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11. 发明申请

US20070020782A1 Method of monitoring a semiconductor manufacturing trend 有权
标题翻译：监控半导体制造趋势的方法
公开(公告)号：US20070020782A1
公开(公告)日：2007-01-25
申请号：US11443241
申请日：2006-05-30
申请人： Dieter Rathei
发明人： Dieter Rathei
IPC分类号： H01L21/66
CPC分类号： H01L22/20 , G05B23/0232
摘要： A method of monitoring trends in semiconductor processes is provided. Lot values are assigned to each of a set of wafer lots prior to performing semiconductor processes. After at least some of the semiconductor processes, at least some of the wafer lots are tested to generate a set of test data. A degree of scrambling is calculated for the set of wafer lots already tested using the test data: calculating a current scrambling value by subtracting the lot value of a current wafer lot from a maximum lot value of the lot values assigned for the set of wafer lots to yield the current scrambling value; storing the current scrambling value into a set of scrambling values; and determining a current adjusted maximum scrambling value by multiplying a selected multiplier value with a current maximum scrambling value of the set of scrambling values for a selected number of wafer lots.
摘要翻译：提供了一种监测半导体工艺趋势的方法。在执行半导体处理之前，批次值分配给一组晶片批次中的每一个。在至少一些半导体工艺之后，测试至少一些晶圆批次以产生一组测试数据。针对已经使用测试数据测试的晶片组的集合计算加扰度：通过从为该组晶片批次分配的批次值的最大批次值中减去当前晶片批次的批次值来计算当前加扰值产生当前扰频值; 将当前加扰值存储到一组加扰值中; 以及通过将所选择的乘数值与所选数量的晶片批次的所述一组加扰值的当前最大扰频值相乘来确定当前调整的最大扰频值。

12. 发明申请

US20070016321A1 Method for screening risk quality semiconductor products 审中-公开
标题翻译：筛选风险品质半导体产品的方法
公开(公告)号：US20070016321A1
公开(公告)日：2007-01-18
申请号：US11485477
申请日：2006-07-12
申请人： Dieter Rathei
发明人： Dieter Rathei
IPC分类号： G06F19/00
CPC分类号： G01R31/2894
摘要： Method of forming a quality passing set of semiconductor products. A parameter is tested in a plurality of semiconductor products. A specification passing set of semiconductor products is formed from semiconductor products in the plurality of semiconductor products. The specification passing set of semiconductor products have a parameter value of the parameter within a specification range. An upper and a lower percentile value are calculated. A weighted benchmark step distance is calculated. The calculation of the weighted benchmark step distance includes dividing a bulk distribution range distance by a bulk distribution population size to calculate a benchmark step distance. The weighted benchmark step distance is the product of the benchmark step distance and a step weighting number. A lower bound of the specification passing set of parameter values is screened. An upper bound of the specification passing set of parameter values is also screened.
摘要翻译：形成半导体产品质量通过的方法。在多个半导体产品中测试参数。半导体产品的规格通过集合由多个半导体产品中的半导体产品形成。规格通过的半导体产品集合具有在规格范围内的参数的参数值。计算上下百分比值。计算加权基准步距。加权基准步距的计算包括将体积分布范围距离除以体积分布群体大小以计算基准步距。加权基准步距是基准步距和步加权数的乘积。过滤参数值集合的下限被屏蔽。也屏蔽了规范通过参数值集合的上限。

13. 发明授权

US06963813B1 Method and apparatus for fast automated failure classification for semiconductor wafers 失效
标题翻译：用于半导体晶片快速自动化故障分类的方法和装置
公开(公告)号：US06963813B1
公开(公告)日：2005-11-08
申请号：US09660703
申请日：2000-09-13
申请人： Dieter Rathei , Peter Oswald , Thomas Hladschik , Joerg Wohlfahrt
发明人： Dieter Rathei , Peter Oswald , Thomas Hladschik , Joerg Wohlfahrt
IPC分类号： H01L21/66 , G01N37/00 , G06F19/00
CPC分类号： H01L22/20
摘要： A method for classifying patterns of failcodes on a semiconductor wafer, in accordance with the present invention, includes determining failcodes for chips on the wafer and checking adjacent chips for each chip on the wafer having a failcode to determine a failcode pattern having a defined number of chips.
摘要翻译：根据本发明的用于对半导体晶片上的故障代码的图案进行分类的方法包括：确定晶片上的芯片的失败代码并检查具有故障代码的晶片上的每个芯片的相邻芯片，以确定具有限定数量的故障代码模式筹码

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