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111. 发明授权

US06507527B1 Memory line discharge before sensing 有权
标题翻译：感应前存储线放电
公开(公告)号：US06507527B1
公开(公告)日：2003-01-14
申请号：US09698614
申请日：2000-10-27
申请人： Lee Cleveland , Jin-Lien Lin , Takao Akaogi , Ali Al-Shamma , Boon Tang Teh , Kendra Nguyen , Yong Kim
发明人： Lee Cleveland , Jin-Lien Lin , Takao Akaogi , Ali Al-Shamma , Boon Tang Teh , Kendra Nguyen , Yong Kim
IPC分类号： G11C700
CPC分类号： G11C7/06 , G11C7/12
摘要： A method of charging a data line to a desired voltage level prior to the data line being sensed in a low power memory device by discharging the data line from a voltage level above the desired voltage level to approximately the desired voltage level. By using N-type transistors to discharge the data line to the desired voltage level, the voltage level can be reached faster with cheaper components.
摘要翻译：一种通过将数据线从高于期望电压电平的电压电平放电到大约期望的电压电平，在数据线在低功率存储器件中被感测之前将数据线充电到期望的电压电平的方法。通过使用N型晶体管将数据线放电至期望的电压电平，可以用更便宜的组件更快地达到电压电平。

112. 发明授权

US06245490B1 Method of manufacturing a circuit board having metal bumps and a semiconductor device package comprising the same 失效
标题翻译：制造具有金属凸块的电路板的方法和包括该凸起的半导体器件封装的方法
公开(公告)号：US06245490B1
公开(公告)日：2001-06-12
申请号：US09506593
申请日：2000-02-18
申请人： Jin Hyun Yoon , Gi Bum Park , In Pyo Hong , Yong Kim , Myung Kee Chung
发明人： Jin Hyun Yoon , Gi Bum Park , In Pyo Hong , Yong Kim , Myung Kee Chung
IPC分类号： G03F700
CPC分类号： H01L23/3107 , H01L23/3114 , H01L23/49833 , H01L24/48 , H01L2224/32225 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/30107 , H05K1/113 , H05K3/064 , H05K3/244 , H05K3/4007 , H05K3/423 , H05K2201/0347 , H05K2201/0355 , H05K2201/0367 , H05K2201/0379 , H05K2201/0394 , H05K2201/09563 , H05K2203/0369 , H05K2203/0542 , Y10T29/49117 , Y10T29/49144 , Y10T29/49146 , Y10T29/49165 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399 , H01L2924/00012
摘要： A first method of manufacturing a printed circuit board includes steps of (a) preparing a board which has a chip mounting area and circuit patterns on an upper surface and metal pads to be electrically connected to the circuit patterns on a lower surface, (b) attaching a metal plate to the lower surface of the board, (c) forming metal patterns on the metal pads by etching the metal plate, and (d) forming metal bumps by plating the metal patterns. A second method of manufacturing a circuit board, in this case a flexible circuit board, includes the steps of (a) preparing a board having Cu patterns, plated with a Au layer, attached to a lower surface of a polyimide tape, (b) forming a plurality of via holes in the polyimide tape, which expose the Cu patterns to the upper surface of the polyimide tape, (c) coating the upper surface of the polyimide tape with a photoresist, and exposing and developing the photoresist to form openings therein which expose the via holes, (d) plating walls, defining the openings and the via holes, with Cu, (e) removing remaining portions of the photoresist to produce Cu bumps, and (f) plating the bumps to protect the Cu. The printed circuit boards of the present invention have advantages in that they are not subject to a misalignment of the metal bumps with their underlying conductive pattern, and eliminate the need to use flux, thereby being environmentally friendly.
摘要翻译：制造印刷电路板的第一种方法包括以下步骤：（a）制备具有芯片安装区域和上表面上的电路图案的板，以及与下表面上的电路图案电连接的金属焊盘;（b）将金属板附着到板的下表面，（c）通过蚀刻金属板在金属焊盘上形成金属图案，（d）通过镀金属图案形成金属凸块。制造电路板的第二种方法（在这种情况下为柔性电路板）包括以下步骤：（a）准备具有附着在聚酰亚胺胶带的下表面上的镀有Au层的Cu图案的板，（b）在聚酰亚胺胶带中形成多个通孔，将Cu图案暴露于聚酰亚胺胶带的上表面，（c）用光致抗蚀剂涂覆聚酰亚胺胶带的上表面，并曝光和显影光致抗蚀剂以在其中形成开口其暴露通孔，（d）用Cu限定开口和通孔的电镀壁，（e）除去光致抗蚀剂的剩余部分以产生Cu凸块，以及（f）电镀凸块以保护Cu。本发明的印刷电路板的优点在于，它们不会使金属凸块与其下面的导电图案不对准，并且不需要使用助焊剂，因此是环境友好的。

113. 发明授权

US6041495A Method of manufacturing a circuit board having metal bumps and a semiconductor device package comprising the same 失效
标题翻译：制造具有金属凸块的电路板的方法和包括该凸起的半导体器件封装的方法
公开(公告)号：US6041495A
公开(公告)日：2000-03-28
申请号：US87929
申请日：1998-06-01
申请人： Jin Hyun Yoon , Gi Bum Park , In Pyo Hong , Yong Kim , Myung Kee Chung
发明人： Jin Hyun Yoon , Gi Bum Park , In Pyo Hong , Yong Kim , Myung Kee Chung
IPC分类号： H01L23/12 , H01L21/60 , H01L23/31 , H01L23/498 , H05K1/11 , H05K3/00 , H05K3/06 , H05K3/24 , H05K3/40 , H05K3/42 , H05K3/30
CPC分类号： H01L23/3107 , H01L23/3114 , H01L23/49833 , H05K3/4007 , H01L2224/32225 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/73265 , H01L24/48 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/30107 , H05K1/113 , H05K2201/0347 , H05K2201/0355 , H05K2201/0367 , H05K2201/0379 , H05K2201/0394 , H05K2201/09563 , H05K2203/0369 , H05K2203/0542 , H05K3/064 , H05K3/244 , H05K3/423 , Y10T29/49117 , Y10T29/49144 , Y10T29/49146 , Y10T29/49165
摘要： A first method of manufacturing a printed circuit board includes steps of (a) preparing a board which has a chip mounting area and circuit patterns on an upper surface and metal pads to be electrically connected to the circuit patterns on a lower surface, (b) attaching a metal plate to the lower surface of the board, (c) forming metal patterns on the metal pads by etching the metal plate, and (d) forming metal bumps by plating the metal patterns. A second method of manufacturing a circuit board, in this case a flexible circuit board, includes the steps of (a) preparing a board having Cu patterns, plated with a Au layer, attached to a lower surface of a polyimide tape, (b) forming a plurality of via holes in the polyimide tape, which expose the Cu patterns to the upper surface of the polyimide tape, (c) coating the upper surface of the polyimide tape with a photoresist, and exposing and developing the photoresist to form openings therein which expose the via holes, (d) plating walls, defining the openings and the via holes, with Cu, (e) removing remaining portions of the photoresist to produce Cu bumps, and (f) plating the bumps to protect the Cu. The printed circuit boards of the present invention have advantages in that they are not subject to a misalignment of the metal bumps with their underlying conductive pattern, and eliminate the need to use flux, thereby being environmentally friendly.
摘要翻译：制造印刷电路板的第一种方法包括以下步骤：（a）制备具有芯片安装区域和上表面上的电路图案的板，以及与下表面上的电路图案电连接的金属焊盘;（b）将金属板附着到板的下表面，（c）通过蚀刻金属板在金属焊盘上形成金属图案，（d）通过镀金属图案形成金属凸块。制造电路板的第二种方法（在这种情况下为柔性电路板）包括以下步骤：（a）准备具有附着在聚酰亚胺胶带的下表面上的镀有Au层的Cu图案的板，（b）在聚酰亚胺胶带中形成多个通孔，将Cu图案暴露于聚酰亚胺胶带的上表面，（c）用光致抗蚀剂涂覆聚酰亚胺胶带的上表面，并曝光和显影光致抗蚀剂以在其中形成开口其暴露通孔，（d）用Cu限定开口和通孔的电镀壁，（e）除去光致抗蚀剂的剩余部分以产生Cu凸块，以及（f）电镀凸块以保护Cu。本发明的印刷电路板的优点在于，它们不会使金属凸块与其下面的导电图案不对准，并且不需要使用助焊剂，因此是环境友好的。

114. 发明授权

US5648006A Heater for chemical vapor deposition equipment 失效
标题翻译：化学气相沉积设备加热器
公开(公告)号：US5648006A
公开(公告)日：1997-07-15
申请号：US385968
申请日：1995-02-09
申请人： Suk-Ki Min , Moo Sung Kim , Seong-Il Kim , Yong Kim
发明人： Suk-Ki Min , Moo Sung Kim , Seong-Il Kim , Yong Kim
IPC分类号： H05B3/20 , C23C16/46 , H05B3/16 , H05B3/68
CPC分类号： C23C16/46 , H05B3/16
摘要： A heater for a chemical vapor deposition equipment includes a meandering heating wire made of either molybdenum or tungsten and having a diameter of about 1 mm. The heating wire is laid on a heater disc that is made of either molybdenum, tungsten or ceramic. The heater disc is holed at its center for receiving a susceptor rotating shaft. A plurality of heating wire fixtures support the heating wire on the heater disc while spacing the heating wire from the heater disc at an interval, thus to prevent the heating wire from directly contacting the heater disc. Each of the heating wire fixtures is provided with a pair of lateral through holes, that is, a heating wire hole formed in an upper section of each fixture and a fixing wire hole formed in a lower section of each fixture. The heater also includes heat resisting plates that are made of either molybdenum or tungsten and placed on the bottom surface and the side surface of the heater disc for preventing side and downward radiation of the heat of the heating wire. The heater heats a substrate to a high temperature not less than 1500.degree. C. and achieves an excellent heating efficiency.
摘要翻译：用于化学气相沉积设备的加热器包括由钼或钨制成并具有约1mm直径的曲折加热丝。加热丝放置在由钼，钨或陶瓷制成的加热盘上。加热盘在其中心处是用于接收基座旋转轴的。多个加热线夹具支撑加热盘上的加热线，同时间隔加热丝与加热盘间隔开，从而防止加热线直接接触加热盘。每个加热线夹具设置有一对横向通孔，即，形成在每个固定装置的上部中的加热丝孔和形成在每个夹具的下部中的固定线孔。加热器还包括由钼或钨制成并且放置在加热盘的底表面和侧表面上的耐热板，用于防止加热丝的热量的侧向和向下辐射。加热器将基板加热至不低于1500℃的高温，并实现优良的加热效率。

115. 发明授权

US09026361B2 Method of calculating accuracy of measuring location, and method and apparatus for measuring location of terminal using accuracy of measuring location 有权
标题翻译：测量位置精度的计算方法以及测量位置的测量位置的方法和装置
公开(公告)号：US09026361B2
公开(公告)日：2015-05-05
申请号：US13600956
申请日：2012-08-31
申请人： Eung Sun Kim , Dohyung Park , Yong Kim
发明人： Eung Sun Kim , Dohyung Park , Yong Kim
IPC分类号： G01C21/20 , H04W4/02
CPC分类号： G01C21/20 , H04W4/021
摘要： A method of calculating an accuracy of measuring a location, and a method and apparatus to measure a location of a terminal using the accuracy of measuring the location, are provided. The method of calculating the accuracy of measuring the location of the terminal includes providing a map corresponding to a location measurement type that is used in the terminal. The method further includes reading, from the map, map information of a predetermined area including the location of the terminal. The method further includes calculating the accuracy of measuring the location with the location measurement type based on the map information.
摘要翻译：提供了一种计算位置测量精度的方法，以及使用测量位置的精度来测量终端位置的方法和装置。计算终端位置测量精度的方法包括提供与在终端中使用的位置测量类型对应的地图。该方法还包括从地图读取包括终端位置的预定区域的地图信息。该方法还包括基于地图信息，利用位置测量类型来计算测量位置的精度。

116. 发明申请

US20140229888A1 MOBILE TERMINAL AND METHOD OF CONTROLLING THE MOBILE TERMINAL 有权
标题翻译：移动终端和控制移动终端的方法
公开(公告)号：US20140229888A1
公开(公告)日：2014-08-14
申请号：US14176487
申请日：2014-02-10
申请人： Eulina KO , Hosoo Kim , Chaesung Leem , Minjoo Chung , Hojae Jung , Shinhui Ahn , Juhyun Jung , Yong Kim , Hyoungkeun Kim
发明人： Eulina KO , Hosoo Kim , Chaesung Leem , Minjoo Chung , Hojae Jung , Shinhui Ahn , Juhyun Jung , Yong Kim , Hyoungkeun Kim
IPC分类号： G06F3/0481 , G06F3/0484
CPC分类号： G06F3/0481 , G06F3/04842 , G06F3/04886 , G06F2203/04803
摘要： Provided is a mobile terminal including a display unit to which multiple divisional screen regions are output, and a control unit that when an input for entering a division mode in which the display unit is divided into the multiple screen regions is received, generates a list region including a list of multiple applications, divides the display unit into first and second screen regions with the list region in between, and executes first and second applications selected from among the multiple applications on the first and second screen regions, respectively, in which the controller executes an application selected from among the multiple applications included in the list on the list region, and in which when an object included in the application being executed on the list region is selected, at least one of the first and second applications uses the selected object.
摘要翻译：提供了一种移动终端，其包括输出多个分割屏幕区域的显示单元，以及控制单元，当接收到用于输入其中显示单元被划分为多个屏幕区域的分割模式的输入时，生成列表区域包括多个应用的列表，将显示单元划分为具有列表区域的第一和第二屏幕区域，并且分别执行从第一和第二屏幕区域上的多个应用程序中选择的第一和第二应用程序，其中控制器执行从列表区域中列表中包括的多个应用程序中选择的应用程序，并且当选择包括在列表区域中的应用程序中的对象时，第一和第二应用程序中的至少一个使用所选择的对象。

117. 发明授权

US08379859B2 Method and apparatus for ciphering data in wireless communication system 有权
标题翻译：无线通信系统中数据加密的方法和装置
公开(公告)号：US08379859B2
公开(公告)日：2013-02-19
申请号：US12786953
申请日：2010-05-25
申请人： Sejin Park , Yong Kim
发明人： Sejin Park , Yong Kim
IPC分类号： G06F12/14 , H04K1/00 , H04Q5/22
CPC分类号： H04L9/00 , G09C1/00 , H04L2209/12 , H04L2209/80 , H04W12/02
摘要： An apparatus for ciphering data in a wireless communication system. The apparatus includes a memory which stores data to be ciphered; a controller which outputs a cipher command for each layer of a wireless protocol; a protocol processing unit including a cipher hardware, which receives the cipher command outputted from the controller, reads data to be ciphered from the memory, ciphers the data and outputs the ciphered data, and a transmission data processing unit, which receives ciphered data that is directly outputted from the cipher hardware, adds a header for transmission and generates a data packet; and an RF communication unit which directly receives the generated data packet and transmits the received data packet.
摘要翻译：一种用于在无线通信系统中加密数据的装置。该装置包括存储要被加密的数据的存储器; 输出针对无线协议的每一层的密码命令的控制器; 接收从控制器输出的密码命令的密码硬件的协议处理单元从存储器读取要加密的数据，对数据进行加密并输出加密数据，以及发送数据处理单元，其接收加密数据，从密码硬件直接输出，添加用于发送的报头，并生成数据包; 以及RF通信单元，其直接接收所生成的数据分组并发送所接收的数据分组。

118. 发明申请

US20110019685A1 METHOD AND SYSTEM FOR PACKET PREEMPTION FOR LOW LATENCY 审中-公开
标题翻译：低分辨率分组预处理方法与系统
公开(公告)号：US20110019685A1
公开(公告)日：2011-01-27
申请号：US12604968
申请日：2009-10-23
申请人： Wael William Diab , Michael Johas Teener , Bruce Currivan , Jeyhan Karaoguz , Yong Kim , Kenneth Ma
发明人： Wael William Diab , Michael Johas Teener , Bruce Currivan , Jeyhan Karaoguz , Yong Kim , Kenneth Ma
IPC分类号： H04L12/56
CPC分类号： H04L47/28 , H04L49/90
摘要： Latency requirements for Ethernet link partners comprising PHY devices and memory buffers, may be determined for packets pending transmission. Transmission may be interrupted for a first packet having greater latency than a second packet, and the second packet may be transmitted. The second packet may be interrupted for transmission of a third or more packets. Packets are inspected for marks and/or for OSI layer 2 or higher OSI layer information to determine the latency requirements prior to completion of transmission of the first packet. The second packet is transmitted after a first portion of the first packet and/or prior to a second portion. Delimiters are inserted among the first and/or second packets for interrupting transmission. A PHY layer, MAC layer and/or higher OSI layer of the second link partner may receive, buffer and/or parse the packets and/or packet portions and/or may reconstruct the first packet and/or the second packet.
摘要翻译：可以为待发送的分组确定包括PHY设备和存储器缓冲器的以太网链路伙伴的延迟要求。对于具有比第二分组更长的延迟的第一分组，传输可能被中断，并且可以发送第二分组。第二个分组可能被中断以传输第三个或更多个分组。检查分组的标记和/或OSI层2或更高的OSI层信息，以确定在完成第一分组的传输之前的等待时间要求。第二分组在第一分组的第一部分之后和/或在第二分组之前被发送。在第一和/或第二分组之间插入分隔符以中断传输。第二链路伙伴的PHY层，MAC层和/或更高的OSI层可以接收，缓冲和/或解析分组和/或分组部分和/或可以重建第一分组和/或第二分组。

119. 发明授权

US07559251B2 Apparatus for forming thermal fatigue cracks 失效
标题翻译：用于形成热疲劳裂纹的装置
公开(公告)号：US07559251B2
公开(公告)日：2009-07-14
申请号：US11625706
申请日：2007-01-22
申请人： Bo-Young Lee , Duck Hee Ryu , Jae Seong Kim , Yong Kim , Dae Hwan An
发明人： Bo-Young Lee , Duck Hee Ryu , Jae Seong Kim , Yong Kim , Dae Hwan An
IPC分类号： G01N3/32
CPC分类号： G01N3/60 , G01N2203/0066 , G01N2203/0073 , G01N2203/027
摘要： Disclosed is an apparatus and method for forming thermal fatigue cracks in a test piece for performance demonstration of nondestructive testing. The apparatus for forming thermal fatigue cracks includes a heating unit, having a conductive member attached around the outer surface of a pipe test piece and an induction heating coil disposed adjacent to the conductive member; a cooling unit, having a cooling water pump for forcibly supplying cooling water to the inner surface of the pipe test piece from a cooling water storage source and a cooling water hose; and a control unit for controlling operation of the heating unit and the cooling unit. Accordingly, thermal fatigue cracks similar to actual thermal fatigue cracks occurring during the operation of nuclear power plants or processing industry equipment are formed in a test piece, thereby assuring effective performance demonstration of nondestructive testing.
摘要翻译：公开了一种用于在无损检测的性能演示中形成试验片中的热疲劳裂纹的装置和方法。用于形成热疲劳裂纹的装置包括加热单元，其具有附接在管道试件的外表面上的导电构件和邻近导电构件设置的感应加热线圈; 冷却单元，具有冷却水泵，用于从冷却水存储源和冷却水软管向管道试件的内表面强制供给冷却水; 以及用于控制加热单元和冷却单元的操作的控制单元。因此，在试验片中形成类似于在核电厂或加工工业设备运行期间发生的实际热疲劳裂纹的热疲劳裂纹，从而确保了非破坏性试验的有效性能演示。

120. 发明授权

US07483530B2 Apparatus for separating blind source signals having systolic array structure 失效
标题翻译：用于分离具有收缩阵列结构的盲源信号的装置
公开(公告)号：US07483530B2
公开(公告)日：2009-01-27
申请号：US10989430
申请日：2004-11-17
申请人： Hong Jeong , Yong Kim
发明人： Hong Jeong , Yong Kim
IPC分类号： H04M9/08
CPC分类号： G10L21/028 , G06K9/624
摘要： Disclosed is a hardware architecture receiving multi-input blind source signals and obtaining multi-output. An apparatus for separating blind source signals includes: a forward process unit receiving a plurality of blind source signal vectors and outputting a plurality of output signal vectors by using a predetermined blind source separation algorithm; an update process unit receiving the plurality of output signal vectors and learning first weighting values used for the predetermined blind source separation algorithm according to a predetermined learning algorithm; and a weight process unit having a matrix operation structure for receiving the first weighting values and converting them into coefficients and second weighting values applicable to the predetermined blind source separation algorithm. The forward process unit includes (L+1) identical processing elements connected in a systolic array structure, where L is the number of sequential delay of blind input signal vectors. The update process unit includes (N2+N)/2×(2L+1) identical updating elements connected in a systolic array structure, where N is the number of the blind input signal vectors. Each cost of the processing elements and the updating elements is initialized by 0 in an initial operation stage.
摘要翻译：公开了一种接收多输入盲源信号并获得多输出的硬件架构。一种用于分离盲源信号的装置包括：前向处理单元，接收多个盲源信号向量，并通过使用预定的盲源分离算法输出多个输出信号向量; 更新处理单元，根据预定的学习算法，接收多个输出信号矢量和学习用于预定盲源分离算法的第一加权值; 以及加权处理单元，具有用于接收第一加权值并将其转换成适用于预定盲源分离算法的系数和第二加权值的矩阵运算结构。前向处理单元包括（L + 1）以脉冲阵列结构连接的相同的处理元件，其中L是盲输入信号矢量的顺序延迟的数量。更新处理单元包括连接在收缩阵列结构中的（N2 + N）/ 2x（2L + 1）相同的更新元件，其中N是盲输入信号矢量的数量。在初始操作阶段，处理元件和更新元件的每个成本被初始化为0。

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