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1. 发明授权

US08420539B2 Additive for polishing composition 有权
标题翻译：抛光组合物用添加剂
公开(公告)号：US08420539B2
公开(公告)日：2013-04-16
申请号：US13442125
申请日：2012-04-09
申请人： Masashi Teramoto , Ryoko Higashigaki , Hiroshi Makino
发明人： Masashi Teramoto , Ryoko Higashigaki , Hiroshi Makino
IPC分类号： C09K13/00
CPC分类号： C09K3/1463 , C09G1/02 , H01L21/02024
摘要： The invention relates to an additive for polishing composition, which can ensure stable polishing properties. The additive for polishing composition contains one or more amine compounds and an alcohol. The one or more amine compounds contain a quaternary ammonium salt. When the one or more amine compounds are contained in high concentration, the occurrence of precipitation of the amine compound can be prevented by including the alcohol.
摘要翻译：本发明涉及一种用于抛光组合物的添加剂，其可以确保稳定的抛光性能。抛光组合物添加剂含有一种或多种胺化合物和醇。一种或多种胺化合物含有季铵盐。当高浓度含有一种或多种胺化合物时，可以通过包括醇来防止胺化合物沉淀的发生。

2. 发明申请

US20100025623A1 ADDITIVE FOR POLISHING COMPOSITION 有权
标题翻译：抛光组合物添加剂
公开(公告)号：US20100025623A1
公开(公告)日：2010-02-04
申请号：US12449242
申请日：2007-09-26
申请人： Masashi Teramoto , Ryoko Higashigaki , Hiroshi Makino
发明人： Masashi Teramoto , Ryoko Higashigaki , Hiroshi Makino
IPC分类号： C09K13/00
CPC分类号： C09K3/1463 , C09G1/02 , H01L21/02024
摘要： One embodiment of the present invention discloses an additive for polishing composition, which can ensure stable polishing properties. The additive for polishing composition contains one or more amine compounds and an alcohol. The one or more amine compounds contain a quaternary ammonium salt. In one embodiment, when the one or more amine compounds are contained in high concentration, the occurrence of precipitation of the amine compound can be prevented by including the alcohol.
摘要翻译：本发明的一个实施方案公开了一种用于抛光组合物的添加剂，其可以确保稳定的抛光性能。抛光组合物添加剂含有一种或多种胺化合物和醇。一种或多种胺化合物含有季铵盐。在一个实施方案中，当高浓度含有一种或多种胺化合物时，可以通过包括醇来防止胺化合物沉淀的发生。

3. 发明授权

US08308972B2 Additive for polishing composition 有权
标题翻译：抛光组合物用添加剂
公开(公告)号：US08308972B2
公开(公告)日：2012-11-13
申请号：US12449242
申请日：2007-09-26
申请人： Masashi Teramoto , Ryoko Higashigaki , Hiroshi Makino
发明人： Masashi Teramoto , Ryoko Higashigaki , Hiroshi Makino
IPC分类号： C09K13/00
CPC分类号： C09K3/1463 , C09G1/02 , H01L21/02024
摘要： The invention relates to an additive for polishing composition, which can ensure stable polishing properties. The additive for polishing composition contains one or more amine compounds and an alcohol. The one or more amine compounds contain a quaternary ammonium salt. When the one or more amine compounds are contained in high concentration, the occurrence of precipitation of the amine compound can be prevented by including the alcohol.
摘要翻译：本发明涉及一种用于抛光组合物的添加剂，其可以确保稳定的抛光性能。抛光组合物添加剂含有一种或多种胺化合物和醇。一种或多种胺化合物含有季铵盐。当高浓度含有一种或多种胺化合物时，可以通过包括醇来防止胺化合物沉淀的发生。

4. 发明申请

US20140030897A1 POLISHING COMPOSITION AND POLISHING METHOD USING THE SAME 审中-公开
标题翻译：抛光组合物和使用该抛光组合物的抛光方法
公开(公告)号：US20140030897A1
公开(公告)日：2014-01-30
申请号：US13983278
申请日：2012-02-02
申请人： Masashi Teramoto , Shinichi Ogata , Ryuichi Tanimoto
发明人： Masashi Teramoto , Shinichi Ogata , Ryuichi Tanimoto
IPC分类号： C09G1/04 , H01L21/306
CPC分类号： C09G1/04 , C09G1/02 , H01L21/02024 , H01L21/30604
摘要： Provided is a polishing composition that does not contain abrasives and that is used for polishing a silicon wafer, the polishing composition including a pH buffer, a polishing accelerator, a water-soluble polymer, and a block-type compound. By polishing a silicon wafer by using the polishing composition, a polishing speed of greater than 0.1 μm/min can be achieved.
摘要翻译：本发明提供一种抛光组合物，其不包含研磨剂，并且用于研磨硅晶片，所述抛光组合物包括pH缓冲剂，抛光促进剂，水溶性聚合物和嵌段型化合物。通过使用抛光组合物研磨硅晶片，可以实现大于0.1mum / min的抛光速度。

5. 发明申请

US20100294983A1 POLISHING COMPOSITION 有权
标题翻译：抛光组合物
公开(公告)号：US20100294983A1
公开(公告)日：2010-11-25
申请号：US12733913
申请日：2008-09-29
申请人： Takayuki Matsushita , Masashi Teramoto , Haruki Nojo
发明人： Takayuki Matsushita , Masashi Teramoto , Haruki Nojo
IPC分类号： C09K13/00
CPC分类号： C09G1/02 , C09K3/1463 , C09K13/02 , H01L21/02024
摘要： A polishing composition that can improve polishing property without foaming is provided. A polishing composition includes a pH regulator, a water-soluble polymer compound, and a compound containing an alkylene diamine structure having two nitrogens represented by the following general formula (1), and having at least one block type polyether bonded to the two nitrogens of the alkylene structure, the block type polyether having a bond of an oxyethylene group and an oxypropylene group: where R represents an alkylene group represented by CnH2n, in which n is an integer of 1 or more.
摘要翻译：提供可以提高抛光性而不发泡的抛光组合物。抛光组合物包括pH调节剂，水溶性聚合物化合物和含有由以下通式（1）表示的具有两个氮的亚烷基二胺结构的化合物，并且具有至少一个与两个氮结合的嵌段型聚醚亚烷基结构，具有氧化乙烯基和氧化亚丙基的键的嵌段型聚醚：其中R表示由C n H 2n表示的亚烷基，其中n为1或更大的整数。

6. 发明授权

US5816175A Thread control apparatus for a double chain stitch sewing machine 失效
标题翻译：双链缝纫机的螺纹控制装置
公开(公告)号：US5816175A
公开(公告)日：1998-10-06
申请号：US837011
申请日：1997-04-11
申请人： Masashi Teramoto
发明人： Masashi Teramoto
IPC分类号： D05B1/10 , D05B47/04 , D05B63/00 , D05B49/00
CPC分类号： D05B1/10 , D05B47/04
摘要： A thread control apparatus for a double chain stitch sewing machine of the present invention is applied to the case of sewing a cloth with a double chain stitch sewing machine having multiple needles, and forming a thread chain consecutively to the sewing end of the cloth. Two thread tensioning devices change over and apply mutually different thread tensions to needle threads and to a looper thread passed through a plurality of needles and a looper, respectively, when sewing the cloth and when forming a thread chain. An other looper thread tensioning device disposed in a thread route between a looper thread take-up device and the looper. The other looper thread tensioning device limits the draw-out amount of thread by pinching the looper thread from the looper thread take-up device to the looper side only when forming a thread chain, and therefore a tight thread chain may be securely formed when forming a thread chain. As such, the thread chain can be drawn out securely and stably even in high speed operation of the sewing machine.
摘要翻译：本发明的双链式针迹缝纫机的线程控制装置适用于用具有多针的双链式针迹缝纫机对布进行缝制的情况，并且连续地形成到针织物的缝纫端。两个线张紧装置在缝合布和形成线链时，分别切换并施加相互不同的线张力到针线和穿过多根针和弯针的弯针线。另一种弯针线张紧装置，设置在弯针线收卷装置和弯针之间的线路中。另一个弯针线张紧装置仅在形成线链时将弯针线从弯针线收紧装置夹到弯针侧，从而限制线的拉出量，因此当成形时可以牢固地形成紧线一条线链。因此，即使在缝纫机的高速运转中，线链也能够稳定且稳定地拉出。

7. 发明授权

US5722441A Electronic device process apparatus 失效
标题翻译：电子装置处理装置
公开(公告)号：US5722441A
公开(公告)日：1998-03-03
申请号：US753032
申请日：1996-11-19
申请人： Masashi Teramoto
发明人： Masashi Teramoto
IPC分类号： H01L21/304 , B08B3/10 , H01L21/00 , H01L21/22 , H01L21/306 , B08B3/02
CPC分类号： B08B3/10 , H01L21/02052 , H01L21/67028 , H01L21/67207 , H01L21/67253 , Y10S134/902
摘要： A process apparatus for processing semiconductor wafers. It includes a process vessel in which process solution is contained. In the process solution, the wafers are immersed and processed. A supply pipe extends from the process vessel to solution storing vessels. Component solutions are stored in the component solution storing vessels and supplied from them to the process vessel to keep the concentration of each component in process solution. A supply pump is attached to the supply pipe. Valves for adjusting the amount of each component supplied are attached to the supply pipe. The adjusting valves are electrically connected to a CPU. Data representing that concentration of each component in process solution which changes with passage of time are previously stored in the CPU. The CPU controls the adjusting valves on the basis of the data to supply component solutions into the process vessel so as to meet any change in the concentration of each component in process solution in the process vessel. The concentration of each component in process solution can be thus kept to be a predetermined value. This enables the wafers in every batch to be uniformly washed.
摘要翻译：一种用于处理半导体晶片的处理装置。它包括其中包含工艺溶液的处理容器。在工艺解决方案中，将晶片浸入并处理。供应管从处理容器延伸到溶液储存容器。组分溶液存储在组分溶液储存容器中并从它们提供给处理容器以保持每个组分在过程溶液中的浓度。供应泵连接到供应管。用于调节供应的每个部件的量的阀连接到供应管。调节阀电连接到CPU。表示过程解决中随时间变化的每个组件的浓度的数据预先存储在CPU中。 CPU根据数据控制调节阀，以将组件溶液供应到处理容器中，以满足处理容器中处理溶液中各组分浓度的任何变化。因此，处理溶液中的每种组分的浓度可以保持为预定值。这使得每批中的晶片能够被均匀地洗涤。

8. 发明授权

US08540894B2 Polishing composition 有权
标题翻译：抛光组成
公开(公告)号：US08540894B2
公开(公告)日：2013-09-24
申请号：US12733913
申请日：2008-09-29
申请人： Takayuki Matsushita , Masashi Teramoto , Haruki Nojo
发明人： Takayuki Matsushita , Masashi Teramoto , Haruki Nojo
IPC分类号： C09K13/00
CPC分类号： C09G1/02 , C09K3/1463 , C09K13/02 , H01L21/02024
摘要： A polishing composition that can improve polishing property without foaming is provided. A polishing composition includes a pH regulator, a water-soluble polymer compound, and a compound containing an alkylene diamine structure having two nitrogens represented by the following general formula (1), and having at least one block type polyether bonded to the two nitrogens of the alkylene structure, the block type polyether having a bond of an oxyethylene group and an oxypropylene group: where R represents an alkylene group represented by CnH2n, in which n is an integer of 1 or more.
摘要翻译：提供可以提高抛光性而不发泡的抛光组合物。抛光组合物包括pH调节剂，水溶性聚合物化合物和含有由以下通式（1）表示的具有两个氮的亚烷基二胺结构的化合物，并且具有至少一个与两个氮结合的嵌段型聚醚亚烷基结构，具有氧化乙烯基和氧化亚丙基的键的嵌段型聚醚：其中R表示由C n H 2n表示的亚烷基，其中n为1或更大的整数。

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