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    • 138. 发明授权
    • Fin FET structure
    • 翅片FET结构
    • US07317230B2
    • 2008-01-08
    • US11041063
    • 2005-01-21
    • Choong-Ho LeeDong-Gun ParkJae-Man YounChul Lee
    • Choong-Ho LeeDong-Gun ParkJae-Man YounChul Lee
    • H01L29/94
    • H01L29/785H01L29/4908H01L29/66795H01L29/7854
    • A fin FET structure employs a negative word line scheme. A gate electrode of a fin FET employs an electrode doped with n+ impurity, and a channel doping for a control of threshold voltage is not executed, or the channel doping is executed by a low density, thereby remarkably improving characteristics of the fin FET. A semiconductor substrate is formed in a first conductive type, and a fin active region of a first conductive type is projected from an upper surface of the semiconductor substrate and is connected to the semiconductor substrate. An insulation layer is formed on the semiconductor substrate, and a gate insulation layer is formed in upper part and sidewall of the fin active region. A gate electrode is formed on the insulation layer and the gate insulation layer. Source and drain are formed in the fin active region of both sides of the gate electrode.
    • 鳍式FET结构采用负字线方案。 翅片FET的栅极采用掺杂有n +杂质的电极,不执行用于阈值电压控制的沟道掺杂,或者通过低密度执行沟道掺杂,从而显着提高了鳍式FET的特性。 半导体衬底形成为第一导电类型,并且第一导电类型的鳍有源区域从半导体衬底的上表面突出并连接到半导体衬底。 在半导体衬底上形成绝缘层,并且在翅片有源区的上部和侧壁形成栅极绝缘层。 在绝缘层和栅极绝缘层上形成栅电极。 源极和漏极形成在栅极两侧的鳍片有源区域中。
    • 139. 发明申请
    • Fin-FET having GAA structure and methods of fabricating the same
    • 具有GAA结构的Fin-FET及其制造方法
    • US20070145431A1
    • 2007-06-28
    • US11505936
    • 2006-08-18
    • Suk-Pil KimJae-Woong HyunYoon-Dong ParkWon-Joo KimDong-Gun ParkChoong-Ho Lee
    • Suk-Pil KimJae-Woong HyunYoon-Dong ParkWon-Joo KimDong-Gun ParkChoong-Ho Lee
    • H01L29/76
    • H01L29/785H01L29/42392H01L29/66795
    • Example embodiments of the present invention relate to a semiconductor device and methods of fabricating the same. Other example embodiments of the present invention relate to a fin-field effect transistor (Fin-FET) having a fin-type channel region and methods of fabricating the same. A Fin-FET having a gate all around (GAA) structure that may use an entire area around a fin as a channel region is provided. The Fin-FET having the GAA structure includes a semiconductor substrate having a body, a pair of support pillars and a fin. The pair of support pillars may protrude from the body. A fin may be spaced apart from the body and may have ends connected to and supported by the pair of support pillars. A gate electrode may surround at least a portion of the fin of the semiconductor substrate. The gate electrode may be insulated from the semiconductor substrate. A gate insulation layer may be interposed between the gate electrode and the fin of the semiconductor substrate.
    • 本发明的示例性实施例涉及一种半导体器件及其制造方法。 本发明的其它示例性实施例涉及一种具有鳍型沟道区的鳍式场效应晶体管(Fin-FET)及其制造方法。 提供了可以使用围绕鳍片的整个区域作为沟道区域的具有栅极全(GAA)结构的鳍FET。 具有GAA结构的Fin-FET包括具有主体,一对支撑柱和鳍的半导体衬底。 一对支柱可能从身体突出。 翅片可以与主体间隔开,并且可以具有连接到一对支撑柱并由其支撑的端部。 栅电极可围绕半导体衬底的鳍的至少一部分。 栅电极可以与半导体衬底绝缘。 栅极绝缘层可以插入在半导体衬底的栅电极和鳍之间。
    • 140. 发明申请
    • Semiconductor device having vertical transistor and method of fabricating the same
    • 具有垂直晶体管的半导体器件及其制造方法
    • US20070080385A1
    • 2007-04-12
    • US11450936
    • 2006-06-09
    • Bong-Soo KimKang-Yoon LeeDong-Gun ParkJae-Man YoonSeong-Goo KimHyeoung-Won Seo
    • Bong-Soo KimKang-Yoon LeeDong-Gun ParkJae-Man YoonSeong-Goo KimHyeoung-Won Seo
    • H01L29/94
    • H01L27/10894H01L27/10876H01L29/66666H01L29/7827
    • There are provided a semiconductor device having a vertical transistor and a method of fabricating the same. The method includes preparing a semiconductor substrate having a cell region and a peripheral circuit region. Island-shaped vertical gate structures two-dimensionally aligned along a row direction and a column direction are formed on the substrate of the cell region. Each of the vertical gate structures includes a semiconductor pillar and a gate electrode surrounding a center portion of the semiconductor pillar. A bit line separation trench is formed inside the semiconductor substrate below a gap region between the vertical gate structures, and a peripheral circuit trench confining a peripheral circuit active region is formed inside the semiconductor substrate of the peripheral circuit region. The bit line separation trench is formed in parallel with the column direction of the vertical gate structures. A bit line separation insulating layer and a peripheral circuit isolation layer are formed inside the bit line separation trench and the peripheral circuit trench, respectively.
    • 提供了具有垂直晶体管的半导体器件及其制造方法。 该方法包括制备具有单元区域和外围电路区域的半导体衬底。 在单元区域的基板上形成沿行方向和列方向二维排列的岛状的垂直栅极结构。 每个垂直栅极结构包括半导体柱和围绕半导体柱的中心部分的栅电极。 在垂直栅极结构之间的间隙区域的下方,在半导体衬底的内部形成有位线分离沟槽,并且在外围电路区域的半导体衬底的内部形成限制外围电路有源区的外围电路沟道。 位线分离沟槽与垂直栅极结构的列方向平行地形成。 位线分离绝缘层和外围电路隔离层分别形成在位线分离沟槽和外围电路沟槽内部。