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11. 发明申请

US20080210459A1 WARPAGE-PROOF CIRCUIT BOARD STRUCTURE 有权
标题翻译：防伪电路板结构
公开(公告)号：US20080210459A1
公开(公告)日：2008-09-04
申请号：US12039997
申请日：2008-02-29
申请人： Wei-Hung Lin
发明人： Wei-Hung Lin
IPC分类号： H05K1/09
CPC分类号： H05K1/0271 , H05K3/108 , H05K3/4644 , H05K2201/09563 , H05K2201/096 , H05K2201/09781 , H05K2201/2009 , H05K2201/2018
摘要： The invention provides a warpage-proof circuit board structure, including: an inner layer circuit board; at least one dielectric layer formed on at least one surface of the inner layer circuit board; at least one first groove formed in the at least one dielectric layer corresponding in position thereto; a solder mask formed on the surface of the dielectric layer, a second groove formed in the solder mask and corresponding in position to the first groove formed in the dielectric layer; and a metal frame formed in the first and second grooves and protruding from the surface of the solder mask, thereby strengthening the circuit board to prevent it from warping in thermal processing and further using the metal frame as a heat-dissipating means for the package structure.
摘要翻译：本发明提供一种抗翘曲电路板结构，包括：内层电路板; 形成在所述内层电路板的至少一个表面上的至少一个电介质层; 形成在所述至少一个电介质层中的至少一个第一凹槽对应于其中; 形成在所述电介质层的表面上的焊料掩模，形成在所述焊料掩模中并对应于形成在所述电介质层中的所述第一沟槽的位置的第二沟槽; 以及金属框架，形成在第一槽和第二槽中并且从焊接掩模的表面突出，从而加强电路板以防止其在热加工中翘曲，并且进一步使用金属框作为用于封装结构的散热装置。

12. 发明申请

US20080038940A1 COAXIAL CABLE CONNECTING APPARATUS 有权
标题翻译：同轴电缆连接装置
公开(公告)号：US20080038940A1
公开(公告)日：2008-02-14
申请号：US11500932
申请日：2006-08-09
申请人： Li-Sen Chen , Chuan-Shien Yu , Wei-Hung Lin
发明人： Li-Sen Chen , Chuan-Shien Yu , Wei-Hung Lin
IPC分类号： H05K1/00
CPC分类号： H01R9/0518
摘要： A wire core of a coaxial cable is tightly bonded with a terminal. A pressing member is used to press the wire core toward the terminal. By doing so, better electrical characteristics are acquired.
摘要翻译：同轴电缆的芯线与端子紧密接合。使用按压构件将线芯朝向端子按压。通过这样做，获得更好的电特性。

13. 发明授权

US09821196B2 Luminous ball 有权
公开(公告)号：US09821196B2
公开(公告)日：2017-11-21
申请号：US15242511
申请日：2016-08-20
申请人： Wei-Hung Lin
发明人： Wei-Hung Lin
IPC分类号： A63B43/06 , A63B69/00 , A63B37/06 , A63B37/12 , A63B102/18
CPC分类号： A63B43/06 , A63B37/06 , A63B69/0002 , A63B2037/125 , A63B2102/18 , A63B2207/02
摘要： A luminous ball is provided, including an internal sphere in which at least one receiving space is disposed; a light-emitting device disposed in the receiving space; at least one covering wrapping an external circumferential surface of the internal sphere; at least one seam formed on an edge of the covering; a plurality of thread apertures disposed in pairs at two sides of the at least one seam; at least one thread penetrating the plurality of thread apertures to stitch the edge of the covering between the two sides of the at least one seam; wherein the internal sphere is a transparent ball, a light generated by the light-emitting device penetrates the internal sphere through the receiving space, and is visible through the at least one seam and the plurality of the thread apertures distributed on the covering.

14. 发明授权

US09412689B2 Semiconductor packaging structure and method 有权
标题翻译：半导体封装结构及方法
公开(公告)号：US09412689B2
公开(公告)日：2016-08-09
申请号：US13357379
申请日：2012-01-24
申请人： Chun-Cheng Lin , Chung-Shi Liu , Kuei-Wei Huang , Cheng-Ting Chen , Wei-Hung Lin , Ming-Da Cheng
发明人： Chun-Cheng Lin , Chung-Shi Liu , Kuei-Wei Huang , Cheng-Ting Chen , Wei-Hung Lin , Ming-Da Cheng
IPC分类号： H01L23/02 , H01L23/498 , H01L25/10 , H01L23/00
CPC分类号： H01L25/0657 , H01L21/0273 , H01L21/486 , H01L21/56 , H01L21/76898 , H01L23/3128 , H01L23/49827 , H01L23/49838 , H01L23/49866 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/105 , H01L25/50 , H01L2224/0231 , H01L2224/0239 , H01L2224/03452 , H01L2224/0401 , H01L2224/05083 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05184 , H01L2224/1131 , H01L2224/11424 , H01L2224/1152 , H01L2224/1162 , H01L2224/11825 , H01L2224/11849 , H01L2224/13024 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13118 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13611 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/16238 , H01L2225/06517 , H01L2225/06541 , H01L2225/06548 , H01L2225/06586 , H01L2225/1023 , H01L2225/1058 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/01048 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/12042 , H01L2924/15311 , H01L2924/15321 , H01L2924/15747 , H01L2924/18161 , H01L2924/2064 , H01L2924/20641 , H01L2924/20642 , H01L2924/00014 , H01L2924/00
摘要： A system and method for packaging semiconductor dies is provided. An embodiment comprises a first package with a first contact and a second contact. A post-contact material is formed on the first contact in order to adjust the height of a joint between the contact pad a conductive bump. In another embodiment a conductive pillar is utilized to control the height of the joint between the contact pad and external connections.
摘要翻译：提供一种用于封装半导体管芯的系统和方法。实施例包括具有第一触点和第二触点的第一封装。在第一接触件上形成接触后材料，以便调节接触垫之间的接头的高度，导体凸块。在另一个实施例中，使用导电柱来控制接触垫和外部连接之间的接头的高度。

15. 发明授权

US08809117B2 Packaging process tools and packaging methods for semiconductor devices 有权
标题翻译：半导体器件的封装工艺和封装方法
公开(公告)号：US08809117B2
公开(公告)日：2014-08-19
申请号：US13270890
申请日：2011-10-11
申请人： Wen-Hsiung Lu , Ming-Da Cheng , Wei-Hung Lin , Kuei-Wei Huang , Chih-Wei Lin , Chun-Cheng Lin , Chung-Shi Liu
发明人： Wen-Hsiung Lu , Ming-Da Cheng , Wei-Hung Lin , Kuei-Wei Huang , Chih-Wei Lin , Chun-Cheng Lin , Chung-Shi Liu
IPC分类号： H01L21/00
CPC分类号： H01L21/6835 , H01L21/561 , H01L21/563 , H01L23/3128 , H01L23/562 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/97 , H01L2221/68372 , H01L2224/0401 , H01L2224/05027 , H01L2224/05124 , H01L2224/05554 , H01L2224/05572 , H01L2224/05599 , H01L2224/11444 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/13082 , H01L2224/13083 , H01L2224/13111 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13169 , H01L2224/14135 , H01L2224/16225 , H01L2224/16238 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/75754 , H01L2224/7698 , H01L2224/81001 , H01L2224/81136 , H01L2224/81191 , H01L2224/81203 , H01L2224/81815 , H01L2224/81907 , H01L2224/83102 , H01L2224/9205 , H01L2224/92125 , H01L2224/95001 , H01L2224/97 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/351 , H01L2924/3511 , H01L2924/3512 , H01L2924/3841 , Y10T29/41 , H01L2924/00 , H01L2224/81 , H01L2924/00012 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2224/05552 , H01L2924/013
摘要： Packaging process tools and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging process tool for semiconductor devices includes a mechanical structure including a frame. The frame includes a plurality of apertures adapted to retain a plurality of integrated circuit dies therein. The frame includes at least one hollow region.
摘要翻译：公开了用于半导体器件的封装处理工具和封装方法。在一个实施例中，用于半导体器件的封装处理工具包括包括框架的机械结构。框架包括适于将多个集成电路管芯保持在其中的多个孔。框架包括至少一个中空区域。

16. 发明申请

US20140001652A1 PACKAGE-ON-PACKAGE STRUCTURE HAVING POLYMER-BASED MATERIAL FOR WARPAGE CONTROL 有权
标题翻译：具有聚合物材料的包装封装结构进行温度控制
公开(公告)号：US20140001652A1
公开(公告)日：2014-01-02
申请号：US13539136
申请日：2012-06-29
申请人： Meng-Tse CHEN , Yu-Chih LIU , Hui-Min HUANG , Wei-Hung LIN , Jing Ruei LU , Ming-Da CHENG , Chung-Shi LIU
发明人： Meng-Tse CHEN , Yu-Chih LIU , Hui-Min HUANG , Wei-Hung LIN , Jing Ruei LU , Ming-Da CHENG , Chung-Shi LIU
IPC分类号： H01L23/52 , H01L21/50
CPC分类号： H01L25/0652 , H01L21/561 , H01L21/563 , H01L23/00 , H01L23/293 , H01L23/3121 , H01L23/562 , H01L24/17 , H01L25/0655 , H01L25/50 , H01L2224/16 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H01L2225/06513 , H01L2225/06517 , H01L2225/06555 , H01L2225/06582 , H01L2924/15311
摘要： A package on package structure providing mechanical strength and warpage control includes a first package component, a second package component, and a first set of conductive elements coupling the first package component to the second package component. A first polymer-comprising material is molded on the first package component and surrounds the first set of conductive elements. The first polymer-comprising material has an opening therein exposing a top surface of the second package component. A third package component and a second set of conductive elements couples the second package component to the third package component.
摘要翻译：提供机械强度和翘曲控制的封装结构的封装包括第一封装元件，第二封装元件和将第一封装元件连接到第二封装元件的第一组导电元件。第一含聚合物的材料被模制在第一包装部件上并包围第一组导电元件。第一含聚合物的材料在其中具有露出第二包装部件的顶表面的开口。第三包装部件和第二组导电元件将第二包装部件耦合到第三包装部件。

17. 发明申请

US20130143361A1 Packaging Process Tools and Systems, and Packaging Methods for Semiconductor Devices 有权
标题翻译：包装工艺和系统以及半导体器件的封装方法
公开(公告)号：US20130143361A1
公开(公告)日：2013-06-06
申请号：US13309311
申请日：2011-12-01
申请人： Wei-Hung Lin , Kuei-Wei Huang , Chih-Wei Lin , Chun-Cheng Lin , Ming-Da Cheng , Chung-Shi Liu
发明人： Wei-Hung Lin , Kuei-Wei Huang , Chih-Wei Lin , Chun-Cheng Lin , Ming-Da Cheng , Chung-Shi Liu
IPC分类号： H01L21/60 , H01L23/12
CPC分类号： H01L21/6835 , H01L21/561 , H01L21/563 , H01L23/3128 , H01L23/562 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/97 , H01L2221/68372 , H01L2224/0401 , H01L2224/05027 , H01L2224/05124 , H01L2224/05554 , H01L2224/05572 , H01L2224/05599 , H01L2224/11444 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/13082 , H01L2224/13083 , H01L2224/13111 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13169 , H01L2224/14135 , H01L2224/16225 , H01L2224/16238 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/75754 , H01L2224/7698 , H01L2224/81001 , H01L2224/81136 , H01L2224/81191 , H01L2224/81203 , H01L2224/81815 , H01L2224/81907 , H01L2224/83102 , H01L2224/9205 , H01L2224/92125 , H01L2224/95001 , H01L2224/97 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/351 , H01L2924/3511 , H01L2924/3512 , H01L2924/3841 , Y10T29/41 , H01L2924/00 , H01L2224/81 , H01L2924/00012 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2224/05552 , H01L2924/013
摘要： Packaging process tools and systems, and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging process tool for semiconductor devices includes a mechanical structure for supporting package substrates or integrated circuit die during a packaging process for the integrated circuit die. The mechanical structure includes a low thermal conductivity material disposed thereon.
摘要翻译：公开了用于半导体器件的封装加工工具和系统以及封装方法。在一个实施例中，用于半导体器件的封装处理工具包括用于在集成电路管芯的封装工艺期间支撑封装衬底或集成电路管芯的机械结构。机械结构包括设置在其上的低热导率材料。

18. 发明申请

US20130113116A1 Contact and Method of Formation 有权
公开(公告)号：US20130113116A1
公开(公告)日：2013-05-09
申请号：US13291882
申请日：2011-11-08
申请人： Meng-Tse Chen , Wei-Hung Lin , Kuei-Wei Huang , Chih-Wei Lin , Chih Chun Chiu , Ming-Da Cheng , Chung-Shi Liu
发明人： Meng-Tse Chen , Wei-Hung Lin , Kuei-Wei Huang , Chih-Wei Lin , Chih Chun Chiu , Ming-Da Cheng , Chung-Shi Liu
IPC分类号： H01L23/28 , H01L21/56
CPC分类号： H01L23/48 , H01L21/4853 , H01L21/561 , H01L23/3121 , H01L23/49816 , H01L24/16 , H01L25/105 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2225/1023 , H01L2225/1058 , H01L2924/15321 , H01L2224/05624 , H01L2924/00014 , H01L2224/05647
摘要： A system and method for forming contacts is provided. An embodiment comprises forming the contacts on a substrate and then coining the contacts by physically shaping them using, e.g., a molding chamber. The physical shaping of the contacts may be performed using a patterned portion of the molding chamber or else by placing a patterned stencil around the contacts prior before a force is applied to physically reshape the contacts. The contacts may be reshaped into a cylindrical, oval, cuboid, or rectangular shape, for example.

19. 发明申请

US20130062761A1 Packaging Methods and Structures for Semiconductor Devices 有权
公开(公告)号：US20130062761A1
公开(公告)日：2013-03-14
申请号：US13228768
申请日：2011-09-09
申请人： Chih-Wei Lin , Ming-Da Cheng , Wen-Hsiung Lu , Hsiu-Jen Lin , Bor-Ping Jang , Chung-Shi Liu , Mirng-Ji Lii , Chen-Hua Yu , Meng-Tse Chen , Chun-Cheng Lin , Yu-Peng Tsai , Kuei-Wei Huang , Wei-Hung Lin
发明人： Chih-Wei Lin , Ming-Da Cheng , Wen-Hsiung Lu , Hsiu-Jen Lin , Bor-Ping Jang , Chung-Shi Liu , Mirng-Ji Lii , Chen-Hua Yu , Meng-Tse Chen , Chun-Cheng Lin , Yu-Peng Tsai , Kuei-Wei Huang , Wei-Hung Lin
IPC分类号： H01L23/498 , H01L21/56
CPC分类号： H01L25/0657 , H01L21/52 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L21/76898 , H01L23/3128 , H01L23/3135 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/5389 , H01L24/03 , H01L24/05 , H01L24/09 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/92 , H01L24/97 , H01L25/03 , H01L25/0652 , H01L25/0655 , H01L25/105 , H01L25/50 , H01L2221/68331 , H01L2221/68345 , H01L2221/68377 , H01L2224/0231 , H01L2224/0401 , H01L2224/04105 , H01L2224/06515 , H01L2224/09181 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/16225 , H01L2224/16238 , H01L2224/73259 , H01L2224/81005 , H01L2224/81191 , H01L2224/81815 , H01L2224/9202 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06524 , H01L2225/06541 , H01L2225/06548 , H01L2924/14 , H01L2924/1461 , H01L2924/15192 , H01L2924/15311 , H01L2924/15321 , H01L2924/15322 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2224/81 , H01L2224/03 , H01L2924/014 , H01L2924/00
摘要： Packaging methods and structures for semiconductor devices are disclosed. In one embodiment, a packaged semiconductor device includes a redistribution layer (RDL) having a first surface and a second surface opposite the first surface. At least one integrated circuit is coupled to the first surface of the RDL, and a plurality of metal bumps is coupled to the second surface of the RDL. A molding compound is disposed over the at least one integrated circuit and the first surface of the RDL.

20. 发明申请

US20120018494A1 Thermal Compress Bonding 有权
标题翻译：热压接合
公开(公告)号：US20120018494A1
公开(公告)日：2012-01-26
申请号：US12841858
申请日：2010-07-22
申请人： Bor-Ping Jang , Kuei-Wei Huang , Wei-Hung Lin , Chung-Shi Liu
发明人： Bor-Ping Jang , Kuei-Wei Huang , Wei-Hung Lin , Chung-Shi Liu
IPC分类号： B23K31/02
CPC分类号： H01L24/81 , H01L24/13 , H01L24/16 , H01L24/75 , H01L24/95 , H01L2224/13147 , H01L2224/16058 , H01L2224/16225 , H01L2224/75251 , H01L2224/75252 , H01L2224/75302 , H01L2224/75824 , H01L2224/7598 , H01L2224/81193 , H01L2224/81203 , H01L2224/81234 , H01L2224/81815 , H01L2224/81947 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/14 , H01L2924/00014 , H01L2924/00
摘要： A method includes providing a substrate carrier including work piece holders, and placing a first plurality of work pieces into the work piece holders. A second plurality of work pieces is picked up and placed, with each of the second plurality of work pieces being placed on one of the first plurality of work pieces. Solder bumps between the first and the second plurality of work pieces are then reflowed to simultaneously bond the first and the second plurality of work pieces together.
摘要翻译：一种方法包括提供包括工件保持件的基板载体，以及将第一多个工件放置在工件保持件中。拾取和放置第二多个工件，其中第二多个工件中的每一个被放置在第一多个工件中的一个上。然后，第一和第二多个工件之间的焊接凸起被回流以同时将第一和第二工件一起粘合在一起。

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