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11. 发明申请

US20080004359A1 Organic-Solvent Dispersion of Fine Polysilsesquioxane Particle, Process for Producing the Same, Aqueous Dispersion Polysilsesquioxane Particle, and Process 有权
标题翻译：细聚倍半硅氧烷颗粒的有机溶剂分散体，其制备方法，水分散体倍半硅氧烷颗粒和方法
公开(公告)号：US20080004359A1
公开(公告)日：2008-01-03
申请号：US11794177
申请日：2005-12-27
申请人： Chenghuan Ma , Masamichi Yamamoto , Fumio Oi
发明人： Chenghuan Ma , Masamichi Yamamoto , Fumio Oi
IPC分类号： C08J3/09
CPC分类号： C08J3/09 , C08J2383/04
摘要： An organic-solvent dispersion containing fine polysilsesquioxane particles stably dispersed therein, which is obtained by adjusting the pH of an aqueous dispersion of fine polysilsesquioxane particles to 2 to 9, subsequently adding an organic solvent thereto, and then removing the water from the system; and an aqueous dispersion of fine polysilsesquioxane particles having an appropriate average particle diameter, which is obtained by adjusting the amount of a base catalyst to be used so as to be in a specific range. The process for producing an aqueous dispersion of fine polysilsesquioxane particles having a pH of 2 to 9 with an organic solvent. The process for producing an aqueous dispersion of fine polysilsesquioxane particles having an average particle diameter of 1 to 40 nm comprises mixing a dispersion stabilizer, a base catalyst, and trialkoxysilane in the presence of an aqueous solvent to produce an aqueous dispersion of fine polysilsesquioxane particles, and is characterized in that the base catalyst is used in an amount of 4 to 45 mmol/L per total amount of the aqueous solvent.
摘要翻译：通过将细聚倍半硅氧烷颗粒的水性分散体的pH调节至2〜9，然后向其中加入有机溶剂，然后从体系中除去水而获得的包含稳定分散在其中的细聚倍半硅氧烷颗粒的有机溶剂分散体。以及通过将所使用的碱催化剂的量调整到特定范围而得到的具有适当的平均粒径的细聚倍半硅氧烷颗粒的水分散体。用有机溶剂制备pH为2〜9的细聚倍半硅氧烷颗粒的水分散体的方法。制备平均粒径为1〜40nm的细聚倍半硅氧烷颗粒的水性分散体的方法包括在水性溶剂的存在下混合分散稳定剂，碱催化剂和三烷氧基硅烷，以制备细聚倍半硅氧烷颗粒的水性分散体，其特征在于，所述碱催化剂的用量为每水溶剂总量为4〜45mmol / L。

12. 发明授权

US06965054B2 Process for producing mixture of dihydroxydiphenylsulfone isomers 失效
标题翻译：制备二羟基二苯砜异构体混合物的方法
公开(公告)号：US06965054B2
公开(公告)日：2005-11-15
申请号：US10490819
申请日：2002-09-26
申请人： Fumio Oi , Norio Yanase , Masamichi Yamamoto
发明人： Fumio Oi , Norio Yanase , Masamichi Yamamoto
IPC分类号： C07C315/04 , C07C317/22 , C07C317/33
CPC分类号： C07C315/04 , C07C317/22
摘要： The present invention provides a process for producing a mixture of dihydroxydiphenylsulfone isomers containing 2,4′-dihydroxydiphenylsulfone, the process comprising heating 4,4′-dihydroxydiphenylsulfone or a mixture of dihydroxydiphenylsulfone isomers containing at least 85 wt. % of 4,4′-dihydroxydiphenylsulfone in the presence of phenol and sulfuric or sulfonic acid.
摘要翻译：本发明提供一种生产含有2,4'-二羟基二苯砜的二羟基二苯砜异构体混合物的方法，该方法包括加热4,4'-二羟基二苯基砜或含有至少85重量％的二羟基二苯砜异构体的混合物。％的4,4'-二羟基二苯砜在苯酚和硫酸或磺酸存在下进行。

13. 发明申请

US20050106382A1 Anisotropic conductive film and method for producing the same 有权
标题翻译：各向异性导电膜及其制造方法
公开(公告)号：US20050106382A1
公开(公告)日：2005-05-19
申请号：US10506425
申请日：2003-03-03
申请人： Hideaki Kashihara , Masamichi Yamamoto , Jun Yorita , Hideaki Toshioka , Misako Osoegawa , Keiji Koyama , Masatoshi Majima , Yoshie Tani
发明人： Hideaki Kashihara , Masamichi Yamamoto , Jun Yorita , Hideaki Toshioka , Misako Osoegawa , Keiji Koyama , Masatoshi Majima , Yoshie Tani
IPC分类号： G01R1/067 , G01R1/073 , G01R3/00 , H01R4/04 , H01R43/00 , H05K3/32 , B32B15/04
CPC分类号： H01R4/04 , G01R1/06755 , G01R1/073 , G01R3/00 , H01R43/007 , Y10T428/25 , Y10T428/258 , Y10T428/31678
摘要： An anisotropic conductive film, and its production method, especially suitable for mounting a semiconductor package and sufficiently satisfying the requirements of higher density mounting because short circuit does not occur in the plane direction of the film even if the pitch of electrodes is small, or suitable for mounting a contact probe because conductive connection not fused with a high current can be ensured with a lower pressure and even a high frequency signal can be dealt with. The anisotropic conductive film contains metal powder having such a shape that many fine metal particles are linked as a conductive component, wherein the length of the chain of metal powder is set not longer than the distance between adjacent electrodes being bonded conductively when a semiconductor package is mounted, and the diameter of the chain is set in the range of 1 μm-20 μm when a contact probe is mounted. At least a part of the film is formed while orienting a chain formed of a paramagnetic metal with a magnetic field.
摘要翻译：各向异性导电膜及其制造方法，特别适用于安装半导体封装，并且充分满足更高密度安装的要求，因为即使电极的间距小或适当，也不会在膜的平面方向上发生短路为了安装接触式探头，因为能够以更低的压力确保导电连接不会与高电流并联，甚至可以处理高频信号。各向异性导电膜含有金属粉末，其具有许多细金属颗粒作为导电组分连接的形状，其中金属粉末链的长度设定为不超过当半导体封装为半导体封装时导电地接合的相邻电极之间的距离当安装接触探针时，链条的直径设定在1mum-20mum的范围内。在由具有磁场的顺磁金属形成的链定向的同时形成膜的至少一部分。

14. 发明授权

US5050541A Boiler equipped with water tubes 失效
标题翻译：锅炉配有水管
公开(公告)号：US5050541A
公开(公告)日：1991-09-24
申请号：US595370
申请日：1990-10-09
申请人： Hiroshi Kobayashi , Yoshiharu Ueda , Keiryo Tou , Masamichi Yamamoto
发明人： Hiroshi Kobayashi , Yoshiharu Ueda , Keiryo Tou , Masamichi Yamamoto
IPC分类号： F22B37/10 , F22B1/18
CPC分类号： F22B1/1869 , Y10S165/91
摘要： In flue and water tube boilers provided with water tubes arranged in a combustion reaction zone or a convective heating zone, the values of L/D or H/D satisfy the following relationships:1.8.ltoreq.L/D.ltoreq.2.5 and1.2.ltoreq.H/D.ltoreq.1.7and the water tubes are disposed in an (aligned) in-line arrangement. L(mm) is the longitudinal pitch of the water tubes taken in the direction of gas flow, D(mm) is the outer diameter of the water tubes and H(mm) is the transverse pitch of the water tubes taken at right angles to the direction of gas flow.
摘要翻译：在布置在燃烧反应区或对流加热区中的水管的烟道和水管锅炉中，L / D或H / D的值满足以下关系：1.8

15. 发明授权

US08766437B2 Electrode structure, wiring body, adhesive connection structure, electronic device, and method for fabricating same 有权
标题翻译：电极结构，布线体，粘合剂连接结构，电子器件及其制造方法
公开(公告)号：US08766437B2
公开(公告)日：2014-07-01
申请号：US13060845
申请日：2010-04-13
申请人： Masamichi Yamamoto , Kyouichirou Nakatsugi , Takashi Yamaguchi , Shigeki Kawakami , Michihiro Kimura
发明人： Masamichi Yamamoto , Kyouichirou Nakatsugi , Takashi Yamaguchi , Shigeki Kawakami , Michihiro Kimura
IPC分类号： H01L23/48
CPC分类号： H05K3/282 , H01L2924/0002 , H05K1/148 , H05K3/305 , H05K3/323 , H05K3/361 , H05K3/363 , H05K2201/0248 , H05K2201/0373 , H05K2201/083 , H05K2201/10977 , H05K2203/104 , Y10T29/49213 , H01L2924/00
摘要： There is provided an electrode structure to be electrically connected to a connection conductor by being bonded thereto with an anisotropic conductive adhesive mainly composed of a thermosetting resin, the electrode structure including an electrode for connection using an adhesive, the electrode being arranged on a base material, and an organic film serving as an oxidation preventing film configured to cover a surface of the electrode for connection using an adhesive, in which the organic film has a higher decomposition temperature than the maximum temperature of heat treatment to be performed. A wiring body and a connecting structure using an adhesive are also provided.
摘要翻译：提供了一种电极结构，其通过用主要由热固性树脂构成的各向异性导电粘合剂与连接导体电连接，该电极结构包括使用粘合剂连接的电极，该电极设置在基材上以及作为氧化防止膜的有机膜，其被配置为使用粘合剂覆盖用于连接的电极的表面，其中有机膜具有比要进行的热处理的最高温度更高的分解温度。还提供了布线体和使用粘合剂的连接结构。

16. 发明申请

US20120314985A1 GREASE COMPOSITION FOR HUB UNIT BEARING EMPLOYING AN ANGULAR CONTACT BALL BEARING AND HUB UNIT BEARING 有权
标题翻译：用于集装单元的润滑脂组合件采用角接触球轴承和集线器轴承
公开(公告)号：US20120314985A1
公开(公告)日：2012-12-13
申请号：US13580217
申请日：2011-02-28
申请人： Osamu Saita , Takashi Azuma , Masamichi Yamamoto
发明人： Osamu Saita , Takashi Azuma , Masamichi Yamamoto
IPC分类号： C10M169/06 , F16C33/66 , F16C19/14
CPC分类号： F16C33/6633 , C10M169/06 , C10M2207/1236 , C10M2207/1245 , C10M2215/1026 , C10M2219/044 , C10M2219/068 , C10M2223/045 , C10N2210/01 , C10N2230/02 , C10N2230/06 , C10N2230/72 , C10N2240/02 , C10N2250/10 , C10N2210/02 , C10N2210/06
摘要： The invention provides a grease composition for a hub unit bearing employing an angular contact ball bearing, containing (a) as a thickener a mixture of diurea compounds represented by formula (I): R1—NHCONH—R2—NHCONH—R1, formula (II): R1—NHCONH—R2—NHCONH—R3, and formula (III): R3—NHCONH—R2—NHCONH—R3 wherein R1 is cyclohexyl group, R2 is a divalent aromatic hydrocarbon group having 6 to 15 carbon atoms, R3 is a straight-chain or branched alkyl group having 12 to 20 carbon atoms, and (R1/(R1+R3))×100=85 to 95 mol %; (b) a base oil; (c) a molybdenum dialkyldithiocarbamate; and (d) a calcium sulfonate. The grease composition of the invention, when used in the hub unit bearing, shows minimum leakage, excellent anti-flaking properties and satisfactory bearing lubrication life.
摘要翻译：本发明提供一种用于使用角接触球轴承的轮毂单元轴承的润滑脂组合物，其包含（a）作为增稠剂的由式（I）表示的二脲化合物的混合物：R1-NHCONH-R2-NHCONH-R1，式（II ）：R1-NHCONH-R2-NHCONH-R3和式（III）：R3-NHCONH-R2-NHCONH-R3其中R1是环己基，R2是碳原子数6〜15的二价芳香族烃基，R3是具有12〜20个碳原子的直链或支链烷基，（R1 /（R1 + R3））×100 = 85〜95摩尔％（b）基础油; （c）二烷基二硫代氨基甲酸钼; 和（d）磺酸钙。本发明的润滑脂组合物在轮毂单元轴承中使用时，显示出最小的泄漏，优异的抗剥落性能和令人满意的轴承润滑寿命。

17. 发明申请

US20120300426A1 CONNECTION STRUCTURE OF PRINTED CIRCUIT BOARD, METHOD FOR PRODUCING SAME, AND ANISOTROPIC CONDUCTIVE ADHESIVE 审中-公开
标题翻译：印刷电路板的连接结构，其制造方法和各向异性导电胶
公开(公告)号：US20120300426A1
公开(公告)日：2012-11-29
申请号：US13513434
申请日：2010-09-02
申请人： Masamichi Yamamoto , Kyouichirou Nakatsugi , Kou Noguchi , Tetsuga Shimomura
发明人： Masamichi Yamamoto , Kyouichirou Nakatsugi , Kou Noguchi , Tetsuga Shimomura
IPC分类号： H05K1/14 , H05K3/36
CPC分类号： H01B1/22 , C08K3/08 , C08K7/06 , C09J9/02 , C09J11/04 , H05K1/118 , H05K3/323 , H05K3/361 , H05K2201/0281 , H05K2201/0394
摘要： There are provided a connection structure of printed circuit boards, and so forth, the connection structure including a first printed circuit board, a second printed circuit board located above the first printed circuit board, and an anisotropic conductive adhesive configured to establish a conductive connection between a conductor of the first printed circuit board and a conductor of the second printed circuit board, in which the anisotropic conductive adhesive contains a conductive filler, and in which the conductive filler is formed of crystallized metal-particle wires produced by allowing metal particles to crystallize and grow linearly. It is thus possible to easily achieve sufficiently high connection strength while a flying lead of one printed circuit board is electrically connected to a conductive lead (substrate pad) of the other printed circuit board.
摘要翻译：提供了印刷电路板的连接结构等等，连接结构包括第一印刷电路板，位于第一印刷电路板上方的第二印刷电路板和各向异性导电粘合剂，其被配置为在第一印刷电路板之间建立导电连接第一印刷电路板的导体和第二印刷电路板的导体，其中各向异性导电粘合剂包含导电填料，并且其中导电填料由通过使金属颗粒结晶而产生的结晶金属 - 微粒线形成并线性增长。因此，可以容易地实现足够高的连接强度，同时将一个印刷电路板的引线电连接到另一个印刷电路板的导电引线（基板焊盘）。

18. 发明授权

US08133412B2 Anisotropic conductive film 失效
标题翻译：各向异性导电膜
公开(公告)号：US08133412B2
公开(公告)日：2012-03-13
申请号：US12918731
申请日：2009-09-18
申请人： Masamichi Yamamoto , Yasuhiro Okuda
发明人： Masamichi Yamamoto , Yasuhiro Okuda
IPC分类号： H01B1/00 , B32B7/12 , C08L29/04
CPC分类号： H05K3/323 , C08G2650/56 , C08L29/14 , C08L71/00 , C09J163/00 , H01B1/22 , H05K3/361 , Y10T428/2857 , C08L2666/04
摘要： An anisotropic conductive film 2 contains electrically conductive particles 6 dispersed in an adhesive agent 30 for electrode connection, the adhesive agent containing an epoxy resin, which is an insulating thermosetting resin, as a main component, a phenoxy resin having a molecular weight of 30,000 or more, a latent hardener, a polyvinyl butyral resin having a glass-transition temperature of 100° C. or higher, and a polyvinyl butyral resin having a glass-transition temperature of 90° C. or lower. There is provided the high-heat-resistant anisotropic conductive film which suppresses a reduction in repairability and which can be used for electrodes having a finer pitch, i.e., having a minimum pitch of 150 μm or less, when electrodes are connected with the anisotropic conductive film.
摘要翻译：各向异性导电膜2包含分散在用于电极连接的粘合剂30中的导电颗粒6，包含作为主要成分的绝缘热固性树脂的环氧树脂的粘合剂，分子量为30,000的苯氧基树脂或更具体地说，可以使用玻璃化转变温度为100℃以上的潜在硬化剂，聚乙烯醇缩丁醛树脂和玻璃化转变温度为90℃以下的聚乙烯醇缩丁醛树脂。提供了抑制可修复性降低的高耐热各向异性导电膜，并且当电极与各向异性导电体连接时，可以用于具有更细间距的电极，即具有150μm或更小的最小间距的电极电影。

19. 发明申请

US20110250395A1 ELECTRODE CONNECTION STRUCTURE, CONDUCTIVE ADHESIVE USED THEREFOR, AND ELECTRONIC DEVICE 有权
标题翻译：电极连接结构，其使用的导电粘合剂和电子设备
公开(公告)号：US20110250395A1
公开(公告)日：2011-10-13
申请号：US13139926
申请日：2010-06-04
申请人： Masamichi Yamamoto , Kyouichirou Nakatsugi , Yasuhiro Okuda
发明人： Masamichi Yamamoto , Kyouichirou Nakatsugi , Yasuhiro Okuda
IPC分类号： C09J7/00 , B32B15/02 , H01B1/22 , B32B5/16
CPC分类号： H05K3/323 , H01L24/16 , H01L24/81 , H01L25/0655 , H01L2224/16225 , H01L2224/16227 , H01L2224/81815 , H01L2924/00014 , H01L2924/12044 , H01L2924/14 , H05K3/361 , H05K2201/023 , H05K2203/104 , Y10T428/24372 , Y10T428/24413 , Y10T428/249921 , Y10T428/25 , Y10T428/268 , H01L2924/00 , H01L2224/0401
摘要： There is provided a connecting structure with high reliability produced at low cost through the production process simplified by connecting connection electrodes, each including an organic film as an oxidation preventing film, to each other using a conductive adhesive. An electrode-connecting structure in which a first connection electrode 2 and a second connection electrode 10 are connected to each other with a conductive adhesive layer 9 therebetween includes organic films 6 and 11 formed on at least the first connection electrode and conductive particles 8 contained so that major axes of the particles are oriented in a thickness direction of the conductive adhesive layer and the average length of the major axes is larger than the total thickness of at least the organic films and the conductive adhesive layer, wherein the conductive particles pierce the organic films and contact the first connection electrode and the second connection electrode.
摘要翻译：通过使用导电性粘合剂将各自包括作为防氧化膜的有机膜彼此连接的连接电极简化为生产工艺，提供了以低成本生产的高可靠性产生的高可靠性的连接结构。其中第一连接电极2和第二连接电极10之间的导电粘合剂层9彼此连接的电极连接结构包括形成在至少第一连接电极上的有机膜6和11以及包含的导电颗粒8 颗粒的长轴在导电粘合剂层的厚度方向上定向，并且长轴的平均长度大于至少有机膜和导电粘合剂层的总厚度，其中导电颗粒刺穿有机物并与第一连接电极和第二连接电极接触。

20. 发明申请

US20090175019A1 CIRCUIT-BOARD MODULE AND MANUFACTURING METHOD 审中-公开
标题翻译：电路板模块和制造方法
公开(公告)号：US20090175019A1
公开(公告)日：2009-07-09
申请号：US12299561
申请日：2008-02-08
申请人： Keiji Koyama , Masamichi Yamamoto , Katsunari Mikage , Jin-Joo Park
发明人： Keiji Koyama , Masamichi Yamamoto , Katsunari Mikage , Jin-Joo Park
IPC分类号： H05K1/14 , H01L21/98
CPC分类号： H05K3/323 , H01L2224/2929 , H01L2224/293 , H01L2224/83101 , H01L2224/83851 , H01L2924/07811 , H05K1/147 , H05K1/181 , H05K3/361 , H05K2201/0248 , H05K2201/10378 , H05K2203/1572 , H01L2924/00
摘要： [Problem]To enable mounting a part on the rear surface at the back of a connection part on a PCB to be connected with a FPC.[Means for Solving the Problem]Connection parts are provided such that a conductor wiring of a first circuit board and a conductor wiring of a second circuit board are connected with an anisotropic conductive adhesive which is made of an insulative resin including needle-shaped or linear chain-shaped metal powders oriented in a thickness direction, i.e., adhesion direction, and a part is mounted on at least either one of the first and the second circuit boards, the part being mounted on the rear surface at the back opposed to the surface where the connection part is formed.
摘要翻译： [问题]能够将要连接到FPC的PCB上的连接部分的背面的部件安装在背面。 [解决问题的方法]连接部件设置成使得第一电路板的导体布线和第二电路板的导体布线与各向异性导电粘合剂连接，所述各向异性导电粘合剂由包括针状或线性的绝缘树脂制成在厚度方向上取向的链状金属粉末，即粘附方向，一部分安装在第一和第二电路板中的至少一个中，该部分安装在与表面相对的背面的背面上其中连接部分形成。

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