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    • 14. 发明授权
    • Brushless DC motor
    • 无刷直流电机
    • US07420306B2
    • 2008-09-02
    • US11229552
    • 2005-09-20
    • Sang Hoon ParkHyung Chul LeeSang Yong AnChun Mo SungYun Seok KimBum Young Byun
    • Sang Hoon ParkHyung Chul LeeSang Yong AnChun Mo SungYun Seok KimBum Young Byun
    • H02K1/22H02K1/27
    • H02K1/276H02K29/03
    • A brushless DC motor prevents disconnection of a magnetic flux and to minimize leakage of the magnetic flux, thereby reducing torque ripple. A plurality of magnetic flux-disconnection preventing holes are arranged in an outer periphery of a rotor core between installing holes into which magnets are fitted. The plurality of magnetic flux-disconnection preventing holes are symmetrical at both sides about a first line connecting a center of the rotor core to a center between the adjacent installing holes, and an angle between the first line and a second line connecting the center of the rotor core to an outermost end of the plurality of magnetic flux-disconnection preventing holes is about 15˜20°. A length between an outer periphery of the rotor core and an outer periphery of the plurality of magnetic flux-disconnection preventing holes is smaller than a gap between the rotor core and the stator.
    • 无刷直流电动机防止磁通断开并使磁通量的泄漏最小化,从而减小转矩脉动。 在安装有磁铁的安装孔之间,在转子铁心的外周配置有多个防磁通孔。 多个防磁通孔在两侧围绕连接转子铁心的中心到相邻安装孔之间的中心的第一线对称,并且第一线与连接中心的第二线之间的角度对称 转子芯到多个防磁通孔的最外端约为15〜20°。 转子芯体的外周与多个防磁漏孔的外周之间的长度小于转子铁心与定子之间的间隙。
    • 16. 发明申请
    • Method of fabricating silicon-doped metal oxide layer using atomic layer deposition technique
    • 使用原子层沉积技术制造掺杂硅的金属氧化物层的方法
    • US20060257563A1
    • 2006-11-16
    • US11329696
    • 2006-01-11
    • Seok-Joo DohShi-Woo RheeJong-Pyo KimJung-Hyoung LeeJong-Ho LeeYun-Seok Kim
    • Seok-Joo DohShi-Woo RheeJong-Pyo KimJung-Hyoung LeeJong-Ho LeeYun-Seok Kim
    • C23C16/00
    • C23C16/401C23C16/45529C23C16/45531
    • There are provided methods of fabricating a silicon-doped metal oxide layer on a semiconductor substrate using an atomic layer deposition technique. The methods include an operation of repeatedly performing a metal oxide layer formation cycle K times and an operation of repeatedly performing a silicon-doped metal oxide layer formation cycle Q times. At least one of the values K and Q is an integer of 2 or more. K and Q are integers ranging from 1 to about 10 respectively. The metal oxide layer formation cycle includes the steps of supplying a metal source gas to a reactor containing the substrate, and then injecting an oxide gas into the reactor. The silicon-doped metal oxide layer formation cycle includes supplying a metal source gas including silicon into a reactor containing the substrate, and then injecting an oxide gas into the reactor. The sequence of operations of repeatedly performing the metal oxide layer formation cycle K times, followed by repeatedly performing the silicon-doped metal oxide layer formation cycle Q times, is performed one or more times until a silicon-doped metal oxide layer with a desired thickness is formed on the substrate. In addition, a method of fabricating a silicon-doped hafnium oxide (Si-doped HfO2) layer according to a similar invention method is also provided.
    • 提供了使用原子层沉积技术在半导体衬底上制造掺硅金属氧化物层的方法。 这些方法包括重复进行金属氧化物层形成循环K次的操作和重复进行掺硅金属氧化物层形成循环Q次的操作。 值K和Q中的至少一个是2以上的整数。 K和Q分别为1至约10的整数。 金属氧化物层形成循环包括将金属源气体供给到包含基板的反应器中,然后将氧化物气体注入到反应器中的步骤。 掺杂硅的金属氧化物层形成循环包括将含有硅的金属源气体供给到含有该基板的反应器中,然后将氧化物气体注入反应器。 重复执行金属氧化物层形成循环K次的操作顺序,随后重复进行掺杂硅的金属氧化物层形成循环Q次,执行一次或多次,直到具有所需厚度的掺硅金属氧化物层 形成在基板上。 此外,还提供了根据类似的发明方法制造掺杂硅的氧化铪(Si掺杂的HfO 2 N 2)层的方法。