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11. 发明授权

US07358535B2 Photo-coupler semiconductor device and production method therefor 有权
标题翻译：光耦合器半导体器件及其制造方法
公开(公告)号：US07358535B2
公开(公告)日：2008-04-15
申请号：US10747403
申请日：2003-12-30
申请人： Hiroyuki Shoji , Hideya Takakura , Kazuo Kusuda
发明人： Hiroyuki Shoji , Hideya Takakura , Kazuo Kusuda
IPC分类号： H01L21/00
CPC分类号： H01L25/167 , H01L31/16 , H01L2224/32013 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A photo-coupler semiconductor device includes first and second planar lead frames each having a main portion and a distal portion, a light emitting element and a light receiving element respectively mounted on upper surfaces of the distal portions of the first and second lead frames, a light-transmitting resin member which covers the light emitting element and the light receiving element, and supports the distal portions of the first and second lead frames in spaced opposed relation with the light emitting element and the light receiving element being mounted on the upper surfaces of the distal portions so that the main portions of the first and second lead frames are located in coplanar relation, and a opaque resin member which covers the light-transmitting resin member, and supports the main portions of the first and second lead frames. The light-transmitting resin member and the opaque resin member are each composed of an epoxy resin as a base resin.
摘要翻译：光耦合器半导体器件包括分别安装在第一和第二引线框架的远端部分的上表面上的主要部分和远端部分的第一和第二平面引线框架，发光元件和光接收元件，覆盖发光元件和受光元件的透光树脂构件，并且以与发光元件和受光元件隔开的相对关系的方式支撑第一引线框架和第二引线框架的远端部分，其安装在所述远端部分使得所述第一引线框架和所述第二引线框架的主要部分位于共面关系处，以及不透明树脂构件，其覆盖所述透光树脂构件，并且支撑所述第一引线框架和所述第二引线框架的主要部分。透光树脂构件和不透明树脂构件各自由作为基础树脂的环氧树脂构成。

12. 发明申请

US20070181903A1 Semiconductor device manufacturing method and semiconductor device manufacturing apparatus 审中-公开
标题翻译：半导体器件制造方法和半导体器件制造装置
公开(公告)号：US20070181903A1
公开(公告)日：2007-08-09
申请号：US11703679
申请日：2007-02-08
申请人： Hideya Takakura
发明人： Hideya Takakura
IPC分类号： H01L33/00 , H01L29/24
CPC分类号： B29C39/10 , B29C39/24 , B29C45/02 , B29C45/14639 , H01L33/52 , H01L33/54 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/01078 , H01L2924/01079 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor device manufacturing method includes the steps of filling a cavity and a resin reservoir hole in a lower metal mold with a liquid-state resin, holding a semiconductor element between the lower metal mold and an upper metal mold, injecting the resin in the resin reservoir hole into the cavity to seal the semiconductor device with the resin. Thus, the semiconductor device having almost no voids and less material loss is manufactured with high accuracy.
摘要翻译：半导体器件制造方法包括以下步骤：在具有液态树脂的下金属模具中填充空腔和树脂储存器孔，将半导体元件保持在下金属模和上金属模之间，将树脂注入树脂储存孔进入空腔，用树脂密封半导体器件。因此，以高精度制造几乎没有空隙和较少材料损失的半导体器件。

13. 发明授权

US06853057B2 Lead frame for a plastic encapsulated semiconductor device 失效
标题翻译：塑料封装半导体器件的引线框架
公开(公告)号：US06853057B2
公开(公告)日：2005-02-08
申请号：US10340644
申请日：2003-01-13
申请人： Yoshiki Yasuda , Hideya Takakura
发明人： Yoshiki Yasuda , Hideya Takakura
IPC分类号： H01L23/48 , H01L21/56 , H01L23/495 , H01L23/50 , H01L31/167
CPC分类号： H01L21/565 , H01L23/49541 , H01L24/48 , H01L31/167 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/85399 , H01L2224/8592 , H01L2924/00014 , H01L2924/181 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： In a lead frame which has second tie bars in the vicinity of plastic packages first notches are formed along first edges of the second tie bars (in areas defined on both sides of the inner leads and to come into contact with a punch during the tie bar cutting step). The first notches prevent troubles associated with close arrangement of the second tie bars and the plastic packages. In addition, second notches are provided along second edges of the second tie bars. These second notches are designed to receive the tips of outer leads which extend from neighboring plastic packages of the lead frames.
摘要翻译：在塑料包装附近具有第二连接杆的引线框架中，第一切口沿着第二连接条的第一边缘（在内引线的两侧限定的区域中）形成，并且在连接条中与冲头接触切割步骤）。第一个缺口防止与第二连接条和塑料包装的紧密布置相关联的麻烦。另外，沿着第二连接条的第二边缘提供第二切口。这些第二凹口被设计成接收从引线框的相邻塑料封装延伸的外部引线的尖端。

14. 发明申请

US20130120242A1 OPTICAL POINTING DEVICE AND ELECTRONIC DEVICE INCLUDING SAME 审中-公开
标题翻译：光学指示装置和包括它们的电子装置
公开(公告)号：US20130120242A1
公开(公告)日：2013-05-16
申请号：US13677372
申请日：2012-11-15
申请人： Hideya TAKAKURA
发明人： Hideya TAKAKURA
IPC分类号： G06F3/03
CPC分类号： G06F3/0304 , G06F3/042
摘要： An optical pointing device is configured so that: an optical unit and a lens unit are integrally molded and form a portion of an optical cover; each of a light transmitting resin layer and the optical cover is made of a resin containing thermosetting resin as a main component; and a light shielding resin layer is made of a resin containing, as a main component, thermosetting resin and/or thermoplastic resin that has heat resistance. Thereby, the present invention provides an optical pointing device whose optical characteristics, reliability and heat resistance are excellent and whose number of component members are reduced.
摘要翻译：光学指示装置被配置为：光学单元和透镜单元被一体地模制并形成光学盖的一部分; 透光性树脂层和光学罩均由含有热固性树脂作为主要成分的树脂制成，并且遮光树脂层由含有作为主要成分的具有耐热性的热固性树脂和/或热塑性树脂的树脂制成。由此，本发明提供光学特性，可靠性，耐热性优异，成分数量减少的光学指向装置。

15. 发明申请

US20110074736A1 OPTICAL POINTING DEVICE AND ELECTRONIC EQUIPMENTS 有权
标题翻译：光点设备和电子设备
公开(公告)号：US20110074736A1
公开(公告)日：2011-03-31
申请号：US12854271
申请日：2010-08-11
申请人： Hideya TAKAKURA
发明人： Hideya TAKAKURA
IPC分类号： G06F3/042
CPC分类号： G06F3/03547 , G06F3/042
摘要： Light emitted from a light source such as LED and reflected by a fingertip is guided by a cover member onto a light receiving surface of an imaging element. A second resin part is provided that is in contact with the cover member and a resin molded part sealing the imaging element. The reflected light guided by the cover member is made to reach the light receiving surface via the second resin part and the resin molded part, traveling along a path spaced apart from an air layer.
摘要翻译：从诸如LED的光源发射并由指尖反射的光由盖构件引导到成像元件的光接收表面上。提供与盖构件接触的第二树脂部件和密封成像元件的树脂模制部件。由盖构件引导的反射光通过第二树脂部分和树脂模制部分沿着与空气层间隔开的路径行进到达光接收表面。

16. 发明授权

US07835607B2 Optical-electrical composite transmission device and electronic equipment 有权
标题翻译：光电复合传输装置及电子设备
公开(公告)号：US07835607B2
公开(公告)日：2010-11-16
申请号：US12349635
申请日：2009-01-07
申请人： Hideya Takakura
发明人： Hideya Takakura
IPC分类号： G02B6/44
CPC分类号： G02B6/4416 , G02B6/43
摘要： An optical-electrical composite cable as an example of an optical-electrical composite transmission device has a flexible board as an electrical signal transmission member having an electric wiring section, and an optical fiber as an optical signal transmission member. The optical fiber is passed through a plurality of holes formed in a resin base section of the flexible board so as to thread through the resin base section. The flexible board and the optical fiber are integrated so as not to be separated from each other, so that even when the characteristics (tensile strength, thermal expansion coefficient) of the transmission lines respectively embodied by the flexible board and the optical fiber are different, the optical-electrical composite cable has stable flexibility as a whole.
摘要翻译：作为光电复合传输装置的实例的光电复合电缆具有作为具有电布线部分的电信号传输部件的柔性板，以及作为光信号传输部件的光纤。光纤穿过形成在柔性板的树脂基部中的多个孔，以便穿过树脂基部。柔性基板和光纤被集成为不会彼此分离，使得即使分别由柔性板和光纤实现的传输线的特性（拉伸强度，热膨胀系数）不同，光电复合电缆整体上具有稳定的柔性。

17. 发明授权

US07234231B2 Method of manufacturing a lead frame 有权
标题翻译：制造引线框架的方法
公开(公告)号：US07234231B2
公开(公告)日：2007-06-26
申请号：US10974910
申请日：2004-10-28
申请人： Hideya Takakura , Kazuo Kusuda , Hiroyuki Shoji
发明人： Hideya Takakura , Kazuo Kusuda , Hiroyuki Shoji
IPC分类号： H01R43/00
CPC分类号： H01L23/49565 , H01L21/4842 , H01L24/45 , H01L24/48 , H01L25/167 , H01L31/12 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/01038 , H01L2924/01078 , H01L2924/01079 , H01L2924/181 , H01L2924/3025 , Y10T29/49117 , Y10T29/49121 , Y10T29/4913 , Y10T29/49144 , Y10T29/5111 , H01L2924/00014 , H01L2924/00012
摘要： A manufacturing method of an optical coupling device includes, preparing an elongated lead frame on which a plurality of tie bars are placed between a pair of side rails that are mutually in parallel with each other so as to orthogonally cross the tie bars, with a plurality of lead terminals being placed in a staggered form in a manner so as to orthogonally cross the tie bars, and laterally cutting the elongated lead frame to prepare a plurality of strap-shaped lead frames, in such a manner that the length of protrusion of a cut end of each of the side rails from each of the tie bars is made longer than the length of protrusion of a lead terminal from each of the tie bars.
摘要翻译：光耦合装置的制造方法包括：准备细长的引线框架，多个连接杆放置在一对侧轨之间，所述多个连接杆彼此平行地彼此平行，以便与多个的引线端子以交错的形式被放置成正交地穿过连接杆，并且横向地切割细长的引线框架以制备多个带状引线框架，使得一个每个连接条的每个侧轨的切割端的长度大于从每个连接条引导端子的突出长度。

18. 发明授权

US06895664B2 Method of making an optical coupling device 失效
标题翻译：制造光耦合装置的方法
公开(公告)号：US06895664B2
公开(公告)日：2005-05-24
申请号：US10270005
申请日：2002-10-15
申请人： Hideya Takakura , Kazuo Kusuda
发明人： Hideya Takakura , Kazuo Kusuda
IPC分类号： H01L23/48 , H01L21/00 , H01L25/16 , H01L31/12 , H01R43/00
CPC分类号： H01L21/67144 , H01L25/167 , H01L2224/45144 , H01L2224/48247 , H01L2924/3025 , Y10T29/49121 , Y10T29/4913 , H01L2924/00014 , H01L2924/00
摘要： A lead frame of an optical coupling device of the present invention is so arranged that (a) a light-emitting side section in which a plurality of header sections for mounting thereon the light-emitting elements are aligned and (b) a light-receiving side section in which a plurality of header sections for mounting thereon the light-receiving element are aligned, and (c) a connecting section for connecting the light-emitting side section and the light-receiving side section in parallel into one body. The light-emitting side section and the light-receiving side section are integrated via a connecting section at which a V groove is formed for facilitating the folding of the lead frame. As a result, it is possible to provide a low-cost lead frame of an optical coupling device with a small number of components can be realized, in a simplified manner, and a manufacturing method of the optical coupling device.
摘要翻译：本发明的光耦合装置的引线框架被配置为：（a）其上安装有发光元件的多个集管部分对准的发光侧部分，（b）光接收部其中多个用于安装在其上的光接收元件的集管部分对准的侧面部分，以及（c）用于将发光侧部分和光接收侧部分平行连接成一体的连接部分。发光侧部分和光接收侧部分通过形成V沟槽的连接部分一体化，以便引导框架的折叠。结果，可以以简单的方式提供具有少量部件的光耦合装置的低成本引线框架和光耦合装置的制造方法。

19. 发明授权

US06507035B1 Photocoupler device, method for fabricating the same, and lead frame for photocoupler device 失效
标题翻译：光耦合装置及其制造方法以及光电耦合器装置的引线框架
公开(公告)号：US06507035B1
公开(公告)日：2003-01-14
申请号：US09482278
申请日：2000-01-13
申请人： Yasushi Hasegawa , Hideya Takakura , Kazuo Kusuda
发明人： Yasushi Hasegawa , Hideya Takakura , Kazuo Kusuda
IPC分类号： G02B2700
CPC分类号： H01L31/167 , H01L25/167 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A photocoupler device includes a light emitting element; a monitor photodetector and an output photodetector for receiving light from the light emitting element; a primary side lead frame for mounting the light emitting element and the monitor photodetector; and a secondary side lead frame for mounting the output photodetector, wherein the light emitting element and the output photodetector are placed so as to face each other.
摘要翻译：光电耦合器件包括发光元件; 监视器光电检测器和用于接收来自发光元件的光的输出光电检测器; 用于安装发光元件和监视器光电检测器的初级侧引线框架; 以及用于安装输出光电检测器的次级侧引线框架，其中发光元件和输出光电检测器被放置成彼此面对。

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