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    • 18. 发明授权
    • Buried type semiconductor laser
    • 埋式半导体激光器
    • US07720123B2
    • 2010-05-18
    • US11611933
    • 2006-12-18
    • Tohru TakiguchiChikara Watatani
    • Tohru TakiguchiChikara Watatani
    • H01S5/00
    • H01S5/34313B82Y20/00H01S5/2224H01S5/2227H01S5/2275H01S5/3072
    • A buried type semiconductor laser 1 is made of a p-type InP substrate 2 and includes a ridge section 6 made up of a p type InP first clad layer 3, AlGaInAs distorted quantum well active layer 4 and n type InP second clad layer 5 laminated one atop another. On both sides of the ridge section 6, an buried current block layer 10 made up of a p-type InP first buried layer 7, n-type InP second buried layer 8 and semi-insulating Fe-doped InP third buried layer 9 laminated one atop another is formed. A top face of the third buried layer 9 is covered with an n-type InP semiconductor layer 11. The above structure can suppress the occurrence of a leakage current path on the top face of the third buried layer 9 and improve reliability of the buried type semiconductor laser.
    • 掩埋型半导体激光器1由p型InP衬底2制成,并且包括由ap型InP第一包层3,AlGaInAs失真的量子阱有源层4和n型InP第二覆盖层5组成的脊部6 在另一个上面 在脊部6的两侧,形成由p型InP第一掩埋层7,n型InP第二掩埋层8和半绝缘的Fe掺杂的InP第三掩埋层9构成的埋入电流阻挡层10, 形成另一个顶部。 第三掩埋层9的顶面被n型InP半导体层11覆盖。上述结构可以抑制在第三掩埋层9的顶面上产生漏电流路径,并且提高掩埋型的可靠性 半导体激光器。