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    • 13. 发明授权
    • Thickness measuring apparatus, thickness measuring method, and wet etching apparatus and wet etching method utilizing them
    • 厚度测量装置,厚度测量方法和湿蚀刻装置以及利用它们的湿式蚀刻方法
    • US06897964B2
    • 2005-05-24
    • US10181557
    • 2001-01-16
    • Teruo TakahashiMotoyuki WatanabeHidenori Takahashi
    • Teruo TakahashiMotoyuki WatanabeHidenori Takahashi
    • G01B11/06H01L21/00H01L21/66G01B9/02G01B11/28
    • G01B11/06H01L21/67075H01L22/12
    • At each measurement time, measurement light is supplied from a measurement light source 11, and interference light obtained when reflected light from a semiconductor wafer W and reference light from a reference light generating section 14 are coupled is detected by a photodetector 15. A thickness calculating section 16 obtains a light intensity distribution representing the correlation between the light intensity of the interference light and the reference optical path length, selects a wafer upper surface peak and wafer lower surface peak from a plurality of light intensity peaks in the light intensity distribution using a predetermined selection criterion, and calculates the thickness of the semiconductor wafer W from the optical path length difference between the light intensity peaks. With this arrangement, a thickness measuring apparatus and thickness measuring method capable of measuring the thickness of a semiconductor wafer during execution of wet etching independently of the presence of an etchant, and a wet etching apparatus and wet etching method using the thickness measuring apparatus and method are implemented.
    • 在每个测量时间,测量光从测量光源11提供,并且当来自半导体晶片W的反射光和来自参考光产生部14的参考光耦合时获得的干涉光被光电检测器15检测。 厚度计算部分16获得表示干涉光的光强度与基准光程长度之间的相关性的光强度分布,从光强度的多个光强度峰值中选择晶片上表面峰值和晶片下表面峰值 分布,并且根据光强度峰值之间的光程长度差计算半导体晶片W的厚度。 利用这种布置,可以独立于蚀刻剂的存在,以及使用该厚度测量装置和方法的湿蚀刻装置和湿式蚀刻方法,能够在执行湿蚀刻期间测量半导体晶片的厚度的厚度测量装置和厚度测量方法 被实施。
    • 14. 发明授权
    • Carrying device for information recording medium
    • 信息记录媒体携带装置
    • US06628590B1
    • 2003-09-30
    • US09433956
    • 1999-11-04
    • Kazunori MatsuoTeruo TakahashiSusumu Yoshida
    • Kazunori MatsuoTeruo TakahashiSusumu Yoshida
    • G11B700
    • G11B17/0515G11B19/12
    • An information recording-reproducing apparatus includes carrier rollers arranged in a carriage path having a width almost equal to a diameter of a large diameter disc, and a mechanical side switch PSW at one peripheral end of the carriage path. First and second optical detectors are arranged in the carriage path at an interval smaller than a diameter of the small diameter disc. The first optical detector and the side switch are arranged at an interval larger than the diameter of the small diameter disc, while the second optical detector and the side switch are arranged at an interval smaller than the diameter of the small diameter disc. The type of the disc as well as difference between the disc and an object other than the disc are determined based on the detection signals from the optical detectors and the side switch.
    • 信息记录再现装置包括布置在具有几乎等于大直径盘的直径的宽度的托架路径中的托辊和在托架路径的一个外周端处的机械侧开关PSW。 第一和第二光学检测器以小于小直径盘的直径的间隔布置在托架路径中。 第一光学检测器和侧面开关以比直径小的圆盘的直径大的间隔排列,而第二光学检测器和侧面开关以小于直径盘的直径的间隔排列。 基于来自光学检测器和侧面开关的检测信号来确定盘的类型以及盘与盘之外的物体之间的差异。
    • 15. 发明授权
    • Photo film support device and magnetic head securing method for the same
    • 摄影胶片支持装置和磁头固定方法相同
    • US06603931B2
    • 2003-08-05
    • US09861671
    • 2001-05-22
    • Soichiro KimuraWataru SasakiTeruo Takahashi
    • Soichiro KimuraWataru SasakiTeruo Takahashi
    • G03B1724
    • G03B17/24G03B2217/244
    • A camera incorporates a photo film support plate, which supports a back of photo film. The photo film has a magnetic recording area. An opening is formed in the photo film support plate. A magnetic head projects forwards from inside the opening, for recording information to and/or reading information from the magnetic recording area. A head base plate is mounted on a rear face of the photo film support plate to cover the opening, for supporting the magnetic head. Adhesive agent is applied to the periphery of the head base plate, and hardened for securing the head base plate to the photo film support plate. A pair of recesses are formed in a rear face of the head base plate in a vicinity of the periphery. The adhesive agent is disposed to extend from a front face of the head base plate to a surface of the recesses, which enlarge a contact area between the adhesive agent and the head base plate.
    • 相机包含支持照相胶片背面的摄影胶片支撑板。 摄影胶片具有磁记录区域。 在摄影胶片支承板上形成开口。 磁头从开口内部向前突出,用于将信息记录到磁记录区和/或从磁记录区读取信息。 头基板安装在摄影胶片支撑板的后表面上以覆盖开口,用于支撑磁头。 将粘合剂施加到头基板的周边,并将头基板固定到摄影胶片支撑板上进行硬化。 在头基板的背面附近形成有一对凹部。 粘合剂被设置成从头基板的前表面延伸到凹部的表面,这增加了粘合剂和头基板之间的接触面积。
    • 18. 发明授权
    • Abrasion resistant valve seat made of sintered alloy for internal
combustion engines
    • 内燃机烧结合金耐磨阀座
    • US5870989A
    • 1999-02-16
    • US985550
    • 1997-12-05
    • Teruo TakahashiTakashi Kawamoto
    • Teruo TakahashiTakashi Kawamoto
    • F01L3/02B22F5/00C22C33/02C22C38/00F01C21/08F01L3/22F04C18/344
    • F01L3/22C22C33/0207F01C21/0809
    • The invention is directed to an iron series sintered alloy superior in abrasion resistance, preferably usable for slipping parts such as valve seats used in internal combustion engines, vanes in compressors and so forth. The sintered alloy is of base matrix of a mixed structure comprising the primary phase of in area ratio 30.about.95% mainly of Fe having a hardness of 400 Hv or above with precipitated fine carbide of 10 .mu.m or smaller, and the secondary phase of in area ratio 5.about.70% softer than said primary phase, consisted of pure iron or carbon steel or low alloy steel. This base matrix will include in area ratio 1.about.20% infiltrated or previously added Cu phase or Cu alloy phase, or will include dispersed therein in area ratio 1.about.20% hard particles having average diameter of 20.about.100 .mu.m and a hardnessof 700.about.1500 Hv such as Fe--Mo paricles, Cr--Mo--Co intermetallic compound particles, C--Cr--W--Co particles, etc.
    • 本发明涉及耐磨性优异的铁系烧结合金,优选可用于内燃机中使用的阀座,压缩机叶片等滑动部件。 该烧结合金为基体基体,其混合结构包含主面积比为30%的主相,95%以上的硬度为400Hv以上的Fe,析出的微细碳化物为10μm以下,第二相为 面积比5差异比所述主相柔软70%,由纯铁或碳钢或低合金钢组成。 该基础基质将包括面积比1差异20%渗透或预先添加的Cu相或Cu合金相,或将包括以面积比1分散的平均直径为20微米的硬质颗粒为20微米,硬度为700 如Fe-Mo颗粒,Cr-Mo-Co金属间化合物颗粒,C-Cr-W-Co颗粒等的差异1500Hv