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    • 12. 发明申请
    • ESD protection for RF power amplifier circuits
    • RF功率放大器电路的ESD保护
    • US20060050452A1
    • 2006-03-09
    • US10936308
    • 2004-09-08
    • Ismail OguzmanCharvaka DuvvuryChih-Ming Hung
    • Ismail OguzmanCharvaka DuvvuryChih-Ming Hung
    • H02H9/00
    • H01L27/0251H03F1/52H03F2200/294H03F2200/372
    • An electrostatic discharge (ESD) device for protecting a power amplifier circuit is disclosed. The ESD device comprises a first ESD protection circuit coupled between a positive terminal of a supply voltage and a negative terminal of the supply voltage, and a second ESD protection circuit coupled between the negative terminal of the supply voltage and an output terminal of the power amplifier circuit, wherein a first current path is formed from the positive terminal to the output terminal through the first and second ESD protection circuits. A circuit device operative to increase impedance of a second current path from the positive terminal to the output terminal through the power amplifier circuit to divert current from the second current path to the first current path in the course of an ESD event.
    • 公开了一种用于保护功率放大器电路的静电放电(ESD)装置。 ESD器件包括耦合在电源电压的正极端子和电源电压的负极端子之间的第一ESD保护电路和耦合在电源电压的负极端子和功率放大器的输出端子之间的第二ESD保护电路 电路,其中通过所述第一和第二ESD保护电路从所述正极端子到所述输出端子形成第一电流路径。 电路装置,其可操作以通过功率放大器电路增加从正端子到输出端子的第二电流路径的阻抗,以在ESD事件的过程中将电流从第二电流路径转移到第一电流路径。
    • 16. 发明授权
    • Harmonic suppression device
    • 谐波抑制装置
    • US08217735B2
    • 2012-07-10
    • US12603654
    • 2009-10-22
    • Shyue-Dar ChenChih-Ming Hung
    • Shyue-Dar ChenChih-Ming Hung
    • H03H7/00H03F3/213H04B1/04
    • H01P1/20345H03F1/32H03F3/60
    • A harmonic suppression device includes a multilayer printed circuit board (PCB). The multilayer PCB includes a first layer, a second layer, and a third layer. The third layer is connected to the ground. The first layer is configured with a power amplifier, an input microstrip, a voltage divider microstrip, and an output microstrip. The power amplifier is operable to amplify radio frequency (RF) signals input using the input microstrip and to output the amplified RF signals using the output microstrip. The second layer is configured with a first microstrip and a second microstrip. One end of each of the first and second microstrips is connected to an alternative one of the first layer and the third layer by vias, and the other ends of the first and second microstrips are unattached so as to suppress harmonics on the power amplifier.
    • 谐波抑制装置包括多层印刷电路板(PCB)。 多层PCB包括第一层,第二层和第三层。 第三层连接到地面。 第一层配置有功率放大器,输入微带线,分压器微带线和输出微带线。 功率放大器可用于放大使用输入微带输入的射频(RF)信号,并使用输出微带输出放大的RF信号。 第二层配置有第一微带和第二微带。 第一和第二微带中的每一个的一端通过通孔连接到第一层和第三层中的另一个,并且第一和第二微带的另一端未连接,以便抑制功率放大器上的谐波。