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111. 发明申请

US20050221538A1 Resin encapsulated semiconductor device and the production method 有权
公开(公告)号：US20050221538A1
公开(公告)日：2005-10-06
申请号：US11062867
申请日：2005-02-23
申请人： Kazuhiro Suzuki , Toshiaki Morita , Hisayuki Imamura , Junichi Watanabe , Mitsuaki Chiba
发明人： Kazuhiro Suzuki , Toshiaki Morita , Hisayuki Imamura , Junichi Watanabe , Mitsuaki Chiba
IPC分类号： H01L23/12 , H01L21/44 , H01L21/58 , H01L23/24 , H01L23/36 , H01L23/373 , H01L23/488 , H01L23/498 , H01L25/07 , H01L25/18 , H01R43/02 , H05K1/03 , H05K3/00 , H05K3/34
CPC分类号： H05K3/0061 , H01L23/24 , H01L23/3735 , H01L23/488 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32225 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/92247 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01028 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/19107 , H05K1/0306 , H05K3/341 , H05K2201/0215 , H05K2201/2036 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device having both high strength and high thermal radiation that is capable of being applied to mounting on automobiles experiencing many thermal cycles, and a manufacturing method thereof are provided. A circuit board 1a for a resin encapsulated semiconductor module device has a configuration where a silicon nitride plate 2 with a thickness of 0.635 mm has copper plates of 1.0 mm and 0.8 mm bonded to both sides thereof via active metal. A copper plate 3a is bonded to the surface side of the silicon nitride plate 2, and a prescribed circuit pattern is formed on the copper plate 3a. Tin-silver-copper cream solder layers 4a and 4b with a thickness of 200 μm are formed at a prescribed location on the circuit pattern 3a on which a semiconductor element 6 is mounted and at a prescribed location of a base plate 1 on which the circuit board 1a is disposed. Nickel particles 5 having a maximum particle size of 100 μm and an average particle size of 70 μm are dispersed in the solder 4a on the base plate 1 of good thermal conductivity. A semiconductor element (chip) 6, the circuit board 1a, and the base plate 1 are disposed on predetermined locations. Thereafter, they are set in a reflow oven (not shown in the drawings) for reflow soldering. After the inside of the reflow oven is replaced by a nitrogen atmosphere, the reflow oven is heated to 280° C. At the time when solder is melted, the inside of the oven is decompressed to 1 Pa, nitrogen is introduced, and the reflow oven is cooled to about room temperature, thereby completing the solder bonding step. After flux is washed, an outer case 7 with an insert-molded outlet terminal 8 is adhered to the base plate 1 and a predetermined connection is conducted via an aluminum bonding wire 9. Then, silicone gel 10 is injected into a package delimited via the base plate 1 and the outer case 7, and the silicone gel 10 is heat-hardened, thereby completing a resin encapsulated semiconductor device A.

112. 发明授权

US06904774B2 Composite needs 失效
标题翻译：复合需求
公开(公告)号：US06904774B2
公开(公告)日：2005-06-14
申请号：US10399469
申请日：2001-10-15
申请人： Toshiaki Morita
发明人： Toshiaki Morita
IPC分类号： D04B35/06
CPC分类号： D04B35/06
摘要： A tongue (67) is provided, at a front end thereof, with a drop-loop preventing step (79), and the hook (11) is provided, on an outer edge portion thereof extending from a sharp-pointed tip (27) of the hook to a top (29) of the hook, with a loop escape surface (31) to hide the drop-loop preventing step (79) when the hook (11) is closed by the tongue (67). In addition, the front end of the tongue is lowered so that a height between a bottom of the needle body and a top of the drop-loop preventing step (79) is lowered more when the slider is in a knock-over position than before the slider arrives at the knock-over position and also the top of the drop-loop preventing step (79) positioned at the knocked-over position can be positioned at a lower level than the top (29) of the hook. This can allow can allow a further smooth knock-over of the loop without negative effects on the yarn feed requirements for the capture of the yarn by the needle hook.
摘要翻译：在其前端设有舌部（67），其具有防滴环防止步骤（79），并且在从尖锐尖端（27）延伸的外边缘部分上设置有钩（11）的钩子连接到钩的顶部（29），当钩子（11）被舌头（67）关闭时，具有环形逃逸表面（31）以隐藏防滴环防止步骤（79）。此外，舌头的前端被降低，使得当滑块处于比之前的敲击位置时，针体的底部与防滴环防止步骤（79）的顶部之间的高度降低得更多滑块到达撞击位置，并且位于敲击位置的防滴环步骤（79）的顶部也可以位于比钩的顶部（29）更低的位置。这可以允许循环的进一步平滑的敲击，而不会对通过针钩捕获纱线的喂纱要求产生负面影响。

113. 发明授权

US06900551B2 Semiconductor device with alternate bonding wire arrangement 有权
标题翻译：具有交替接合线布置的半导体器件
公开(公告)号：US06900551B2
公开(公告)日：2005-05-31
申请号：US10430279
申请日：2003-05-07
申请人： Tomoo Matsuzawa , Takafumi Nishita , Yasuyuki Nakajima , Toshiaki Morita
发明人： Tomoo Matsuzawa , Takafumi Nishita , Yasuyuki Nakajima , Toshiaki Morita
IPC分类号： H01L23/48 , H01L21/60 , H01L23/498 , H01L25/065
CPC分类号： H01L24/85 , H01L23/49838 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05624 , H01L2224/05647 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/4809 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48465 , H01L2224/48624 , H01L2224/48647 , H01L2224/49052 , H01L2224/49171 , H01L2224/49431 , H01L2224/49433 , H01L2224/73265 , H01L2224/85 , H01L2224/85203 , H01L2224/85205 , H01L2224/97 , H01L2225/0651 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01079 , H01L2924/014 , H01L2924/05042 , H01L2924/1306 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19043 , H01L2924/01039 , H01L2224/78 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device comprising a plurality of wires for electrically connecting a plurality of electrode pads arranged on a main surface of a semiconductor chip along one side of the semiconductor chip to a plurality of connecting portions arranged on the main surface of a wiring substrate along one side of the semiconductor chip, respectively, wherein second wires out of the plural wires consisting of first and second wires adjacent to each other have a larger loop height than the first wires, one end portions of the second wires are connected to the electrode pads at positions farther from one side of the semiconductor chip than the one end portions of the first wires, and the other end portions of the second wires are connected to the connecting portions at positions farther from one side of the semiconductor chip than the other end portions of the first wires.
摘要翻译：一种半导体器件，包括多个引线，用于将布置在半导体芯片的主表面上的多个电极焊盘沿着半导体芯片的一侧电连接到布置在布线基板的主表面上的多个连接部分其中，由彼此相邻的第一和第二布线组成的多根导线中的第二布线具有比第一布线更大的环形高度，第二布线的一个端部在电极焊盘的位置处连接比半导体芯片的一侧比第一布线的一个端部更远，而第二布线的另一个端部连接到比半导体芯片的另一个端部更远离半导体芯片的一侧的连接部分第一根电线

115. 发明授权

US06568223B1 Guide mechanism of knitting member and compound needle assembling the guide mechanism therein 有权
标题翻译：针织机构和复合针组装引导机构
公开(公告)号：US06568223B1
公开(公告)日：2003-05-27
申请号：US10089091
申请日：2002-04-11
申请人： Toshiaki Morita
发明人： Toshiaki Morita
IPC分类号： D04B704
CPC分类号： D04B35/06
摘要： A first knitting member 5 has a fork portion 38 extending forwardly formed in an upper portion of a side wall(s) of the first knitting member at an accommodation groove forming portion 33 thereof where the accommodation groove 32 for accommodating the second knitting member 7 is formed, while also the second knitting member 7 has a guiding portion 55 formed to be curved outwardly so that its upper surface can confront a lower surface of the fork portion 38 formed on the side wall(s) of the first knitting member 5, so that while the second knitting member 7 is moved relative to the first knitting member 5, the guiding portion 55 of the second knitting member 7 is guided into a space formed under the fork portion 38 of the first knitting member 5 and supported by the fork portion 38 during at least part of the relative movement.
摘要翻译：第一编织部件5具有在第一编织部件的侧壁的上部向前方形成的叉部38，该收纳槽形成部33的容纳第二针织部件7的收纳槽32为而第二编织构件7也具有形成为向外弯曲的引导部55，使得其上表面可以面对形成在第一编织构件5的侧壁上的叉部38的下表面，因此当第二编织构件7相对于第一编织构件5移动时，第二编织构件7的引导部55被引导到形成在第一编织构件5的叉部38下方的空间中，并被叉部 38在至少部分相对运动期间。

116. 发明授权

US06568222B1 Sinker device of flat knitting machine 失效
标题翻译：横机的沉没装置
公开(公告)号：US06568222B1
公开(公告)日：2003-05-27
申请号：US10110764
申请日：2002-04-24
申请人： Toshiaki Morita
发明人： Toshiaki Morita
IPC分类号： D04B1506
CPC分类号： D04B15/362 , D04B15/06 , D04B15/10 , D04B15/70
摘要： A sinker device comprises a sinker jack 50 which can be freely advanced and retracted with respect to a needle bed gap 4 and a sinker 30 supported on an upper surface of the sinker jack formed as a supporting surface in a freely swingable manner. The sinker 30 and the sinker jack 50 have sliding contact surfaces sidably contactable with each other which are each formed at a front side thereof with respect to a swinging pivot point. When the sinker jack 50 is advanced toward the needle bed gap 4 to move relative to the sinker 30, the sinker 30 takes the swinging attitude controlled by the sliding contact relation between the respective sliding contact surfaces of the sinker and the sinker jack, so that the sinker 30 is controllably swung to at least a knitted loop pushing level, a knitted loop releasing level and a stitch forming level.
摘要翻译：沉降片装置包括可相对于针床间隙4自由前进和缩回的沉降片插入件50和以可自由摆动的方式支撑在形成为支撑表面的沉降片插座的上表面上的沉降片30。沉降片30和沉降片插孔50具有彼此相对滑动接触的滑动接触表面，它们各自形成在相对于摆动枢转点的前侧。当沉降片插座50朝向针床间隙4前进以相对于沉降片30移动时，沉降片30采取由沉降片和沉降片插孔的各个滑动接触表面之间的滑动接触关系控制的摆动姿势，使得沉降片30被可控制地摆动到至少编织的环向推动水平，编织环释放水平和缝合形成水平。

117. 发明授权

US5767577A Method of solder bonding and power semiconductor device manufactured by the method 失效
标题翻译：通过该方法制造的焊接方法和功率半导体器件
公开(公告)号：US5767577A
公开(公告)日：1998-06-16
申请号：US568234
申请日：1995-12-06
申请人： Masayasu Nihei , Jin Onuki , Toshiaki Morita
发明人： Masayasu Nihei , Jin Onuki , Toshiaki Morita
IPC分类号： B23K1/20 , B23K1/00 , C23F4/00 , H01L21/48 , H01L23/12 , H01L21/58
CPC分类号： H01L24/85 , B23K1/0008 , H01L21/4807 , H01L21/4864 , H01L21/4882 , B23K2201/40 , H01L2224/48091 , H01L2224/48227 , H01L2224/8501 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/15787 , H01L2924/3025
摘要： A method of solder bonding suitable for a body having a large bonding surface area including the following steps of cleaning off the bonding surfaces in vacuum chamber by impinging accelerated particles such as argon ions through reverse spattering; then covering with an oxidation inhibiting thin silver film over the cleaned off bonding surfaces through spattering; further sandwiching a cleaned off solder foil between the bonding surfaces covered with the oxidation inhibiting thin sliver film; and heating the solder foil in vacuum upto the melting temperature thereof to complete the bonding, whereby defects in the solder bonding is reduced downto about 1/25 and life time of the solder bonding which is affected by thermal fatigue is prolonged twice in comparison with a conventional solder bonding method, thereby reliability of the solder bonding is greatly improved.
摘要翻译：一种适合于具有大的接合表面积的本体的焊接方法，包括以下步骤：通过反溅射冲击加速的诸如氩离子的颗粒，从而清除真空室中的接合表面; 然后通过溅射在被清除的粘合表面上用氧化抑制性薄银膜覆盖; 在被氧化抑制薄条膜覆盖的接合表面之间进一步夹持清洁的焊料箔; 并将真空中的焊锡箔加热至其熔融温度，以完成接合，由此焊接接合中的缺陷降低至约+ E，fra 1/25 + EE，受热疲劳影响的焊料的使用寿命为与常规焊接方法相比延长了两倍，从而极大地提高了焊接接合的可靠性。

118. 发明授权

US5573442A Apparatus for measuring a cutting blade width in a cutting apparatus 失效
标题翻译：用于测量切割装置中切割刀片宽度的装置
公开(公告)号：US5573442A
公开(公告)日：1996-11-12
申请号：US292225
申请日：1994-08-22
申请人： Toshiaki Morita , Toshiro Ochi
发明人： Toshiaki Morita , Toshiro Ochi
IPC分类号： B24B3/36 , B26D7/12 , B26D7/26 , G01B21/08 , G05B19/404 , B24B49/00
CPC分类号： G05B19/404 , B24B3/361 , B26D7/12 , B26D7/2628 , G05B2219/45159 , G05B2219/50309 , Y10T83/089 , Y10T83/303
摘要： An apparatus for measuring the width of a cutting blade in a linear motor is activated when the cutting blade is raised. A working pin is advanced and one end of a detecting pin is abutted against an edge of the cutting blade. Thereafter, the working pin is returned. The blade width is derived by deducting the number of inputted driving pulses in returning from the advanced position of the detecting pin. The cutting blade is polished each polishing cycle for predetermined times by polishing rollers. The width of the cutting blade is measured by blade width detecting means during each predetermined polishing cycle. The measurement value of the blade width is fed back into a control device so that the subsequent polishing time of the cutting blade with the polishing rollers is adjusted until it becomes appropriate. The expiration of the useful life of the polishing rollers is determined when a long polishing time is required.
摘要翻译：当切割刀片升高时，激活用于测量线性电动机中的切割刀片的宽度的装置。工作销先进，检测销的一端与切割刀片的边缘抵接。此后，返回工作针。通过减去从检测销的前进位置返回的输入驱动脉冲的数量导出刀片宽度。通过抛光辊将切割刀片抛光每个抛光循环预定次数。在每个预定的抛光循环期间，刀片宽度检测装置测量切割刀片的宽度。刀片宽度的测量值被反馈到控制装置中，从而调整切割刀片与研磨辊的后续抛光时间，直到适当。当需要长的抛光时间时，确定抛光辊的使用寿命期满。

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