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121. 发明授权

US08308972B2 Additive for polishing composition 有权
标题翻译：抛光组合物用添加剂
公开(公告)号：US08308972B2
公开(公告)日：2012-11-13
申请号：US12449242
申请日：2007-09-26
申请人： Masashi Teramoto , Ryoko Higashigaki , Hiroshi Makino
发明人： Masashi Teramoto , Ryoko Higashigaki , Hiroshi Makino
IPC分类号： C09K13/00
CPC分类号： C09K3/1463 , C09G1/02 , H01L21/02024
摘要： The invention relates to an additive for polishing composition, which can ensure stable polishing properties. The additive for polishing composition contains one or more amine compounds and an alcohol. The one or more amine compounds contain a quaternary ammonium salt. When the one or more amine compounds are contained in high concentration, the occurrence of precipitation of the amine compound can be prevented by including the alcohol.
摘要翻译：本发明涉及一种用于抛光组合物的添加剂，其可以确保稳定的抛光性能。抛光组合物添加剂含有一种或多种胺化合物和醇。一种或多种胺化合物含有季铵盐。当高浓度含有一种或多种胺化合物时，可以通过包括醇来防止胺化合物沉淀的发生。

122. 发明授权

US07982188B2 Apparatus and method for wafer pattern inspection 有权
标题翻译：晶圆图案检查的装置和方法
公开(公告)号：US07982188B2
公开(公告)日：2011-07-19
申请号：US11336895
申请日：2006-01-23
申请人： Hiroyuki Shinada , Hisaya Murakoshi , Hideo Todokoro , Hiroshi Makino , Yoshihiro Anan
发明人： Hiroyuki Shinada , Hisaya Murakoshi , Hideo Todokoro , Hiroshi Makino , Yoshihiro Anan
IPC分类号： G21K7/00
CPC分类号： H01J37/29 , H01J2237/2817
摘要： An electric field for decelerating an electron beam is formed on a surface of a sample semiconductor to be inspected, an electron beam having a specific area (a sheet electron beam) and containing a component having such an energy as not to reach the surface of the sample semiconductor is reflected in the very vicinity of the surface of the sample semiconductor by action of the electric field for deceleration and then forms an image through an imaging lens. Thus images of plural fields on the surface of the sample semiconductor are obtained and are stored in image memory units. By comparing the stored images of the plural fields with one another, the presence and position of a defect in the fields are determined.
摘要翻译：在要检查的样品半导体的表面上形成用于减小电子束的电场，具有特定面积的电子束（片状电子束）并且包含具有不能到达表面的能量的成分通过用于减速的电场的作用，样品半导体在样品半导体的表面的非常附近被反射，然后通过成像透镜形成图像。因此，获得样品半导体表面上的多个场的图像并将其存储在图像存储单元中。通过将存储的多个场的图像相互比较，确定场中的缺陷的存在和位置。

123. 发明申请

US20100133433A1 ELECTRON BEAM APPARATUS 有权
标题翻译：电子束设备
公开(公告)号：US20100133433A1
公开(公告)日：2010-06-03
申请号：US11958717
申请日：2007-12-18
申请人： Sayaka TANIMOTO , Hiroya Ohta , Hiroshi Makino , Ryuichi Funatsu
发明人： Sayaka TANIMOTO , Hiroya Ohta , Hiroshi Makino , Ryuichi Funatsu
IPC分类号： G01N23/225
CPC分类号： H01J37/28 , H01J37/244 , H01J2237/0435 , H01J2237/2448 , H01J2237/24564 , H01J2237/24592
摘要： A plurality of primary beams are formed from a single electron source, the surface charge of a sample is controlled by at least one primary beam, and at the same time, the inspection of the sample is conducted using a primary beam other than this. Also, for an exposure area of the primary beam for surface charge control and an exposure area of the primary beam for the inspection, the surface electric field strength is set individually. Also, the current of the primary beam for surface charge control and the interval between the primary beam for surface charge control and the primary beam for inspection are controlled.
摘要翻译：由单个电子源形成多个主光束，通过至少一个主光束来控制样品的表面电荷，同时使用除此之外的一次光束进行样品的检查。此外，对于用于表面电荷控制的一次光束的曝光区域和用于检查的主光束的曝光区域，单独设置表面电场强度。此外，控制用于表面电荷控制的主光束的电流以及用于表面电荷控制的主光束和用于检查的主光束之间的间隔。

124. 发明申请

US20090309022A1 APPARATUS FOR INSPECTING A SUBSTRATE, A METHOD OF INSPECTING A SUBSTRATE, A SCANNING ELECTRON MICROSCOPE, AND A METHOD OF PRODUCING AN IMAGE USING A SCANNING ELECTRON MICROSCOPE 审中-公开
标题翻译：用于检查基板的装置，检查基板的方法，扫描电子显微镜以及使用扫描电子显微镜产生图像的方法
公开(公告)号：US20090309022A1
公开(公告)日：2009-12-17
申请号：US12480443
申请日：2009-06-08
申请人： Yasuhiro GUNJI , Akira Fujii , Hiroyuki Takahashi , Ryuichi Funatsu , Toshifumi Honda , Takashi Hiroi , Hiroshi Makino
发明人： Yasuhiro GUNJI , Akira Fujii , Hiroyuki Takahashi , Ryuichi Funatsu , Toshifumi Honda , Takashi Hiroi , Hiroshi Makino
IPC分类号： G01N23/00 , H01J3/14
CPC分类号： G01N23/2251 , G01N2223/646 , H01J37/265 , H01J37/28 , H01J2237/202 , H01J2237/216 , H01J2237/2482 , H01J2237/2817
摘要： An object of the present invention provides an inspection apparatus and an inspection method which use an electron beam image to accurately detect a defect that is difficult to detect in an optical image, the apparatus and method also enabling prevention of a possible decrease in focus accuracy of an inspection image which affect the defect detection. To accomplish the object, the present invention includes a height measurement section which measures height of the electron beam irradiation position on the substrate after the substrate is loaded onto a movable stage, a height correction processing section which corrects the measured height, and a control section which adjusts a focus of the electron beam according to the height corrected by the height correction processing section, wherein a stage position set when the height measurement section measures the height differs from a stage position set when the substrate is irradiated with the electron beam, and the height correction processing section corrects a possible deviation in height resulting from movement from the stage position for the height measurement to the stage position for the electron beam irradiation.
摘要翻译：本发明的目的是提供一种使用电子束图像来精确地检测光学图像中难以检测的缺陷的检查装置和检查方法，该装置和方法还能够防止可能降低聚焦精度影响缺陷检测的检查图像。为了实现该目的，本发明包括一个高度测量部分，其测量将基板装载到可移动平台上之后的基板上的电子束照射位置的高度，校正测量高度的高度校正处理部分，以及控制部分其根据由高度校正处理部校正的高度来调整电子束的焦点，其中当高度测量部分测量高度时设置的台阶位置与当基板被电子束照射时设定的台位置不同，以及高度校正处理部分校正由高度测量的台位置到用于电子束照射的台位置的运动导致的高度偏差。

125. 发明授权

US07566871B2 Method and apparatus for pattern inspection 有权
标题翻译：图案检查方法和装置
公开(公告)号：US07566871B2
公开(公告)日：2009-07-28
申请号：US11698025
申请日：2007-01-26
申请人： Masaki Hasegawa , Hisaya Murakoshi , Hiroshi Makino
发明人： Masaki Hasegawa , Hisaya Murakoshi , Hiroshi Makino
IPC分类号： G01N23/00 , G21K7/00 , A61N5/00 , G21G5/00
CPC分类号： H01J37/265 , G06T7/0004 , G06T2207/10056 , G06T2207/30148 , H01J37/29 , H01J2237/22 , H01J2237/24592
摘要： Because a mirror electron imaging type inspection apparatus for obtaining an inspection object image with mirror electrons has been difficult to optimize inspection conditions, since the image forming principles of the apparatus are different from those of conventional SEM type inspection apparatuses. In order to solve the above conventional problem, the present invention has made it possible for the user to examine such conditions as inspection speed, inspection sensitivity, etc. intuitively by displaying the relationship among the values of inspection speed S, inspection object digital signal image pixel size D, inspection object image size L, and image signal acquisition cycle P with use of a time delay integration method as a graph on an operation screen. The user can thus determine a set of values of a pixel size, an inspection image width, and a TDI sensor operation cycle easily with reference to the displayed graph.
摘要翻译：由于用于获得具有镜电子的检查对象图像的镜像电子成像型检查装置难以优化检查条件，因为该装置的图像形成原理与常规SEM型检查装置的图像形成原理不同。为了解决上述常规问题，本发明使得用户可以通过显示检查速度S，检查对象数字信号图像的值之间的关系来直观地检查诸如检查速度，检查灵敏度等条件像素尺寸D，检查对象图像尺寸L和图像信号采集周期P，使用时间延迟积分方法作为操作画面上的图形。因此，用户可以参照所显示的图形容易地确定像素尺寸，检查图像宽度和TDI传感器操作循环的一组值。

126. 发明申请

US20090141569A1 SEMICONDUCTOR MEMORY DEVICE 有权
标题翻译：半导体存储器件
公开(公告)号：US20090141569A1
公开(公告)日：2009-06-04
申请号：US12367871
申请日：2009-02-09
申请人： Koji NII , Shigeki Obayashi , Hiroshi Makino , Koichiro Ishibashi , Hirofumi Shinohara
发明人： Koji NII , Shigeki Obayashi , Hiroshi Makino , Koichiro Ishibashi , Hirofumi Shinohara
IPC分类号： G11C11/416 , G11C5/14 , G11C7/00 , G11C8/00
CPC分类号： G11C11/419 , G11C5/063 , G11C11/412
摘要： Cell power supply lines are arranged for memory cell columns, and adjust impedances or voltage levels of the cell power supply lines according to the voltage levels of bit lines in the corresponding columns, respectively. In the data write operation, the cell power supply line is forced into a floating state according to the bit line potential on a selected column and has the voltage level changed, and a latching capability of a selected memory cell is reduced to write data fast. Even with a low power supply voltage, a static semiconductor memory device that can stably perform write and read of data is implemented.
摘要翻译：单元电源线被布置用于存储单元列，并且分别根据相应列中的位线的电压电平来调整单元电源线的阻抗或电压电平。在数据写入操作中，根据所选列的位线电位将单元电源线强制为浮置状态，并且电压电平改变，并且减小所选存储单元的锁存能力以快速写入数据。即使使用低电源电压，也可以实现能够稳定地执行数据的写入和读取的静态半导体存储器件。

127. 发明授权

US07501625B2 Electron microscope application apparatus and sample inspection method 失效
标题翻译：电子显微镜应用仪器和样品检测方法
公开(公告)号：US07501625B2
公开(公告)日：2009-03-10
申请号：US11442566
申请日：2006-05-30
申请人： Hikaru Koyama , Hiroshi Makino , Mitsugu Sato
发明人： Hikaru Koyama , Hiroshi Makino , Mitsugu Sato
IPC分类号： G21K7/00
CPC分类号： H01J37/026 , H01J2237/0042 , H01J2237/0047 , H01J2237/2817
摘要： A charge control electrode emitting photoelectrons is disposed just above a wafer (sample) in parallel thereto, and the electrode has a through hole so that ultraviolet light can be irradiated to the wafer through the charge control electrode. Specifically, a metal plate which is formed in mesh or includes one or plural holes is used as the charge control electrode. By disposing the charge control electrode just above the sample in parallel thereto, when negative voltage is applied to the electrode, electric field approximately perpendicular to the wafer is generated. Therefore, photoelectrons are efficiently absorbed in the wafer. Also, by using the charge control electrode having approximately the same size as that of the wafer, charges on a whole surface of the wafer can be removed collectively and uniformly. Therefore, time required for the process can be reduced.
摘要翻译：发射光电子的电荷控制电极平行于晶片（样品）正上方，并且电极具有通孔，使得可以通过充电控制电极将紫外光照射到晶片。具体地，使用形成为网状或包含一个或多个孔的金属板作为充电控制电极。通过将电荷控制电极与样品平行放置在正上方，当向电极施加负电压时，产生大致垂直于晶片的电场。因此，光电子被有效地吸收在晶片中。此外，通过使用具有与晶片大致相同尺寸的电荷控制电极，可以集中均匀地去除晶片的整个表面上的电荷。因此，可以减少该过程所需的时间。

128. 发明授权

US07357449B2 Sunroof device 有权
标题翻译：天窗装置
公开(公告)号：US07357449B2
公开(公告)日：2008-04-15
申请号：US11315240
申请日：2005-12-23
申请人： Atsushi Ikeda , Takashi Kikuta , Kentaro Hirose , Nobuyasu Bessho , Kinju Uchida , Samson Asfaw , Kenji Hori , Robert Gore , Hiroshi Makino
发明人： Atsushi Ikeda , Takashi Kikuta , Kentaro Hirose , Nobuyasu Bessho , Kinju Uchida , Samson Asfaw , Kenji Hori , Robert Gore , Hiroshi Makino
IPC分类号： B60J7/057
CPC分类号： B60J7/05
摘要： A sunroof device includes a roof panel having a first opening portion, a ceiling member having a second opening portion so as to face the first opening portion, a movable panel moved between a full-closed position and an open position, the movable panel passing through a half-closed position, a motor for driving the movable panel, a controlling means for controlling an operation of the motor, an operating member to be operated or released by a passenger in the vehicle, and a switch for inputting an operation signal for operating the motor, and inputting a stop signal for stopping the motor. The controlling means drives the motor until the movable panel reaches the full-closed position while moving towards the full-closed position by the operating member being operated even if the operating member is released after the movable panel reaches the half-closed position.
摘要翻译：天窗装置包括具有第一开口部分的顶板，具有与第一开口部分相对的第二开口部分的顶板部件，在全闭合位置和打开位置之间移动的可移动板，可移动板通过半闭合位置，用于驱动可动面板的电动机，用于控制电动机的操作的控制装置，由乘客在车辆中操作或释放的操作构件，以及用于输入操作信号的开关电机，并输入停止信号，停止电机。即使在可动面板到达半闭合位置之后操作构件被释放，控制装置驱动马达，直到可移动面板到达全闭合位置，同时由操作构件操作而向全闭合位置移动。

129. 发明申请

US20080067381A1 Semiconductor wafer inspection tool and semiconductor wafer inspection method 失效
标题翻译：半导体晶圆检查工具和半导体晶圆检查方法
公开(公告)号：US20080067381A1
公开(公告)日：2008-03-20
申请号：US11808247
申请日：2007-06-07
申请人： Takashi Hiroi , Kenji Tanimoto , Yuko Sasaki , Hiroshi Makino
发明人： Takashi Hiroi , Kenji Tanimoto , Yuko Sasaki , Hiroshi Makino
IPC分类号： G21K7/00
CPC分类号： H01J37/20 , G01R31/307 , H01J37/222 , H01J37/244 , H01J37/28 , H01J2237/2008 , H01J2237/20235 , H01J2237/20292 , H01J2237/221 , H01J2237/24564 , H01J2237/24592 , H01J2237/28
摘要： A semiconductor wafer inspection tool and a semiconductor wafer inspection method capable of conducting an inspection under appropriate conditions in any one of an NVC (Negative Voltage Contrast) mode and a PVC (Positive Voltage Contrast) mode is provided. Primary electrons 2 are irradiated onto a wafer to be inspected 6 and the irradiation position thereof is scanned in an XY direction. Secondary electrons (or reflected electrons) 10 from the wafer to be inspected 6 are controlled by a charge control electrode 5 and detected by a sensor 11. An image processor converts a detection signal from the sensor 11 to a detected image, compares the detected image with a predetermined reference image, judges defects, an overall control section 14 selects inspection conditions from recipe information for each wafer to be inspected 6 and sets a voltage to be applied to the charge control electrode 5. A Z stage 8 sets the distance between the wafer to be inspected 6 and the charge control electrode 5 according to this voltage.
摘要翻译：提供能够在适当条件下进行NVC（负电压对比度）模式和PVC（正电压对比度）模式中的任一种的半导体晶片检查工具和半导体晶片检查方法。将一次电子2照射到要检查的晶片6上，并且其XY照射位置被扫描。来自待检查晶片的二次电子（或反射电子）10由电荷控制电极5控制，并由传感器11检测。图像处理器将来自传感器11的检测信号转换为检测图像，将检测到的图像与预定参考图像进行比较，判断缺陷，总体控制部14从每个被检查晶片的配方信息中选择检查条件6，施加到充电控制电极5的电压。 Z级8根据该电压设定待检查晶片6与充电控制电极5之间的距离。

130. 发明申请

US20070293962A1 Design Method for Industrial Product Using Clothoid Curve, Industrial Products Designed by the Design Method, and Method and Device for Numerical Control Using the Clothoid Curve 有权
标题翻译：设计方法工业产品设计方法，设计方法设计的工业产品及使用干燥曲线进行数值控制的方法与装置
公开(公告)号：US20070293962A1
公开(公告)日：2007-12-20
申请号：US10590704
申请日：2005-02-14
申请人： Fumihiko Kimura , Hiroshi Makino , Yoshikazu Matsuo
发明人： Fumihiko Kimura , Hiroshi Makino , Yoshikazu Matsuo
IPC分类号： G05B19/18 , G06F19/00
CPC分类号： G05B19/4103 , G05B2219/35146 , Y02P90/265
摘要： A. [1] A trajectory of motion of the mechanical element is designed by using a three-dimensional curve (referred to as a three-dimensional clothoid curve) in which each of a pitch angle and a yaw angle in a tangential direction is given by a quadratic expression of a curve length or a curve length variable. B. A trajectory of a machine tool or a contour shape of a workpiece is expressed by using a three-dimensional curve (referred to as a three-dimensional clothoid curve) in which each of a pitch angle and a yaw angle in a tangential direction is given by a quadratic expression of a curve length or a curve length variable to control motion of the machine tool based on the three-dimensional curve.
摘要翻译：通过使用三维曲线（称为三维回旋曲线）来设计机械元件的运动轨迹，其中给出切向方向上的俯仰角和偏航角中的每一个通过曲线长度或曲线长度变量的二次表达式。 B.通过使用三维曲线（称为三维回旋曲线）来表示工件的机床轨迹或工件的轮廓形状，其中在切向方向上的俯仰角和偏航角中的每一个由曲线长度或曲线长度变量的二次表达式给出，以基于三维曲线来控制机床的运动。

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