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11. 发明专利

JP2012142063A Thin-film magnetic head, method of manufacturing the same, head gimbal assembly, and hard disk drive 有权
标题翻译：薄膜磁头，其制造方法，头部组件和硬盘驱动
公开(公告)号：JP2012142063A
公开(公告)日：2012-07-26
申请号：JP2011157436
申请日：2011-07-19
申请人： Headway Technologies Inc , Sae Magnetics(H K )Ltd , ヘッドウェイテクノロジーズインコーポレイテッド , 新科實業有限公司SAE Magnetics(H.K.)Ltd.
发明人： SASAKI YOSHITAKA , ITO HIROYUKI , SATO KAZUKI , IIJIMA ATSUSHI
IPC分类号： G11B5/31
CPC分类号： G11B5/1278 , G11B5/3123 , G11B5/4853 , Y10T29/49021
摘要： PROBLEM TO BE SOLVED: To reduce the electric resistance of a thin-film coil within a restriction range of the read/write separation without increasing the magnetic path length and suppress protrusion of a part of the ABS.SOLUTION: A thin-film magnetic head 300 is constructed such that a main magnetic pole layer 26, a write shield layer 60, a gap layer 27, a lower thin-film coil 10, and an upper thin-film coil 55 are laminated on a substrate 1. The lower thin-film coil 10 has a first coil layer 11 and a second coil layer 12. The first coil layer 11 has turn parts 11e, 11c. In the first coil layer 11, magnetic pole corresponding parts 11e1, 11c1 corresponding to an arrangement space of the main magnetic pole layer 26 are thinner than magnetic pole non-corresponding parts 11e2, 11c2 other than the magnetic pole corresponding parts.
摘要翻译：要解决的问题：为了在读/写分离的限制范围内减小薄膜线圈的电阻，而不增加磁路长度并抑制ABS的一部分的突出。解决方案：薄膜磁头300被构造成使得主磁极层26，写入屏蔽层60，间隙层27，下部薄膜线圈10和上部薄膜线圈55 层叠在基板1上。下部薄膜线圈10具有第一线圈层11和第二线圈层12.第一线圈层11具有转向部11e，11c。在第一线圈层11中，与主磁极层26的配置空间对应的磁极对应部11e1,11c1比磁极对应部分以外的磁极非对应部11e2,11c2薄。版权所有（C）2012，JPO＆INPIT

12. 发明专利

JP2012133864A Magnetic read head with high resolution 有权
标题翻译：高分辨率磁头读头
公开(公告)号：JP2012133864A
公开(公告)日：2012-07-12
申请号：JP2011272114
申请日：2011-12-13
申请人： Headway Technologies Inc , ヘッドウェイテクノロジーズインコーポレイテッド
发明人： YUCHEN ZHOU , CHEN WENYU , JOE SMITH
IPC分类号： G11B5/39 , H01L43/08
CPC分类号： G11B5/3932 , G01R33/098 , G11B5/3909 , G11B2005/3996 , Y10T29/49044 , Y10T29/49048
摘要： PROBLEM TO BE SOLVED: To provide a CPP type MR read head including a patterned CPP type MR sensor stack having an SAF free layer structure, and a method of manufacturing the same.SOLUTION: In the SAF free layer structure, a bias in a length direction is applied by a combination of an exchange bias layer formed on the sensor stack and a hard bias layer formed adjacently to a patterned side face of the stack. With this combination, high-resolution read performance can be provided without requiring a narrow read gap formed of an upper shield and a lower shield which are close to each other across a slight gap. Disclosed are 16 embodiments in which positions of exchange bias layers and hard bias layers and patterning of CPP type MR sensor stacks are different.
摘要翻译：要解决的问题：提供一种包括具有SAF自由层结构的图案化CPP型MR传感器堆叠的CPP型MR读取头及其制造方法。解决方案：在SAF自由层结构中，通过组合形成在传感器堆叠上的交换偏压层和与堆叠的图案化侧面相邻形成的硬偏压层，施加长度方向的偏压。通过这种组合，可以提供高分辨率读取性能，而不需要通过稍微间隙彼此靠近的上屏蔽和下屏蔽形成的窄读取间隙。公开了16个实施例，其中交换偏压层和硬偏压层的位置以及CPP型MR传感器堆叠的图案化是不同的。版权所有（C）2012，JPO＆INPIT

13. 发明专利

JP2012018752A Heat-assisted magnetic recording head and method for manufacturing plasmon antenna 有权
标题翻译：热辅助磁记录头及制造天线的方法
公开(公告)号：JP2012018752A
公开(公告)日：2012-01-26
申请号：JP2011152352
申请日：2011-07-08
申请人： Headway Technologies Inc , ヘッドウェイテクノロジーズインコーポレイテッド
发明人： YUCHEN ZHOU , TOBIAS MALESKI , KIM UK-HWY , BAEK CHIH-KANG , TAKANO KENICHI , SCHRECK ERHARD
IPC分类号： G11B5/31 , G11B5/02
CPC分类号： G11B5/314 , B82Y20/00 , G02B6/1226 , G11B5/3163 , G11B5/6088 , G11B2005/0021
摘要： PROBLEM TO BE SOLVED: To provide a TAMR head which is suitable for high density recording.SOLUTION: A TAMR head according to the present invention has: a magnetic pole for generating a recording magnetic field to write in a magnetic recording medium when electrified; a radiation source for electromagnetic emission; a plasmon antenna including a magnetic core having a pair of side surfaces and a plasmon generating layer made from conductive material which conformally covers the pair of side surfaces in a cross section parallel to an air bearing surface; and a waveguide path for guiding the electromagnetic emission to the plasmon antenna and combining the electromagnetic emission with a plasmon mode generated in the plasmon antenna. The plasmon generating layer varies in thickness in a direction orthogonal to the air bearing surface, where it is thinnest at a position closest to the air bearing surface and thickest in a region adjacent to the waveguide path.
摘要翻译：要解决的问题：提供适合于高密度记录的TAMR头。解决方案：根据本发明的TAMR头具有：用于在通电时产生记录磁场以写入磁记录介质的磁极; 用于电磁辐射的辐射源; 一种等离子体激元天线，包括具有一对侧表面的磁芯和由平行于空气轴承表面的横截面中共形地覆盖所述一对侧表面的导电材料制成的等离子体发生层; 以及用于将电磁辐射引导到等离子体激元天线并将电磁发射与等离子体激元天线中产生的等离子体激发模式组合的波导路径。等离子体发生层的厚度在与空气轴承表面正交的方向上变化，其中最靠近空气轴承表面的位置处最薄，并且在与波导路径相邻的区域中最厚。版权所有（C）2012，JPO＆INPIT

14. 发明专利

JP2012009807A Layered chip package and method of manufacturing same 有权
标题翻译：层状芯片包装及其制造方法
公开(公告)号：JP2012009807A
公开(公告)日：2012-01-12
申请号：JP2010288172
申请日：2010-12-24
申请人： Headway Technologies Inc , Sae Magnetics (Hk) Ltd , ヘッドウェイテクノロジーズインコーポレイテッド , 新科實業有限公司SAE Magnetics(H.K.)Ltd.
发明人： SASAKI YOSHITAKA , ITO HIROYUKI , IKEJIMA HIROSHI , IIJIMA ATSUSHI
IPC分类号： H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L21/6835 , H01L21/563 , H01L21/76898 , H01L23/522 , H01L23/544 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/24 , H01L24/25 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/82 , H01L24/83 , H01L24/92 , H01L24/94 , H01L24/95 , H01L24/96 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L25/50 , H01L2221/68327 , H01L2223/54406 , H01L2223/54433 , H01L2223/54453 , H01L2224/0231 , H01L2224/02311 , H01L2224/02313 , H01L2224/02317 , H01L2224/02321 , H01L2224/02371 , H01L2224/02375 , H01L2224/02379 , H01L2224/02381 , H01L2224/0239 , H01L2224/0345 , H01L2224/0346 , H01L2224/0401 , H01L2224/04026 , H01L2224/05008 , H01L2224/05554 , H01L2224/05644 , H01L2224/05647 , H01L2224/1146 , H01L2224/13144 , H01L2224/16148 , H01L2224/24011 , H01L2224/24146 , H01L2224/245 , H01L2224/2746 , H01L2224/29144 , H01L2224/2919 , H01L2224/32148 , H01L2224/81121 , H01L2224/8113 , H01L2224/81191 , H01L2224/81193 , H01L2224/81203 , H01L2224/81815 , H01L2224/82005 , H01L2224/821 , H01L2224/82101 , H01L2224/82106 , H01L2224/83005 , H01L2224/83121 , H01L2224/8313 , H01L2224/83191 , H01L2224/83193 , H01L2224/83203 , H01L2224/83815 , H01L2224/8385 , H01L2224/85 , H01L2224/9202 , H01L2224/92244 , H01L2224/94 , H01L2224/95001 , H01L2224/96 , H01L2224/97 , H01L2225/06551 , H01L2225/06565 , H01L2225/1058 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2224/81 , H01L2224/83 , H01L2224/82 , H01L2924/00 , H01L2221/68304
摘要： PROBLEM TO BE SOLVED: To provide a layered chip package that facilitates implementing a package that provides, even if it includes a malfunctioning semiconductor chip, the same functions as those for the case where no malfunctioning semiconductor chip is included.SOLUTION: A layered chip package 1A, 1B includes a main body 2, and wiring 3 disposed on a side surface of the main body 2. The main body 2 includes: a main part 2M including a plurality of layer portions; a plurality of first terminals 4 disposed on the top surface of the main part 2M and connected to the wiring; and a plurality of second terminals disposed on the bottom surface of the main part 2M and connected to the wiring. The plurality of layer portions include a first-type layer portion 10A and a second-type layer portion 10B. The first-type layer portion 10A includes a conforming semiconductor chip, and a plurality of first-type electrodes that are connected to the semiconductor chip and the wiring. The second-type layer portion 10B includes a defective semiconductor chip, and a plurality of second-type electrodes that are connected to the wiring and not to the semiconductor chip.
摘要翻译：要解决的问题：为了提供便于实现包括即使包括故障半导体芯片的封装的分层芯片封装，其功能与不包括故障半导体芯片的功能相同。解决方案：层叠芯片封装1A，1B包括主体2和布置在主体2的侧表面上的布线3.主体2包括：包括多个层部分的主体部分2M; 多个第一端子4，其设置在主体部件2M的上表面上，与该布线连接; 以及多个第二端子，其设置在主体部件2M的底面上，与该布线连接。多个层部分包括第一类型部分10A和第二类型部分10B。第一类型部分10A包括符合标准的半导体芯片和连接到半导体芯片和布线的多个第一类型的电极。第二类型部分10B包括有缺陷的半导体芯片和多个第二类型的电极，其连接到布线而不连接到半导体芯片。版权所有（C）2012，JPO＆INPIT

15. 发明专利

JP2011248993A Thermally assisted perpendicular magnetic recording device and thermally assisted perpendicular magnetic recording method 有权
标题翻译：热辅助的磁性记录装置和热辅助的永磁记录方法
公开(公告)号：JP2011248993A
公开(公告)日：2011-12-08
申请号：JP2011120968
申请日：2011-05-30
申请人： Headway Technologies Inc , ヘッドウェイテクノロジーズインコーポレイテッド
发明人： KIM UK-HWY , JOE SMITH , MORIS DOVEK
IPC分类号： G11B5/31 , G11B5/02
CPC分类号： G11B5/1278 , G11B5/314 , G11B2005/001 , G11B2005/0021
摘要： PROBLEM TO BE SOLVED: To provide a TAMR head capable of enhancing recording density.SOLUTION: A TAMR device includes a slider having a TE mode LD, a WG, an SGPG, and a PMP in a sequence. The SGPG is divided into first to third region parts S1 to S3, that are interconnected and aligned from the LD side toward ABS side. Each region part includes a pair of metallic portions 22A, 22B, that are opposing to each other by a gap 22G in a track width direction. The separation distance of the pair of metallic portions 22A, 22B in the X axis direction decreases both when going from the WG-facing surface toward the PMP-facing surface as well as when going towards the ABS along the Z axis direction.
摘要翻译：要解决的问题：提供能够提高记录密度的TAMR头。解决方案：TAMR装置包括具有TE模式LD，WG，SGPG和PMP的滑块。 SGPG被分割为从LD侧朝向ABS侧互连并对准的第一至第三区域部分S1至S3。每个区域部分包括在轨道宽度方向上通过间隙22G彼此相对的一对金属部分22A，22B。当从面向WG的表面朝着面向PMP的表面以及当沿着Z轴方向朝向ABS时，一对金属部分22A，22B在X轴方向上的分离距离减小。版权所有（C）2012，JPO＆INPIT

16. 发明专利

JP2011181163A Manufacturing method of near-field light generating element, and manufacturing method of thermally assisted magnetic recording head 有权
标题翻译：近场光产生元件的制造方法及热辅助磁记录头的制造方法
公开(公告)号：JP2011181163A
公开(公告)日：2011-09-15
申请号：JP2010233757
申请日：2010-10-18
申请人： Headway Technologies Inc , ヘッドウェイテクノロジーズインコーポレイテッド
发明人： SASAKI YOSHITAKA , ITO HIROYUKI , TANEMURA SHIGEKI , ARAKI HIRONORI
IPC分类号： G11B5/31
CPC分类号： G11B5/314 , B24B37/048 , G11B5/3163 , G11B2005/0021
摘要： PROBLEM TO BE SOLVED: To manufacture a near-field light generating element having a front end face whose upper end has a sharp shape.
SOLUTION: An outer face of the near-field light generating element 16 includes slopes 16b and 16c, and an edge 16d that connects the slopes 16b and 16c. In a manufacturing method for the near-field light generating element 16, first, a polishing stop layer is formed on a metal layer, and the polishing stop layer and the metal layer are etched so that the slope 16b is formed on the metal layer. Then, a covered layer 18A which is formed of an inorganic material other than metal and has a lower etching speed than that of the metal layer in a subsequently performed second etching process is formed so as to cover the metal layer and the polishing stop layer. Then, the covered layer 18A is polished until the polishing stop layer is exposed. Then, by the second etching process, the polishing stop layer and the metal layer are etched using the covered layer 18A as an etching mask. By this, the slope 16c and the edge 16d are formed in the metal layer, and the near-field light generating element 16 is manufactured.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：制造具有上端具有尖锐形状的前端面的近场光产生元件。解决方案：近场光产生元件16的外表面包括斜面16b和16c以及连接斜面16b和16c的边缘16d。在近场光发生元件16的制造方法中，首先，在金属层上形成研磨停止层，并且在金属层上形成研磨停止层和金属层，使斜面16b形成。然后，形成覆盖金属层和抛光停止层的覆盖层18A，其由金属以外的无机材料形成，蚀刻速度低于金属层的蚀刻速度。然后，对被覆层18A进行研磨，直到研磨停止层露出为止。然后，通过第二蚀刻工艺，使用覆盖层18A作为蚀刻掩模蚀刻抛光停止层和金属层。由此，在金属层中形成斜面16c和边缘16d，制造近场光产生元件16。版权所有（C）2011，JPO＆INPIT

17. 发明专利

JP2011166109A Method of manufacturing layered chip package 有权
标题翻译：制造分层芯片包装的方法
公开(公告)号：JP2011166109A
公开(公告)日：2011-08-25
申请号：JP2010215273
申请日：2010-09-27
申请人： Headway Technologies Inc , Sae Magnetics (Hk) Ltd , ヘッドウェイテクノロジーズインコーポレイテッド , 新科實業有限公司SAE Magnetics(H.K.)Ltd.
发明人： SASAKI YOSHITAKA , ITO HIROYUKI , IIJIMA ATSUSHI
IPC分类号： H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L21/78 , H01L2224/16
摘要： PROBLEM TO BE SOLVED: To mass-produce layered chip packages at low cost in a short time. SOLUTION: The layered chip package includes: a main body including a plurality of layer portions stacked; and wiring disposed on at least one side surface of the main body. In a method of manufacturing the layered chip package, first, a plurality of substructures each of which including an array of a plurality of preliminary layer portions are used to fabricate a layered substructure that includes a plurality of pre-separation main bodies 2P arranged in rows. Next, the layered substructure is cut into a plurality of blocks 116 each of which includes a row of a plurality of pre-separation main bodies 2P, and the wiring is collectively formed on the plurality of pre-separation main bodies 2P included in each block 116. The plurality of pre-separation main bodies 2P are then separated from each other. Each of the plurality of blocks 116 includes a row of three, four, or five pre-separation main bodies 2P. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：在短时间内以低成本批量生产分层芯片封装。解决方案：层状芯片封装包括：主体，其包括堆叠的多个层部分; 以及布置在主体的至少一个侧表面上的布线。在制造层状芯片封装的方法中，首先，使用包括多个预备层部分的阵列的多个子结构来制造层叠子结构，其包括排列成行的多个预分离主体2P 。接下来，将分层子结构切割成多个块116，每个块116包括一排多个预分离主体2P，并且布线集中地形成在包括在每个块中的多个预分离主体2P上然后，将多个预分离主体2P彼此分离。多个块116中的每一个包括一行三个，四个或五个预分离主体2P。版权所有（C）2011，JPO＆INPIT

18. 发明专利

JP2011141943A Thermally assisted magnetic recording facilitation structure and method of manufacturing the same 有权
标题翻译：热辅助磁记录辅助结构及其制造方法
公开(公告)号：JP2011141943A
公开(公告)日：2011-07-21
申请号：JP2011002546
申请日：2011-01-07
申请人： Headway Technologies Inc , ヘッドウェイテクノロジーズインコーポレイテッド
发明人： JIN XUHUI , SCHRECK ERHARD , SMYTH JOE , DOVEK MORIS
IPC分类号： G11B5/31 , G11B5/02
CPC分类号： G11B5/102 , G11B5/105 , G11B5/314 , G11B5/6088 , G11B2005/0021 , Y10T29/49032
摘要： PROBLEM TO BE SOLVED: To provide a device for facilitating thermally assisted magnetic recording (TAMR), and also to provide a method of manufacturing the same. SOLUTION: An integrated type focusing element such as cylindrical lenses of one or more or a concave mirror are introduced to a light guide system extending from a laser diode to a waveguide, light from the laser diode is focused on the waveguide and a near plasmon antenna using the above element. Hence, a divergence laser beam of the laser diode is compensated, and coupling efficiency between the light guide system and the waveguide is improved. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种促进热辅助磁记录（TAMR）的装置，并且还提供一种其制造方法。解决方案：将一个或多个凹面镜的圆柱形透镜的集成型聚焦元件引入到从激光二极管延伸到波导的光导系统中，来自激光二极管的光聚焦在波导上，并且使用上述元件近等离子体天线。因此，补偿了激光二极管的发散激光束，并提高了导光系统与波导之间的耦合效率。版权所有（C）2011，JPO＆INPIT

19. 发明专利

JP2011141942A Thermally assisted magnetic head, method of manufacturing the same, head gimbal assembly, and hard disk drive 有权
标题翻译：热辅助磁头，其制造方法，头部组件和硬盘驱动
公开(公告)号：JP2011141942A
公开(公告)日：2011-07-21
申请号：JP2010255640
申请日：2010-11-16
申请人： Headway Technologies Inc , Tdk Corp , Tdk株式会社 , ヘッドウェイテクノロジーズインコーポレイテッド
发明人： SASAKI YOSHITAKA , ITO HIROYUKI , IIJIMA ATSUSHI
IPC分类号： G11B5/31
CPC分类号： G11B5/3116 , G11B5/1278 , G11B5/3133 , G11B5/314 , G11B5/3163 , G11B5/6088 , G11B2005/0005 , G11B2005/0021
摘要： PROBLEM TO BE SOLVED: To prevent a fault of a hard disk drive due to protrusion of a medium-opposing surface accompanying magnetic recording operation and melting of a plasmon antenna. SOLUTION: A thermally assisted magnetic head has: a main magnetic pole layer; a near-field light generating layer having a generating end part generating near-field light arranged within a medium-opposing surface; and an optical waveguide guiding light to the near-field light generating layer. The near-field light generating layer has a near-field light generating part in a triangle shape with the generating end part being one vertex, and is formed in a triangle pole shape. The optical waveguide is formed to be opposed to a ridge part of the near-field light generating layer via an interposed layer. The main magnetic pole layer is formed to be opposed to the generating end part via the interposed layer. The thermally assisted magnetic head further has a heat radiating layer in contact with an opposite side of the near-field light generating layer from the optical waveguide. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：防止伴随磁记录操作和等离子体激元天线熔化的介质相对表面的突出引起的硬盘驱动器的故障。解决方案：热辅助磁头具有：主磁极层; 近场光产生层，具有产生在介质相对表面内的近场光的发生端部; 以及将光导向近场光产生层的光波导。近场光产生层具有三角形状的近场光产生部，发光端部为一顶点，形成为三角形。光波导通过中间层形成为与近场光产生层的脊部相对。主磁极层经由插入层形成为与发生端部相对。热辅助磁头还具有与来自光波导的近场光产生层的相对侧接触的散热层。版权所有（C）2011，JPO＆INPIT

20. 发明专利

JP2011060408A Heat-assisted magnetic recording head with laser diode fixed to slider 有权
标题翻译：热辅助磁记录头，激光二极管固定在滑块上
公开(公告)号：JP2011060408A
公开(公告)日：2011-03-24
申请号：JP2010074164
申请日：2010-03-29
申请人： Headway Technologies Inc , ヘッドウェイテクノロジーズインコーポレイテッド
发明人： SASAKI YOSHITAKA , ITO HIROYUKI , TANEMURA SHIGEKI , ARAKI HIRONORI
IPC分类号： G11B5/31 , G11B5/02 , G11B5/60
CPC分类号： G11B5/314 , G11B5/105 , G11B5/6088 , G11B2005/001 , G11B2005/0021 , H01S5/0224 , H01S5/02272 , H01S5/0228 , H01S5/02292
摘要： PROBLEM TO BE SOLVED: To easily perform alignment of laser light with a waveguide, while using an edge-emitting laser diode and to shorten the path of the laser light from the laser-light emission part of the laser diode to the waveguide. SOLUTION: A heat-assisted magnetic recording head 200 includes a slider 201, an edge-emitting laser diode 202 and an external mirror 203. The slider 201 has a magnetic pole, a waveguide 26 and a near-field light generating element. The laser diode 202 includes an emitting end face 202c including laser light emission part and a mounting surface 202a facing the slider 201. The external mirror 203 includes a first reference surface 203c that faces the emitting end face 202c, a second reference surface 203d that is parallel to the mounting surface 202a, and a reflecting surface 203c that connects the first and second reference surfaces to each other and reflects the laser light emitted from the emission part toward the waveguide 26. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了容易地执行激光与波导的对准，同时使用边缘发射激光二极管并缩短从激光二极管的激光发射部分到波导的激光的路径。解决方案：热辅助磁记录头200包括滑块201，边缘发射激光二极管202和外反射镜203.滑块201具有磁极，波导26和近场光产生元件。激光二极管202包括包括激光发射部分和面向滑块201的安装表面202a的发射端面202c。外部反射镜203包括面向发射端面202c的第一参考表面203c，第二参考表面203d，平行于安装表面202a的反射表面203c和将第一和第二参考表面彼此连接并将从发射部分发射的激光反射到波导26的反射表面203c。（C）2011，JPO和INPIT

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