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11. 发明申请

US20060151336A1 Pad for electrochemical processing 审中-公开
公开(公告)号：US20060151336A1
公开(公告)日：2006-07-13
申请号：US11345634
申请日：2006-01-31
申请人： Paul Butterfield , Liang-Yuh Chen , Yongqi Hu , Antoine Manens , Rashid Mavliev , Stan Tsai
发明人： Paul Butterfield , Liang-Yuh Chen , Yongqi Hu , Antoine Manens , Rashid Mavliev , Stan Tsai
IPC分类号： B23H3/00
CPC分类号： B24B37/24 , B23H5/08 , B24B37/046 , H01L21/32125
摘要： Systems and methods for electrochemically processing. In one embodiment, a plurality of grooves are formed in a polishing surface of a polishing pad. The grooves are adapted to facilitate the flow of polishing fluid over the polishing pad. Conductive layers are respectively formed in the grooves, wherein the conductive layers are in electrical communication with each other.

12. 发明申请

US20050157317A1 Systems and methods for spectrophotometric assessment of color misregistration in an image forming system 审中-公开
标题翻译：用于分光光度法评估图像形成系统中颜色对准的系统和方法
公开(公告)号：US20050157317A1
公开(公告)日：2005-07-21
申请号：US10758099
申请日：2004-01-16
申请人： Paul Butterfield , Mark Gwaltney , Timothy Sulenski
发明人： Paul Butterfield , Mark Gwaltney , Timothy Sulenski
IPC分类号： B41J2/525 , G01J3/46 , G03G15/00 , G03G15/01 , H04N1/29 , H04N1/46 , H04N1/60 , H04N1/58
CPC分类号： G01J3/46 , G03G15/0152 , G03G15/0163 , G03G2215/0161
摘要： A system and method for detecting and correcting color misregistration errors in a color image forming device. Spectrophotometric analysis is performed on special color registration patches to transform color registration errors into a color signal. The color registration patch is designed so the color shift detected by the spectrophotometer allows prediction of the amount of color misregistration.
摘要翻译：一种用于检测和校正彩色图像形成装置中的色对准误差的系统和方法。对特殊颜色配准贴片进行分光光度分析，将颜色配准误差转换为彩色信号。颜色配准贴片设计成使得分光光度计检测到的色偏可以预测颜色不对齐的量。

13. 发明申请

US20050151974A1 Methods for automated uniformity assessment and modification of image non-uniformities 有权
标题翻译：自动均匀性评估和图像不均匀性修改的方法
公开(公告)号：US20050151974A1
公开(公告)日：2005-07-14
申请号：US10756396
申请日：2004-01-14
申请人： Paul Butterfield , Joseph Hancock , Norman Roof , Shawn Updegraff
发明人： Paul Butterfield , Joseph Hancock , Norman Roof , Shawn Updegraff
IPC分类号： H04N1/00 , H04N1/401 , G01N21/55
CPC分类号： H04N1/00015 , H04N1/00002 , H04N1/00031 , H04N1/00045 , H04N1/00058 , H04N1/4015 , H04N2201/0096
摘要： Methods for automated uniformity assessment and modification of image non-uniformities using an image measurement device capable of determining image reflectance and/or transmitter as a function of position, such as a spectrophotometer, a calorimeter, and/or a densitometer. One or more of these devices scan an image on a substrate, such as a sheet, thereby generating data representing image characteristics, such as, for example, image non-uniformity. The sheet may contain a reference/test pattern including one column, strip or patch intended to have a uniform density. This data generated by the device after the scan of the substrate is analyzed with signal processing algorithms for image characteristics assessment, including image spatial uniformity and compared to reference image characteristics including image spatial uniformity. An image modification profile may be generated to be applied to a marking system to thereby alter subsequent image data and improve image spatial uniformity of the marking system.
摘要翻译：使用能够确定作为位置的函数的图像反射率和/或发射器的图像测量装置，例如分光光度计，量热计和/或密度计，自动均匀性评估和图像不均匀性修改的方法。这些设备中的一个或多个扫描诸如片材的衬底上的图像，从而生成表示图像特性的数据，例如图像不均匀性。片材可以包含参考/测试图案，其包括一个旨在具有均匀密度的柱，条带或贴片。在扫描基板之后由器件产生的数据用信号处理算法分析，用于图像特征评估，包括图像空间均匀性，并与包括图像空间均匀性的参考图像特性进行比较。可以生成图像修改简档以应用于标记系统，从而改变后续图像数据并提高标记系统的图像空间均匀性。

14. 发明申请

US20080042515A1 Optimized modular electrical machine using permanent magnets 有权
公开(公告)号：US20080042515A1
公开(公告)日：2008-02-21
申请号：US11506636
申请日：2006-08-17
申请人： Paul Butterfield
发明人： Paul Butterfield
IPC分类号： H02K21/12 , H02K1/22
CPC分类号： H02K3/26 , H02K1/2793 , H02K3/28 , H02K3/47 , H02K5/20 , H02K5/225 , H02K11/048 , H02K11/33 , H02K13/08 , H02K21/24
摘要： An electrical machine having a magnet assembly with a magnet carrier ring with an even number of permanent magnets mounted in the carrier ring around a circular locus, and a conductor assembly with one or more conductor circuits wound in a double helix wave winding around a flat conductor support ring with the conductor circuits having uniformly curved conductor segments of involute or arcuate configuration wherein the magnet assembly and conductor assembly are contained in a housing with the magnet assembly rotating relative to the conductor assembly.

15. 发明申请

US20070227901A1 Temperature control for ECMP process 审中-公开
标题翻译： ECMP工艺温度控制
公开(公告)号：US20070227901A1
公开(公告)日：2007-10-04
申请号：US11394003
申请日：2006-03-30
申请人： Yongqi Hu , Paul Butterfield , Junzi Zhao , Stan Tsai , Feng Liu
发明人： Yongqi Hu , Paul Butterfield , Junzi Zhao , Stan Tsai , Feng Liu
IPC分类号： B23H9/00 , C25D17/00
CPC分类号： B23H5/08 , B24B37/015 , B24B37/046 , B24B37/12 , B24B49/14 , C25D7/00
摘要： A method and apparatus for temperature control of an ECMP process is provided. In one embodiment, an apparatus for polishing a substrate is provided. The apparatus includes a platen assembly having a support surface, the platen assembly disposed on a stationary base so that the platen assembly may rotate relative to the base. The apparatus further includes a pad assembly disposed on the support surface of the platen assembly and including an electrode electrically coupled to a power source and an abrasive pad electrically coupled to the power source. The apparatus further includes a control system for heating or cooling the pad assembly.
摘要翻译：提供了一种用于ECMP过程的温度控制的方法和装置。在一个实施例中，提供了一种用于抛光衬底的装置。该设备包括具有支撑表面的压板组件，压板组件设置在固定的基座上，使得压板组件可相对于底座旋转。该装置还包括设置在压板组件的支撑表面上并包括电耦合到电源的电极和电耦合到电源的研磨垫的焊盘组件。该装置还包括用于加热或冷却垫组件的控制系统。

16. 发明申请

US20060231414A1 CONTACTS FOR ELECTROCHEMICAL PROCESSING 失效
标题翻译：电化学处理联系
公开(公告)号：US20060231414A1
公开(公告)日：2006-10-19
申请号：US11424170
申请日：2006-06-14
申请人： Paul Butterfield , Liang-Yuh Chen , Yongqi Hu , Antoine Manens , Rashid Mavliev , Stan Tsai
发明人： Paul Butterfield , Liang-Yuh Chen , Yongqi Hu , Antoine Manens , Rashid Mavliev , Stan Tsai
IPC分类号： B23H5/06
CPC分类号： H01L21/32125 , B23H5/08 , B24B37/046 , B24B37/24 , B24B53/017
摘要： Systems and methods for electrochemically processing a substrate. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact element is a rotating member. In one embodiment, the contact element comprises a noble metal.
摘要翻译：用于电化学处理衬底的系统和方法。接触元件限定在处理期间可定位成接触衬底的衬底接触表面。在一个实施例中，接触元件包括线元件。在另一个实施例中，接触元件是旋转构件。在一个实施例中，接触元件包括贵金属。

17. 发明申请

US20060070872A1 Pad design for electrochemical mechanical polishing 审中-公开
标题翻译：垫片设计用于电化学机械抛光
公开(公告)号：US20060070872A1
公开(公告)日：2006-04-06
申请号：US11241821
申请日：2005-09-30
申请人： Rashid Mavliev , Paul Butterfield , Raplh Wadensweiler
发明人： Rashid Mavliev , Paul Butterfield , Raplh Wadensweiler
IPC分类号： C25D17/00
CPC分类号： B24B37/22 , B23H5/08 , C25F7/00 , H01L21/32125
摘要： A method and apparatus for processing a substrate by electrochemical mechanical planarization and electrochemical mechanical plating is disclosed. Included are various embodiments of a processing pad article comprising an open cell foam subpad that is adapted to retain an electrolyte while encountering centrifugal motion, and simultaneously provide electrical and/or abrasive contact to a feature side of a substrate. Also disclosed is a platen capable of holding an electrolyte during processing at a desired RPM, then releasing the electrolyte centrifugally at a higher RPM. The release is actuated by an operator or by centrifugal force.
摘要翻译：公开了一种通过电化学机械平面化和电化学机械电镀处理衬底的方法和装置。包括处理垫制品的各种实施例，其包括开孔泡沫子垫，其适于在遇到离心运动时保持电解质，并且同时向衬底的特征侧提供电和/或研磨接触。还公开了一种压板，其能够在所需RPM的加工期间保持电解质，然后以更高的RPM离心地释放电解质。释放由操作者或离心力致动。

18. 发明申请

US20050284770A1 Conductive polishing article for electrochemical mechanical polishing 有权
标题翻译：电化学机械抛光用导电抛光制品
公开(公告)号：US20050284770A1
公开(公告)日：2005-12-29
申请号：US11215254
申请日：2005-08-30
申请人： Paul Butterfield , Liang-Yuh Chen , Yonqi Hu , Antoine Manens , Rashid Mavliev , Stan Tsai , Feng Liu , Ralph Wadensweiler , Lizhong Sun , Siew Neo , Alain Duboust
发明人： Paul Butterfield , Liang-Yuh Chen , Yonqi Hu , Antoine Manens , Rashid Mavliev , Stan Tsai , Feng Liu , Ralph Wadensweiler , Lizhong Sun , Siew Neo , Alain Duboust
IPC分类号： B23H5/00 , B23H5/06 , B23H5/08 , B23H5/10 , B24B37/04 , B24B49/16 , B24B53/007 , B24D13/14 , C25D17/00 , C25D17/10 , H01L21/321
CPC分类号： B23H5/06 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/11 , B24B37/22 , B24B37/24 , B24B37/26 , B24B49/16 , B24B53/017 , C25D17/10 , H01L21/32125
摘要： Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes a ring-shaped upper layer having a polishing surface, and a conductive layer coupled to the upper layer and forming a replaceable assembly therewith.
摘要翻译：提供了用于研磨衬底的抛光制品的实施例。在一个实施例中，抛光制品包括具有抛光表面的环形上层，以及耦合到上层并与其形成可更换组件的导电层。

19. 发明申请

US20050133363A1 Conductive polishing article for electrochemical mechanical polishing 失效
标题翻译：电化学机械抛光用导电抛光制品
公开(公告)号：US20050133363A1
公开(公告)日：2005-06-23
申请号：US11031545
申请日：2005-01-08
申请人： Yongqi Hu , Yan Wang , Alain Duboust , Feng Liu , Antoine Manens , Siew Neo , Stan Tsai , Liang-Yuh Chen , Paul Butterfield , Yuan Tian , Sen-Hou Ko
发明人： Yongqi Hu , Yan Wang , Alain Duboust , Feng Liu , Antoine Manens , Siew Neo , Stan Tsai , Liang-Yuh Chen , Paul Butterfield , Yuan Tian , Sen-Hou Ko
IPC分类号： B23H5/08 , B23H5/10 , B24B37/04 , B24B53/007 , B24D13/14 , H01L21/321 , C25D17/00
CPC分类号： B82Y30/00 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/14 , B24B37/16 , B24B37/205 , B24B37/22 , B24B37/24 , B24B37/26 , B24B53/017 , H01L21/32125 , Y10T428/249924
摘要： Embodiments of a polishing article for processing a substrate are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or non-woven. The conductive layer may be comprised of a soft metal and, in one embodiment, the exposed surface may be planar.
摘要翻译：提供了用于处理基板的抛光制品的实施例。在一个实施例中，用于处理衬底的抛光制品包括其上设置有导电层的织物层。导电层具有适于抛光衬底的暴露表面。织物层可以是编织的或非织造的。导电层可以由软金属构成，并且在一个实施例中，暴露的表面可以是平面的。

20. 发明申请

US20050000801A1 Method and apparatus for electrochemical mechanical processing 失效
标题翻译：电化学机械加工的方法和装置
公开(公告)号：US20050000801A1
公开(公告)日：2005-01-06
申请号：US10880752
申请日：2004-06-30
申请人： Yan Wang , Siew Neo , Feng Liu , Stan Tsai , Yongqi Hu , Alain Duboust , Antoine Manens , Ralph Wadensweiler , Rashid Mavliev , Liang-Yuh Chen , Donald Olgado , Paul Butterfield , Ming-Kuei Tseng , Shou-Sung Chang , Lizhong Sun
发明人： Yan Wang , Siew Neo , Feng Liu , Stan Tsai , Yongqi Hu , Alain Duboust , Antoine Manens , Ralph Wadensweiler , Rashid Mavliev , Liang-Yuh Chen , Donald Olgado , Paul Butterfield , Ming-Kuei Tseng , Shou-Sung Chang , Lizhong Sun
IPC分类号： B23H5/06 , B23H5/08 , B23H5/10 , B24B37/04 , B24B49/16 , B24B53/007 , B24D13/14 , H01L21/321 , C25D17/00
CPC分类号： B23H5/06 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/16 , B24B49/16 , B24B53/017 , H01L21/32125
摘要： Embodiments of the invention generally provide a method and apparatus for processing a substrate in an electrochemical mechanical planarizing system. In one embodiment, a cell for polishing a substrate includes a processing pad disposed on a top surface of a platen assembly. A plurality of conductive elements are arranged in a spaced-apart relation across the upper planarizing surface and adapted to bias the substrate relative to an electrode disposed between the pad and the platen assembly. A plurality of passages are formed through the platen assembly between the top surface and a plenum defined within the platen assembly. In another embodiment, a system is provided having a bulk processing cell and a residual processing cell. The residual processing cell includes a biased conductive planarizing surface. In further embodiments, the conductive element is protected from attack by process chemistries.
摘要翻译：本发明的实施方案通常提供用于在电化学机械平面化系统中处理基底的方法和装置。在一个实施例中，用于抛光衬底的单元包括设置在压板组件的顶表面上的处理衬垫。多个导电元件跨过上平坦化表面以间隔的关系布置，并且适于相对于设置在垫和压板组件之间的电极偏压衬底。多个通道通过压板组件形成在顶表面和限定在压板组件内的气室之间。在另一个实施例中，提供了具有批处理单元和残余处理单元的系统。残余处理单元包括偏置的导电平面化表面。在另外的实施方案中，保护导电元件免受过程化学物质的侵蚀。

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