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    • 133. 发明申请
    • Y-SHAPED CARBON NANOTUBES AS AFM PROBE FOR ANALYZING SUBSTRATES WITH ANGLED TOPOGRAPHY
    • Y型碳纳米管作为AFM探针,用于分析具有光滑地理位置的基底
    • US20070125946A1
    • 2007-06-07
    • US11164792
    • 2005-12-06
    • Carol BoyeToshiharu FurukawaMark HakeySteven HolmesDavid HorakCharles Koburger
    • Carol BoyeToshiharu FurukawaMark HakeySteven HolmesDavid HorakCharles Koburger
    • G21K7/00
    • G01Q60/42G01Q70/12
    • A Y-shaped carbon nanotube atomic force microscope probe tip and methods comprise a shaft portion; a pair of angled arms extending from a same end of the shaft portion, wherein the shaft portion and the pair of angled arms comprise a chemically modified carbon nanotube, and wherein the chemically modified carbon nanotube is modified with any of an amine, carboxyl, fluorine, and metallic component. Preferably, each of the pair of angled arms comprises a length of at least 200 nm and a diameter between 10 and 200 nm. Moreover, the chemically modified carbon nanotube is preferably adapted to allow differentiation between substrate materials to be probed. Additionally, the chemically modified carbon nanotube is preferably adapted to allow fluorine gas to flow through the chemically modified carbon nanotube onto a substrate to be characterized. Furthermore, the chemically modified carbon nanotube is preferably adapted to chemically react with a substrate surface to be characterized.
    • Y型碳纳米管原子力显微镜探针头和方法包括轴部分; 一对成角度的臂,其从所述轴部的同一端延伸,其中所述轴部和所述一对成角度的臂包括化学改性的碳纳米管,并且其中所述化学改性的碳纳米管用胺,羧基,氟 ,和金属成分。 优选地,一对成角度的臂中的每一个包括至少200nm的长度和10和200nm之间的直径。 此外,化学改性的碳纳米管优选适于允许待探测的基底材料之间的分化。 此外,化学改性的碳纳米管优选适于使氟气通过化学改性的碳纳米管流动到待表征的基底上。 此外,化学改性的碳纳米管优选适于与要表征的基材表面发生化学反应。
    • 135. 发明授权
    • Structure and method for thin box SOI device
    • 薄盒SOI器件的结构和方法
    • US07217604B2
    • 2007-05-15
    • US10906014
    • 2005-01-31
    • Toshiharu FurukawaCarl J. RadensWilliam R. TontiRichard Q. Williams
    • Toshiharu FurukawaCarl J. RadensWilliam R. TontiRichard Q. Williams
    • H01L21/84
    • H01L29/66772H01L29/665H01L29/78606H01L29/78612
    • A method of forming a semiconductor device, including providing a substrate having a first insulative layer on a surface of the substrate, and a device layer on a surface of the first insulative layer, forming a spacer around the first insulative layer and the device layer, removing a portion of the substrate adjacent to the first insulative layer in a first region and a non-adjacent second region of the substrate, such that an opening is formed in the first and second regions of the substrate, leaving the substrate adjacent to the first insulative layer in a third region of the substrate, filling the opening within the first and second regions of the substrate, planarizing a surface of the device, and forming a device within the device layer, such that diffusion regions of the device are formed within the device layer above the first and second regions of the substrate, and a channel region of the device is formed above the third region of the substrate.
    • 一种形成半导体器件的方法,包括在所述衬底的表面上提供具有第一绝缘层的衬底以及在所述第一绝缘层的表面上的器件层,在所述第一绝缘层和所述器件层周围形成间隔物, 在衬底的第一区域和不相邻的第二区域中移除邻近第一绝缘层的衬底的一部分,使得在衬底的第一和第二区域中形成开口,使衬底与第一绝缘层相邻, 在衬底的第三区域中的绝缘层,填充衬底的第一和第二区域内的开口,使器件的表面平坦化,以及在器件层内形成器件,使得器件的扩散区域形成在 器件层在衬底的第一和第二区域之上,并且器件的沟道区形成在衬底的第三区域上方。
    • 140. 发明申请
    • STRUCTURE AND METHOD FOR THIN BOX SOI DEVICE
    • 薄盒SOI器件的结构与方法
    • US20060172499A1
    • 2006-08-03
    • US10906014
    • 2005-01-31
    • Toshiharu FurukawaCarl RadensWilliam TontiRichard Williams
    • Toshiharu FurukawaCarl RadensWilliam TontiRichard Williams
    • H01L21/336
    • H01L29/66772H01L29/665H01L29/78606H01L29/78612
    • A method of forming a semiconductor device, comprising providing a substrate having a first insulative layer on a surface of the substrate, and a device layer on a surface of the first insulative layer, forming a spacer around the first insulative layer and the device layer, removing a portion of the substrate adjacent to the first insulative layer in a first region and a non-adjacent second region of the substrate, such that an opening is formed in the first and second regions of the substrate, leaving the substrate adjacent to the first insulative layer in a third region of the substrate, filling the opening within the first and second regions of the substrate, planarizing a surface of the device, and forming a device within the device layer, such that diffusion regions of the device are formed within the device layer above the first and second regions of the substrate, and a channel region of the device is formed above the third region of the substrate.
    • 一种形成半导体器件的方法,包括在所述衬底的表面上提供具有第一绝缘层的衬底以及在所述第一绝缘层的表面上的器件层,在所述第一绝缘层和所述器件层周围形成间隔物, 在衬底的第一区域和不相邻的第二区域中移除邻近第一绝缘层的衬底的一部分,使得在衬底的第一和第二区域中形成开口,使衬底与第一绝缘层相邻, 在衬底的第三区域中的绝缘层,填充衬底的第一和第二区域内的开口,使器件的表面平坦化,以及在器件层内形成器件,使得器件的扩散区域形成在 器件层在衬底的第一和第二区域之上,并且器件的沟道区形成在衬底的第三区域上方。