and a problem of adhesive transfer is hard to occur. SOLUTION: The adhesive sheet for manufacturing the semiconductor device according to this invention is used for manufacturing the semiconductor device in which at least a semiconductor element and a conductor unit are sealed by sealing resin. The adhesive sheet for manufacturing the semiconductor device is constituted by providing an adhesive layer with a thickness of at least 15 μm or more on a base material, and a tensile ductility of the adhesive layer after curing resides is in a range of 4 to 15% under a condition of a tensile speed 200 mm/minute. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种用于制造半导体器件的粘合片，即使在升高的温度下也能够保持足够的拉伸储存弹性模量，并且可以进行光剥离，并且粘合剂转移的问题难以发生。解决方案：根据本发明的用于制造半导体器件的粘合片用于制造半导体器件，其中至少半导体元件和导体单元通过密封树脂密封。用于制造半导体器件的粘合片通过在基材上提供至少15μm以上的粘合剂层而构成，并且固化后的粘合剂层的拉伸延展性在4〜15％的范围内，在拉伸速度200mm /分钟的条件下。版权所有（C）2009，JPO＆INPIT

15. 发明专利

JP2008047601A Cleaning member, transfer member with cleaning function, and cleaning method for substrate processing device 有权
标题翻译：清洁构件，具有清洁功能的转移构件以及用于衬底处理装置的清洁方法
公开(公告)号：JP2008047601A
公开(公告)日：2008-02-28
申请号：JP2006219434
申请日：2006-08-11
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： TERADA YOSHIO , SUGAO HISAKI , YOSHIDA YOSHITOKU , MAENO YOHEI
IPC分类号： H01L21/304 , B08B1/02 , H01L21/677
CPC分类号： B08B1/00 , B08B7/0028 , B82Y30/00 , B82Y40/00 , C01B32/16 , C01B2202/08 , C01B2202/34 , C01B2202/36
摘要： PROBLEM TO BE SOLVED: To provide a cleaning member that simply, surely, and sufficiently removes minute foreign matter, preferably foreign matter of a submicron level without causing stains at cleaning sites, and to provide a transfer member with a cleaning function that has the cleaning member, and a cleaning method for a substrate processing device that uses the cleaning member or the transfer member with a cleaning function. SOLUTION: The cleaning member 100 has a layered member provided with a plurality of column-structured protrusions on its surface. In this case, each column-structured protrusion 30 is a carbon-based nanostructure. A length of the maximum diameter of the carbon-based nanostructure is ≤100 nm. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种清洁部件，其能够简单且可靠地并且充分地除去微小的异物，优选亚微米级的异物，而不会在清洁部位产生污渍，并提供具有清洁功能的转印部件，具有清洁部件，以及使用具有清洁功能的清洁部件或转印部件的基板处理装置的清洁方法。解决方案：清洁构件100具有在其表面上设置有多个列结构的突起的层状构件。在这种情况下，每个列结构的突起30是碳基纳米结构。碳基纳米结构的最大直径的长度≤100nm。版权所有（C）2008，JPO＆INPIT

16. 发明专利

JP2007311699A Manufacturing method for cleaning sheet and for transfer member with cleaning function, and cleaning method for substrate processing device 审中-公开
标题翻译：用于清洁片和具有清洁功能的传送构件的制造方法和用于衬底处理装置的清洁方法
公开(公告)号：JP2007311699A
公开(公告)日：2007-11-29
申请号：JP2006141493
申请日：2006-05-22
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： NAMIKAWA AKIRA , TERADA YOSHIO , UENDA DAISUKE , SUGAO HISAKI
IPC分类号： H01L21/304 , H01L21/677
摘要： PROBLEM TO BE SOLVED: To provide manufacturing methods for cleaning sheet and transfer member with cleaning function which are superior in foreign matter removing performance and transfer performance, and can suppress contamination caused by a silicon compound in a cleaning layer, and to provide a cleaning method for substrate processing device using such a cleaning sheet and a transfer member with cleaning function as above.
SOLUTION: In the cleaning layer, relative strengths (a positive ion is a C
2 H
3
+ ratio, and a negative ion is an O
- ratio) of a specified fragment ion of the cleaning layer are 0.1 or less respectively in a time-of-flight type secondary ion mass spectrometry. In the manufacturing method for cleaning sheet, plasma treatment is performed for the cleaning layer wherein the relative strength (the positive ion is the C
2 H
3
+ ratio, and the negative ion is the O
- ratio) of at least one fragment ion of the specified fragment ions is 0.1 or less in the time-of-flight type secondary ion mass spectrometry.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供具有优异的异物去除性能和转印性能的具有清洁功能的清洁片材和转印部件的制造方法，并且可以抑制清洁层中由硅化合物引起的污染，并且提供使用这样的清洁片和具有如上所述的清洁功能的转印部件的基板处理装置的清洁方法。解决方案：在清洁层中，相对强度（正离子是C 2 3 + / SP>比，负离子在飞行时间型二次离子质谱法中，清洗层的指定碎片离子分别为0.1以下的O - 比）。在清洁片的制造方法中，对于清洁层进行等离子体处理，其中相对强度（正离子为C 2 SP>比，并且负离子是指定片段离子的至少一个片段离子在时间飞行型二次离子质谱中为0.1以下。版权所有（C）2008，JPO＆INPIT

17. 发明专利

JP2007216092A Conveyance member with cleaning function, and cleaning method of board treatment apparatus 有权
标题翻译：具有清洁功能的输送构件和板处理装置的清洁方法
公开(公告)号：JP2007216092A
公开(公告)日：2007-08-30
申请号：JP2006036444
申请日：2006-02-14
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： AMANO YASUHIRO , NAMIKAWA AKIRA , TERADA YOSHIO
IPC分类号： B08B1/00 , H01L21/304 , H01L21/677
摘要： PROBLEM TO BE SOLVED: To provide a conveyance member with a cleaning function which does not deteriorate caused by ultraviolet rays, is excellent in preservation stability, and also is excellent in foreign matter removing performance and conveyance performance.
SOLUTION: This conveyance member 100 with the cleaning function has a conveyance member 10, and a cleaning layer 20 provided at least one face of the conveyance member. The cleaning member 20 contains polyethylene-based resin having a gel fraction of ≥95%. The cleaning layer 20 preferably contains polyethylene-based resin cross-linked by irradiation of energy ray. The melting point of the cleaning layer 20 is ≥180°C, and Vickars hardness is ≥20.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有不会由紫外线引起的劣化的清洁功能的输送部件，保存稳定性优异，并且异物去除性能和输送性能也优异。解决方案：具有清洁功能的输送构件100具有输送构件10和设置在输送构件的至少一个面上的清洁层20。清洁构件20包含凝胶分数≥95％的聚乙烯类树脂。清洁层20优选含有通过能量射线照射而交联的聚乙烯类树脂。清洗层20的熔点≥180℃，维氏硬度≥20。版权所有（C）2007，JPO＆INPIT

18. 发明专利

JP2007144398A Cleaning sheet, transfer member provided with cleaning function, and method for cleaning substrate processing apparatus 有权
标题翻译：清洁片，具有清洁功能的转移构件以及清洁基板处理装置的方法
公开(公告)号：JP2007144398A
公开(公告)日：2007-06-14
申请号：JP2006272797
申请日：2006-10-04
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： UENDA DAISUKE , ARIMITSU YUKIO , TERADA YOSHIO , AMANO YASUHIRO , MURATA AKIHISA
IPC分类号： B08B1/00 , H01L21/304 , H01L21/677
摘要： PROBLEM TO BE SOLVED: To provide a transfer member with a cleaning function, which has excellent foreign material removing performance and transfer performance and removes foreign materials having a prescribed particle diameter with especially high efficiency.
SOLUTION: The transfer member with the cleaning function is provided with a transfer member and a cleaning layer arranged at least on one surface of the transfer member. The cleaning layer has an uneven shape having an arithmetic average roughness Ra of 0.05 μm or less and a maximum height Rz of 1.0 μm or less. Preferably, a substantial surface area of the cleaning layer per a flat surface of 1 mm
2 is 150% or more of a substantial surface area of a silicon wafer mirror surface per a flat surface of 1 mm
2 .
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：提供具有优异的异物去除性能和转印性能的具有清洁功能的转印部件，并以特别高的效率去除具有规定粒径的异物。解决方案：具有清洁功能的转印部件设置有转印部件和设置在转印部件的至少一个表面上的清洁层。清洗层的算术平均粗糙度Ra为0.05μm以下，最大高度Rz为1.0μm以下的凹凸形状。优选地，每1mm平坦表面的清洁层的基本表面积为1mm×SP的平均表面的硅晶片反射镜表面的基本表面积的150％以上 > 2 。版权所有（C）2007，JPO＆INPIT

19. 发明专利

JP2007103639A Cleaning sheet, transferring member with cleaning function, and cleaning method of substrate processor 审中-公开
标题翻译：清洁片，清洁功能的传送构件和基板处理器的清洁方法
公开(公告)号：JP2007103639A
公开(公告)日：2007-04-19
申请号：JP2005291074
申请日：2005-10-04
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： TERADA YOSHIO , NAMIKAWA AKIRA , UENDA DAISUKE , AMANO YASUHIRO
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a cleaning sheet and a transferring member with cleaning function which can be used under high temperature condition, easily enables determination of the time of replacement, and assures excellent foreign matter removing performance and transferring performance. SOLUTION: The cleaning sheet includes a poly(4-methyl-1-pentene) resin having the structure expressed by the following chemical expression. Moreover, the transferring member with cleaning function comprises a transferring member and a cleaning layer provided to at least single surface of the transferring member. The cleaning layer includes the poly(4-methyl-1-pentene) resin explained above. COPYRIGHT: (C)2007,JPO&INPIT

20. 发明专利

JP2006165044A Transfer member with cleaning function, and cleaning method of substrate treatment equipment 有权
标题翻译：具有清洁功能的转移构件和基板处理设备的清洁方法
公开(公告)号：JP2006165044A
公开(公告)日：2006-06-22
申请号：JP2004349998
申请日：2004-12-02
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： TERADA YOSHIO , NAMIKAWA AKIRA , UENDA DAISUKE
IPC分类号： H01L21/677 , B08B1/00 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a transfer member with a cleaning function which is transferred into substrate treatment equipment for cleaning and removing foreign matters inside the equipment, and which contains a cleaning layer having no photo-deterioration during storage, even though it contains a polyimide having unsaturated bondings.
SOLUTION: In the transfer member with a cleaning function which contains the cleaning layer at least on one plane, the cleaning layer contains a polyimide resin, having unsaturated bonding and a radiation-induced polymerization compound.
COPYRIGHT: (C)2006,JPO&NCIPI

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