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    • 16. 发明申请
    • METHOD FOR COMPUTING THE CRITICAL AREA OF COMPOUND FAULT MECHANISMS
    • 计算化合物故障机理关键领域的方法
    • US20080127004A1
    • 2008-05-29
    • US11461805
    • 2006-08-02
    • Robert J. AllenSarah C. BraaschMervyn Y. Tan
    • Robert J. AllenSarah C. BraaschMervyn Y. Tan
    • G06F17/50
    • G06F17/5081
    • Disclosed is a method of calculating critical area based on both independent and dependent compound fault mechanisms. This critical area is calculated by generating, for each simple fault mechanism in the compound fault mechanism, a map made up of polygonal regions, where values on a third dimensional z-axis represent the critical defect size for each single fault mechanism at a point x,y. These maps are overlaid and the planar faces (i.e., top surfaces) of each region of each map are projected onto the x,y plane in order to identify intersecting sub-regions. The dominant fault mechanism within each sub-region is identified based on an answer to predetermined Boolean expression and the critical areas for all of the sub-regions are accumulated in order to obtain the total critical area for the compound fault mechanism.
    • 公开了一种基于独立和依赖复合故障机制来计算临界面积的方法。 该关键区域通过为复合故障机制中的每个简单故障机制产生由多边形区域组成的地图来计算,其中第三维z轴上的值表示在点x处的每个单个故障机制的临界缺陷尺寸 ,y。 覆盖这些贴图,并且将每个贴图的每个区域的平面(即,顶面)投影到x,y平面上,以便识别相交的子区域。 基于对预定布尔表达式的答案来识别每个子区域内的主要故障机制,并且累积所有子区域的临界区域以获得复合故障机制的总临界面积。
    • 18. 发明授权
    • Use of a layout-optimization tool to increase the yield and reliability of VLSI designs
    • 使用布局优化工具来提高VLSI设计的产出和可靠性
    • US06941528B2
    • 2005-09-06
    • US10604962
    • 2003-08-28
    • Robert J. AllenJason D. HibbelerGustavo E. Tellez
    • Robert J. AllenJason D. HibbelerGustavo E. Tellez
    • G06F9/45G06F17/50
    • G06F17/5068
    • The invention provides a method and structure for optimizing placement of redundant vias within an integrated circuit design. The invention first locates target vias by determining which vias do not have a redundant via. Then, the invention draws marker shapes on or adjacent to the target vias. The marker shapes are only drawn in a horizontal or vertical direction from each of the target vias. The invention simultaneously expands all of the marker shapes in the first direction to a predetermined length or until the marker shapes reach the limits of a ground rule. During the expanding, different marker shapes will be expanded to different lengths. The invention determines which of the marker shapes were expanded sufficiently to form a valid redundant via to produce a first set of potential redundant vias and the invention eliminates marker shapes that could not be expanded sufficiently to form a valid redundant via.
    • 本发明提供了一种用于优化集成电路设计中的冗余通孔的布置的方法和结构。 本发明首先通过确定哪些通孔没有冗余通孔来定位目标通孔。 然后,本发明在目标通孔上或附近绘制标记物形状。 标记形状仅在每个目标通孔的水平或垂直方向绘制。 本发明同时将第一方向上的所有标记形状扩展到预定长度,或者直到标记形状达到接地规则的极限。 在扩展期间,不同的标记形状将被扩展到不同的长度。 本发明确定哪些标记形状被充分扩展以形成有效的冗余通路以产生第一组潜在的冗余通孔,并且本发明消除了不能充分扩展以形成有效的冗余通路的标记形状。