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11. 发明授权

US06812557B2 Stacked type semiconductor device 有权
公开(公告)号：US06812557B2
公开(公告)日：2004-11-02
申请号：US10673192
申请日：2003-09-30
申请人： Mie Matsuo , Takashi Yoda
发明人： Mie Matsuo , Takashi Yoda
IPC分类号： H01L2302
CPC分类号： H01L23/5382 , H01L23/544 , H01L25/0657 , H01L2223/5444 , H01L2223/54473 , H01L2223/5448 , H01L2223/54486 , H01L2224/16 , H01L2224/32145 , H01L2225/06527 , H01L2924/00014 , H01L2224/0401
摘要： Disclosed is a stacked type semiconductor device comprising a predetermined semiconductor integrated circuit chip and at least one semiconductor integrated circuit chip which are stacked, the at least one semiconductor integrated circuit chip including a group of circuit blocks, and the predetermined semiconductor integrated circuit chip comprising a storage section configured to store defect information indicative of a defective circuit block if the group includes the defective circuit block and a replacement circuit section configured to replace the defective circuit block.

12. 发明授权

US4876223A Method of manufacturing semiconductor devices 失效
标题翻译：制造半导体器件的方法
公开(公告)号：US4876223A
公开(公告)日：1989-10-24
申请号：US260300
申请日：1988-10-20
申请人： Takashi Yoda , Tohru Watanabe
发明人： Takashi Yoda , Tohru Watanabe
IPC分类号： H01L21/306 , H01L21/311 , H01L21/3205 , H01L21/3213 , H01L21/768
CPC分类号： H01L21/31133 , H01L21/32134 , H01L21/7684 , Y10S148/051
摘要： A method of manufacturing a semiconductor device whereby a wiring material is filled within a recess of an insulating film, with the upper surface of the wiring material being uneven, a coating film being evenly deposited on the wiring material, the wiring material and the coating film being etched with tetra-methyl-guanidine having the same etching speed with respect to the wiring material and the coating film in such a manner that the upper surface of the wiring material filled within the recess is made substantially flat and substantially flush with the upper surface of the insulating film. A tetra-methyl-guanide may be used which has a higher etching speed with respect to the wiring material than the coating film. In this case, the wiring material has an indentation above the recess, and the coating film is thick above the recess and thin above the insulating film. Therefore, the wiring material within the recess is etched in such a manner that the upper surface of the wiring material within the recess is made flat and substantially flush with the upper surface of the insulating film.

13. 发明授权

US3644170A Fibrilating fibrous pulp stock in a gas stream 失效
标题翻译：在气体流中混合纤维浆料
公开(公告)号：US3644170A
公开(公告)日：1972-02-22
申请号：US3644170D
申请日：1969-12-10
申请人： TEIZO MEKATA , TAKASHI YODA , MASAHARU SHIRAISHI
发明人： MEKATA TEIZO , YODA TAKASHI , SHIRAISHI MASAHARU
IPC分类号： D21D1/00 , D21B1/12 , D21D1/38
CPC分类号： D21B1/12
摘要： Pulp stock in the form of dehydrated pulp flakes having a moisture content of between 20 and 50 percent is entrained in an airstream and is fed into a fibrilator where it is subjected to a three-dimensional turbulent flow resulting from the unidirectional propulsive force of the airstream and centrifugal force caused by rotating blades within the fibrilator. The flakes impinge upon one another and when disintegrated are withdrawn from the fibrilator by the unidirectional force of the airstream. The less fully disintegrated flakes undergo mechanical impact with a toothed surface in the fibrilator and are then withdrawn. The temperature of the airstream may be controlled by a heat exchanger and the moisture content thereof by valved water and steampipes connected to the airstream carrying duct upstream of the fibrilator.

14. 发明授权

US06661088B1 Semiconductor integrated circuit device having interposer and method of manufacturing the same 有权
标题翻译：具有插入件的半导体集成电路器件及其制造方法
公开(公告)号：US06661088B1
公开(公告)日：2003-12-09
申请号：US09669724
申请日：2000-09-26
申请人： Takashi Yoda , Hirokazu Ezawa
发明人： Takashi Yoda , Hirokazu Ezawa
IPC分类号： H01L23053
CPC分类号： H01L23/481 , H01L21/76898 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L27/228 , H01L2224/16225 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/13091 , H01L2924/15174 , H01L2924/15311 , H05K1/141
摘要： A semiconductor integrated circuit device has a semiconductor chip, interposer, and substrate. The semiconductor chip has a plurality of first pads arranged at first pitches on a surface. The interposer has a first surface and a second surface. On the first surface, a plurality of second pads are arranged at the first pitches. On said second surface, a plurality of third pads arranged at second pitches which are larger than the first pitches. The second pads and the first pads are connected to each other by joining the first surface of the interposer to the surface of the semiconductor chip so as to face each other. The substrate has a plurality of fourth pads arranged at the second pitches on a surface. The fourth pads and the third pads are connected to each other by joining the surface of the substrate to the second surface of the interposer so as to face each other.
摘要翻译：半导体集成电路器件具有半导体芯片，插入件和衬底。半导体芯片具有在表面上以第一间距布置的多个第一焊盘。插入器具有第一表面和第二表面。在第一表面上，以第一间距布置多个第二垫。在所述第二表面上，以比第一间距大的第二间距布置的多个第三衬垫。第二焊盘和第一焊盘通过将插入件的第一表面与半导体芯片的表面接合以彼此面对而彼此连接。衬底具有在表面上以第二间距布置的多个第四衬垫。第四焊盘和第三焊盘通过将基板的表面与插入件的第二表面接合以彼此面对而彼此连接。

15. 发明授权

US06432257B1 Dresser for polishing cloth and method for manufacturing such dresser and polishing apparatus 失效
标题翻译：抛光布修整器及其制造方法
公开(公告)号：US06432257B1
公开(公告)日：2002-08-13
申请号：US09018909
申请日：1998-02-05
申请人： Hiroshi Nagasaka , Momoko Kakutani , Kunio Tateishi , Naoaki Ogure , Takashi Yoda
发明人： Hiroshi Nagasaka , Momoko Kakutani , Kunio Tateishi , Naoaki Ogure , Takashi Yoda
IPC分类号： B24B500
CPC分类号： B24B53/017 , B24B37/04 , B24B53/12 , B24D18/00
摘要： A improved dresser for dressing a polishing surface, easily be manufactured such that an object to be polished is not scratched when the object is polished. The dresser can dress the polishing surface of a polishing apparatus to effect surface correction and to correct a time-lapse change due to a polishing operation, a number of spired projections are formed on a surface of a metallic substrate and a wear-resistant hard film is formed on at least a portion of the surface of the metallic substrate on which the projections are formed.
摘要翻译：可以容易地制造用于修整抛光表面的改进的修整器，使得抛光对象在被抛光时不被划伤。梳妆台可以打磨抛光装置的抛光表面以进行表面校正并且校正由于抛光操作引起的延时变化，在金属基底和耐磨硬膜的表面上形成多个喷射突起形成在其上形成有突起的金属基板的表面的至少一部分上。

16. 发明授权

US06410439B1 Semiconductor polishing apparatus and method for chemical/mechanical polishing of films 失效
标题翻译：半导体抛光装置及薄膜化学/机械抛光方法
公开(公告)号：US06410439B1
公开(公告)日：2002-06-25
申请号：US09527528
申请日：2000-03-16
申请人： Masako Kodera , Takashi Yoda , Motosuke Miyoshi
发明人： Masako Kodera , Takashi Yoda , Motosuke Miyoshi
IPC分类号： H01L21302
CPC分类号： B24B37/013 , H01L21/30625 , H01L21/31053
摘要： In the CMP of films of semiconductor devices, pulsed measuring radiation is directed onto a surface to be polished of a rotating wafer. At this point, the pulse repetition rate of the pulsed measuring radiation is determined so that the pulse measuring radiation is directed only onto a specified portion of the surface of each semiconductor device. Thereby, reflection data can be obtained only from the specified portion of a film to be polished, allowing accurate measurements of the thickness of the specified portion of the film in the middle of polishing.
摘要翻译：在半导体器件的CMP的CMP中，脉冲测量辐射被引导到旋转晶片抛光的表面上。此时，脉冲测量辐射的脉冲重复率被确定为使得脉冲测量辐射仅指向每个半导体器件的表面的指定部分。由此，只能从要被研磨的膜的指定部分获得反射数据，从而可以精确地测量抛光中间的膜的指定部分的厚度。

17. 发明授权

US07351131B2 Method for manufacturing semiconductor device and polishing apparatus 失效
标题翻译：半导体器件和抛光装置的制造方法
公开(公告)号：US07351131B2
公开(公告)日：2008-04-01
申请号：US11178318
申请日：2005-07-12
申请人： Kenro Nakamura , Naoto Miyashita , Takashi Yoda , Katsuya Okumura
发明人： Kenro Nakamura , Naoto Miyashita , Takashi Yoda , Katsuya Okumura
IPC分类号： B24B1/00
CPC分类号： H01L21/304 , B24B9/065 , B24B21/002 , B24B21/06 , H01L21/321 , Y10S134/902
摘要： In manufacturing a semiconductor device, a part of an element is formed on the surface of a substrate, and at least a periphery of the substrate is polished using a polishing member stretched around the periphery of the substrate so that a polishing face of the polishing member is slid on a polishing target surface of the periphery.
摘要翻译：在半导体器件的制造中，元件的一部分形成在基板的表面上，并且使用在基板周围进行拉伸的研磨部件来研磨基板的至少周边，使得研磨部件的研磨面在周边的抛光对象表面上滑动。

18. 发明授权

US06566261B2 Semiconductor device and method of manufacturing the same 失效
公开(公告)号：US06566261B2
公开(公告)日：2003-05-20
申请号：US09946601
申请日：2001-09-06
申请人： Hiroshi Ikegami , Rempei Nakata , Takashi Yoda , Nobuo Hayasaka , Yoshimi Hisatsune
发明人： Hiroshi Ikegami , Rempei Nakata , Takashi Yoda , Nobuo Hayasaka , Yoshimi Hisatsune
IPC分类号： H01L2144
CPC分类号： H01L23/53238 , H01L21/0217 , H01L21/02274 , H01L21/02307 , H01L21/02315 , H01L21/3122 , H01L21/76838 , H01L24/11 , H01L2224/13099 , H01L2224/45144 , H01L2224/45147 , H01L2924/00011 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/04953 , H01L2924/12042 , H01L2924/19043 , H01L2924/30105 , Y10S438/959 , H01L2924/00 , H01L2924/01005 , H01L2924/01004 , H01L2924/00014
摘要： There is provided a semiconductor device including a semiconductor substrate and a conductive layer above the semiconductor substrate, wherein the conductive layer contains copper, a surface region of the conductive layer contains at least one of C—H bonds and C—C bonds, and a total amount of C atoms forming the C—H bonds and C atoms forming the C—C bonds in the surface region is 30 atomic % or more of a whole amount of elements in the surface region.

19. 发明授权

US06508578B2 Indication lamp 失效
标题翻译：指示灯
公开(公告)号：US06508578B2
公开(公告)日：2003-01-21
申请号：US09876804
申请日：2001-06-07
申请人： Takashi Yoda , Kunio Toyota
发明人： Takashi Yoda , Kunio Toyota
IPC分类号： F21S1002
CPC分类号： G09F13/08 , G09F13/04 , Y10S362/80 , Y10S362/812
摘要： An indication lamp for, for instance, aircraft passenger cabins comprising light sources housed in lamp chambers defined by a housing and a front cover. Translucent indication portions of the shapes indicative of non-smoking and fasten-seatbelt signs in red, for instance, are formed in the front cover; and the light sources, each comprising a set of light emitting diodes of different colors, such as green and red, are installed behind the translucent indication portions so that each light source emits a mixture of colors that is similar to an incandescent light, thus illuminating the sings with an enhanced visibility.
摘要翻译：用于例如飞机乘客舱的指示灯，其包括容纳在由壳体和前盖限定的灯室中的光源。例如，在前盖中形成表示红色的非吸烟和紧固安全带标志的形状的半透明指示部分; 并且每个包括一组不同颜色的发光二极管（例如绿色和红色）的光源被安装在半透明指示部分的后面，使得每个光源发射类似于白炽灯的颜色的混合物，从而照亮歌声增强了知名度。

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