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    • 115. 发明申请
    • HIGH BANDWIDTH ONE TIME FIELD-PROGRAMMABLE MEMORY
    • 高带宽一次性可编程存储器
    • US20080025061A1
    • 2008-01-31
    • US11461410
    • 2006-07-31
    • Roy E. ScheuerleinChristopher J. Petti
    • Roy E. ScheuerleinChristopher J. Petti
    • G11C17/00G11C11/00
    • G11C8/06G11C5/145G11C5/147G11C7/12G11C8/08G11C8/12G11C11/5692G11C13/0023G11C13/0026G11C13/0028G11C13/003G11C13/0038G11C17/16G11C17/165G11C17/18G11C2213/71G11C2213/72G11C2213/74
    • A one-time field programmable (OTP) memory cell with related manufacturing and programming techniques is disclosed. An OTP memory cell in accordance with one embodiment includes at least one resistance change element in series with a steering element. The memory cell is field programmed using a reverse bias operation that can reduce leakage currents through the array as well as decrease voltage levels that driver circuitry must normally produce in program operations. An array of memory cells can be fabricated by switching the memory cells from their initial virgin state to a second resistance state during the manufacturing process. In one embodiment, the factory switching operation can include popping an anti-fuse of each memory cell to set them into the second resistance state. The array of memory cells in the second resistance state are provided to an end-user. Control circuitry is also provided with the memory array that can switch the resistance of selected cells back toward their initial resistance state to program the array in accordance with data received from a user or host device.
    • 公开了具有相关制造和编程技术的一次性现场可编程(OTP)存储单元。 根据一个实施例的OTP存储器单元包括与转向元件串联的至少一个电阻变化元件。 使用反向偏置操作来对存储单元进行现场编程,该反向偏压操作可以减少通过阵列的漏电流,以及降低驱动器电路在程序运行中通常产生的电压电平。 可以通过在制造过程中将存储器单元从其初始状态切换到第二电阻状态来制造存储器单元阵列。 在一个实施例中,出厂切换操作可以包括弹出每个存储单元的反熔丝以使它们成为第二电阻状态。 将第二电阻状态的存储单元的阵列提供给终端用户。 控制电路还具有存储器阵列,其可以将所选择的单元的电阻切换回其初始电阻状态,以根据从用户或主机设备接收的数据对阵列进行编程。
    • 116. 发明授权
    • Decoding circuit for non-binary groups of memory line drivers
    • 用于非二进制组的存储器线路驱动器的解码电路
    • US07272052B2
    • 2007-09-18
    • US11146952
    • 2005-06-07
    • Roy E. ScheuerleinChristopher J. PettiLuca G. Fasoli
    • Roy E. ScheuerleinChristopher J. PettiLuca G. Fasoli
    • G11C16/06
    • G11C8/10G11C5/063G11C8/08G11C8/14
    • A decoding circuit for non-binary groups of memory line drivers is disclosed. In one embodiment, an integrated circuit is disclosed comprising a binary decoder and circuitry operative to perform a non-binary arithmetic operation, wherein a result of the non-binary arithmetic operation is provided as input to the binary decoder. In another embodiment, an integrated circuit is disclosed comprising a memory array comprising a plurality of array lines, a non-integral-power-of-two number of array line driver circuits, and control circuitry configured to select one of the array line driver circuits. The control circuitry can comprise a binary decoder and a pre-decoder portion that performs a non-binary arithmetic operation. The concepts described herein may be used alone or in combination.
    • 公开了一种用于非二进制组的存储器线驱动器的解码电路。 在一个实施例中,公开了一种集成电路,其包括二进制解码器和用于执行非二进制算术运算的电路,其中非二进制算术运算的结果被提供作为二进制解码器的输入。 在另一个实施例中,公开了一种集成电路,其包括存储器阵列,该存储器阵列包括多个阵列线,两个非整数倍数量的阵列线驱动器电路,以及控制电路,被配置为选择阵列线驱动电路之一 。 控制电路可以包括执行非二进制算术运算的二进制解码器和预解码器部分。 本文所述的概念可以单独使用或组合使用。
    • 120. 发明授权
    • High-voltage transistor and fabrication process
    • 高压晶体管及制造工艺
    • US06501139B1
    • 2002-12-31
    • US09823503
    • 2001-03-30
    • Christopher J. Petti
    • Christopher J. Petti
    • H01L2900
    • H01L29/0653H01L21/26586H01L21/823807H01L21/823814H01L27/0922H01L29/66659H01L29/7835
    • A high-voltage transistor and fabrication process in which the fabrication of the high-voltage transistor can be readily integrated into a conventional CMOS fabrication process. The high-voltage transistor of the invention includes a channel region formed beneath a portion of the gate electrode after the gate electrode has been formed on the surface of a semiconductor substrate. In a preferred embodiment, the channel region is formed by the angled ion implantation of dopant atoms using an edge of the gate electrode as a doping mask. The high-voltage transistor of the invention further includes a drain region that is spaced apart from the channel region by a portion of a well region and by an isolation region residing in the semiconductor substrate. By utilizing the process of the invention to fabricate the high-voltage transistor, the transistor can be integrated into an existing CMOS device with minimal allocation of additional substrate surface area.
    • 一种高压晶体管和制造工艺,其中高压晶体管的制造可以容易地集成到常规CMOS制造工艺中。 本发明的高电压晶体管包括在栅极形成在半导体衬底的表面上之后形成在栅电极的一部分下方的沟道区。 在优选实施例中,通过使用栅电极的边缘作为掺杂掩模的掺杂剂原子的成角度的离子注入形成沟道区。 本发明的高压晶体管还包括漏极区域,其通过阱区域的一部分和位于半导体衬底中的隔离区域与沟道区域间隔开。 通过利用本发明的方法制造高压晶体管,可以以最小的附加衬底表面积的分配将晶体管集成到现有的CMOS器件中。