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    • 117. 发明授权
    • Tone inversion of self-assembled self-aligned structures
    • 自组装自对准结构的音调反演
    • US08921030B2
    • 2014-12-30
    • US13603869
    • 2012-09-05
    • Michael A. GuillornSteven J. HolmesChi-Chun LiuHiroyuki MiyazoeHsinyu Tsai
    • Michael A. GuillornSteven J. HolmesChi-Chun LiuHiroyuki MiyazoeHsinyu Tsai
    • G03F7/00
    • H01L21/0337B81C1/00031B81C2201/0149H01L21/3086
    • A stack of an organic planarization layer (OPL) and a template layer is provided over a substrate. The template layer is patterned to induce self-assembly of a copolymer layer to be subsequently deposited. A copolymer layer is deposited and annealed to form phase-separated copolymer blocks. An original self-assembly pattern is formed by removal of a second phase separated polymer relative to a first phase separated polymer. The original pattern is transferred into the OPL by an anisotropic etch, and the first phase separated polymer and the template layer are removed. A spin-on dielectric (SOD) material layer is deposited over the patterned OPL that includes the original pattern to form SOD portions that fill trenches within the patterned OPL. The patterned OPL is removed selective to the SOD portions, which include a complementary pattern. The complementary pattern of the SOD portions is transferred into underlying layers by an anisotropic etch.
    • 在衬底上设置有机平面化层(OPL)和模板层的叠层。 将模板层图案化以引起随后沉积的共聚物层的自组装。 共聚物层被沉积并退火以形成相分离的共聚物嵌段。 通过相对于第一相分离的聚合物除去第二相分离的聚合物形成原始的自组装图案。 原始图案通过各向异性蚀刻转移到OPL中,并且去除第一相分离的聚合物和模板层。 在包含原始图案的图案化OPL上沉积旋涂电介质(SOD)材料层,以形成填充图案化OPL内的沟槽的SOD部分。 图案化的OPL被选择性地移除到包括互补图案的SOD部分。 SOD部分的互补图案通过各向异性蚀刻转移到下面的层中。
    • 118. 发明申请
    • Method to Transfer Lithographic Patterns Into Inorganic Substrates
    • 将光刻图案转移到无机基板中的方法
    • US20130026133A1
    • 2013-01-31
    • US13191985
    • 2011-07-27
    • Sebastian Ulrich EngelmannMartin GloddeMichael A. Guillorn
    • Sebastian Ulrich EngelmannMartin GloddeMichael A. Guillorn
    • C23F1/02
    • H01L21/0337G03F7/0043G03F7/0757G03F7/094H01L21/0332
    • Techniques for minimizing or eliminating pattern deformation during lithographic pattern transfer to inorganic substrates are provided. In one aspect, a method for pattern transfer into an inorganic substrate is provided. The method includes the following steps. The inorganic substrate is provided. An organic planarizing layer is spin-coated on the inorganic substrate. The organic planarizing layer is baked. A hardmask is deposited onto the organic planarizing layer. A photoresist layer is spin-coated onto the hardmask. The photoresist layer is patterned. The hardmask is etched through the patterned photoresist layer using reactive ion etching (RIE). The organic planarizing layer is etched through the etched hardmask using RIE. A high-temperature anneal is performed in the absence of oxygen. The inorganic substrate is etched through the etched organic planarizing layer using reactive ion etching.
    • 提供了在将光刻图案转移到无机基底期间最小化或消除图案变形的技术。 一方面,提供了图案转印到无机基板中的方法。 该方法包括以下步骤。 提供无机基材。 将有机平面化层旋涂在无机基材上。 烘烤有机平坦化层。 硬掩模沉积在有机平坦化层上。 将光致抗蚀剂层旋涂在硬掩模上。 对光刻胶层进行图案化。 使用反应离子蚀刻(RIE),通过图案化的光刻胶层蚀刻硬掩模。 使用RIE蚀刻通过蚀刻的硬掩模的有机平坦化层。 在不存在氧的情况下进行高温退火。 使用反应离子蚀刻通过蚀刻的有机平坦化层蚀刻无机衬底。
    • 119. 发明申请
    • Silicide Micromechanical Device and Methods to Fabricate Same
    • 硅化物微机械装置及其制造方法
    • US20120318649A1
    • 2012-12-20
    • US13164126
    • 2011-06-20
    • Michael A. GuillornEric A. JosephFei LiuZhen Zhang
    • Michael A. GuillornEric A. JosephFei LiuZhen Zhang
    • H01H57/00H01L21/285
    • B81C1/00666B81C1/00952H01H1/0094H01H2001/0078
    • A method is disclosed to fabricate an electro-mechanical device such as a MEMS or NEMS switch. The method includes providing a silicon layer disposed over an insulating layer that is disposed on a silicon substrate; releasing a portion of the silicon layer from the insulating layer so that it is at least partially suspended over a cavity in the insulating layer; depositing a metal (e.g., Pt) on at least one surface of at least the released portion of the silicon layer and, using a thermal process, fully siliciding at least the released portion of the silicon layer using the deposited metal. The method eliminates silicide-induced stress to the released Si member, as the entire Si member is silicided. Furthermore no conventional wet chemical etch is used after forming the fully silicided material thereby reducing a possibility of causing corrosion of the silicide and an increase in stiction.
    • 公开了一种制造诸如MEMS或NEMS开关的机电装置的方法。 该方法包括提供设置在设置在硅衬底上的绝缘层上的硅层; 从所述绝缘层释放所述硅层的一部分,使得其至少部分地悬挂在所述绝缘层中的空腔上; 在至少所述硅层的释放部分的至少一个表面上沉积金属(例如Pt),并且使用热处理,使用沉积的金属至少完全硅化硅层的释放部分。 当整个Si元件被硅化时,该方法消除了对释放的Si元件的硅化物引起的应力。 此外,在形成完全硅化材料之后,也不使用常规的湿化学蚀刻,从而减少引起硅化物腐蚀和粘性增加的可能性。