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101. 发明申请

US20050167729A1 Self-aligned split-gate nonvolatile memory structure and a method of making the same 失效
标题翻译：自对准分离门非易失性存储器结构及其制造方法
公开(公告)号：US20050167729A1
公开(公告)日：2005-08-04
申请号：US10834082
申请日：2004-04-29
申请人： Hee Jeon , Seung Yoon , Yong Kim
发明人： Hee Jeon , Seung Yoon , Yong Kim
IPC分类号： H01L21/8247 , H01L21/336 , H01L21/8234 , H01L21/8239 , H01L27/10 , H01L27/115 , H01L29/423 , H01L29/788 , H01L29/792 , H01L21/338
CPC分类号： H01L27/11521 , H01L27/115 , H01L29/42324 , H01L29/7885
摘要： Provided are non-volatile split-gate memory cells having self-aligned floating gate and the control gate structures and exemplary processes for manufacturing such memory cells that provide improved dimensional control over the relative lengths and separation of the split-gate elements. Each control gate includes a projecting portion that extends over at least a portion of the associated floating gate with the size of the projecting portion being determined by a first sacrificial polysilicon spacer that, when removed, produces a concave region in an intermediate insulating structure. The control gate is then formed as a polysilicon spacer adjacent the intermediate insulating structure, the portion of the spacer extending into the concave region determining the dimension and spacing of the projecting portion and the thickness of the interpoly oxide (IPO) separating the upper portions of the split-gate electrodes thereby providing improved performance and manufacturability.
摘要翻译：提供了具有自对准浮动栅极的非易失性分裂栅极存储器单元以及用于制造这样的存储单元的控制栅极结构和示例性工艺，其提供了分离栅极元件的相对长度和间隔的改进的尺寸控制。每个控制门包括突出部分，该突出部分在相关联的浮动栅极的至少一部分上延伸，突出部分的尺寸由第一牺牲多晶硅间隔物确定，当被去除时，其在中间绝缘结构中产生凹入区域。然后，控制栅极形成为与中间绝缘结构相邻的多晶硅间隔物，间隔物的延伸到凹区中的部分确定突出部分的尺寸和间距以及分离上部的多晶硅氧化物（IPO）的厚度因此分裂栅电极提供了改进的性能和可制造性。

102. 发明申请

US20050156185A1 Flip chip nitride semiconductor light emitting diode 有权
标题翻译：倒装氮化硅半导体发光二极管
公开(公告)号：US20050156185A1
公开(公告)日：2005-07-21
申请号：US10867755
申请日：2004-06-16
申请人： Hyun Kim , Young Jeong , Yong Kim
发明人： Hyun Kim , Young Jeong , Yong Kim
IPC分类号： H01L33/06 , H01L33/10 , H01L33/32 , H01L33/38 , H01L33/46 , H01L33/62 , H01L33/00
CPC分类号： H01L33/405 , H01L33/32 , H01L33/387 , H01L33/44 , H01L2224/14 , Y10S257/918
摘要： The invention relates to a nitride semiconductor LED, wherein an n-doped nitride semiconductor layer is formed on a transparent substrate. An active layer is formed on the n-doped nitride semiconductor layer. A p-doped nitride semiconductor layer is formed on the active layer. A high reflectivity Ohmic contact layer of a mesh structure is formed on the p-doped nitride semiconductor layer and has a number of open areas for exposing the p-doped nitride semiconductor layer. A metal barrier layer is formed on at least a top region of the high reflectivity Ohmic contact layer. A p-bonding electrode is formed on the metal barrier layer. An n-electrode is formed on the n-doped nitride semiconductor layer.
摘要翻译：本发明涉及氮化物半导体LED，其中在透明衬底上形成n掺杂氮化物半导体层。在n掺杂氮化物半导体层上形成有源层。在有源层上形成p掺杂的氮化物半导体层。高反射率网状结构的欧姆接触层形成在p掺杂氮化物半导体层上，并且具有用于暴露p掺杂氮化物半导体层的多个开放区域。金属阻挡层形成在高反射率欧姆接触层的至少顶部区域上。在金属阻挡层上形成p型接合电极。在n掺杂氮化物半导体层上形成n电极。

103. 发明申请

US20050145875A1 Flip chip type nitride semiconductor light emitting device and manufacturing method thereof 有权
标题翻译：倒装芯片型氮化物半导体发光器件及其制造方法
公开(公告)号：US20050145875A1
公开(公告)日：2005-07-07
申请号：US10861511
申请日：2004-06-07
申请人： Hyun Kim , Yong Kim , Hyoun Shin
发明人： Hyun Kim , Yong Kim , Hyoun Shin
IPC分类号： H01L21/28 , H01L33/10 , H01L33/32 , H01L33/38 , H01L33/40 , H01L33/62 , H01L33/00
CPC分类号： H01L33/405 , H01L33/32
摘要： Disclosed herein are a flip chip type nitride semiconductor light emitting device, which comprises a substrate for growing a nitride semiconductor material, an n-type nitride semiconductor layer formed on the substrate, an active layer formed on at least a part of the n-type nitride semiconductor layer, a p-type nitride semiconductor layer formed on the active layer, a bonding force providing layer formed on the p-type nitride semiconductor layer and adapted to provide a bonding force relative to the p-type nitride semiconductor layer, a reflective electrode layer formed on the bonding force providing layer, and adapted to reflect light produced in the active layer toward the substrate and to diffuse electric current, and a cap layer formed on the reflective electrode layer, and adapted to provide a bonding force between the reflective electrode layer and a bonding metal and to reduce contact resistance.
摘要翻译：本文公开了一种倒装芯片型氮化物半导体发光器件，其包括用于生长氮化物半导体材料的衬底，形成在衬底上的n型氮化物半导体层，形成在n型氮化物半导体的至少一部分上的有源层氮化物半导体层，形成在有源层上的p型氮化物半导体层，形成在p型氮化物半导体层上并适于提供相对于p型氮化物半导体层的结合力的接合力提供层，反射电极层，形成在所述接合力提供层上，并且适于将在所述有源层中产生的光朝向所述衬底反射并扩散电流;以及覆盖层，形成在所述反射电极层上，并且适于在所述反射层之间提供接合力电极层和接合金属，并降低接触电阻。

104. 发明申请

US20050142030A1 Chemical sensors based on metal nanoparticle encapsulated by mixed ligand and sensor array 有权
标题翻译：基于由混合配体和传感器阵列封装的金属纳米颗粒的化学传感器
公开(公告)号：US20050142030A1
公开(公告)日：2005-06-30
申请号：US10944939
申请日：2004-09-21
申请人： Young Kim , Yong Kim , Yoon Yang , Seung Ha , Hae Yang , Yun Kim , Dae Lee , Young Hong
发明人： Young Kim , Yong Kim , Yoon Yang , Seung Ha , Hae Yang , Yun Kim , Dae Lee , Young Hong
IPC分类号： G01N33/20 , G01N27/12 , G01N31/22
CPC分类号： B82Y30/00 , B01J2219/005 , B01J2219/00648 , B01J2219/00702 , B01J2219/0072 , B82Y15/00 , G01N27/127 , G01N33/4972 , Y10T436/203332 , Y10T436/204165 , Y10T436/21 , Y10T436/212
摘要： Provided are mixed ligand metal nanoparticle chemical sensors in which metal nanoparticles are encapsulated by at least two kinds of different molecule ligands having a relatively low conductivity and various composition ratios, and a chemical sensor array in which a film of the metal nanoparticle sensor is formed on the substrate. The metal nanoparticle sensor using the mixed ligand improves sensitivity and reaction speed with respect to an analyte, and selectivity with respect to various analytes, and a kind and a composition of a ligand of the mixed ligand constituting the metal nanoparticle sensor are adjusted to allow the high sensitivity nanoparticle sensor to be applied to the sensor array technology, thereby enabling a design of sensor properties as well as systematic access to a configuration of the sensor array the most efficient for the analytes.
摘要翻译：提供了混合的配体金属纳米颗粒化学传感器，其中金属纳米颗粒被具有相对低的导电性和各种组成比的至少两种不同的分子配体包封，以及化学传感器阵列，其中金属纳米颗粒传感器的膜形成在底物。使用混合配体的金属纳米颗粒传感器改善了对分析物的敏感性和反应速度，并且相对于各种分析物的选择性以及构成金属纳米颗粒传感器的混合配体的配体的种类和组成被调整，以允许高灵敏度纳米粒子传感器应用于传感器阵列技术，从而实现传感器特性的设计，以及对分析物最有效的系统访问传感器阵列的配置。

105. 发明申请

US20050134757A1 Array panel for liquid crystal display device and method of manufacturing the same 有权
标题翻译：液晶显示装置用阵列面板及其制造方法
公开(公告)号：US20050134757A1
公开(公告)日：2005-06-23
申请号：US11050792
申请日：2005-02-07
申请人： Yong Kim , Dong-Jin Park
发明人： Yong Kim , Dong-Jin Park
IPC分类号： G02F1/1335 , G02F1/1333 , G02F1/1362 , G02F1/1368 , G02F1/136
CPC分类号： G02F1/1368 , G02F2001/136218 , G02F2001/136236 , G02F2001/136263
摘要： An array panel for a liquid crystal display device includes a substrate, a gate line and a gate electrode on the substrate, wherein the gate line is connected to the gate electrode, a gate insulating layer on the gate line and the gate electrode, an active layer on the gate insulating layer, an ohmic contact layer on the active layer, a data line, a source electrode, and a drain electrode on the ohmic contact layer, wherein the data line, the source electrode, and the drain electrode are formed of molybdenum, a passivation layer on the data line, the source and drain electrodes, and a pixel electrode on the passivation layer, wherein the ohmic contact layer has the same shape as the data line, the source, and drain electrodes, and the active layer has the same shape as the data line, and the source electrode, and the drain electrode except for a channel area between the source electrode and the drain electrode, and the channel area has a “U” shape.
摘要翻译：用于液晶显示装置的阵列面板包括在基板上的基板，栅极线和栅电极，其中栅极线连接到栅电极，栅极线上的栅极绝缘层和栅电极，栅极绝缘层上的层，有源层上的欧姆接触层，欧姆接触层上的数据线，源电极和漏电极，其中数据线，源电极和漏电极由钼，数据线上的钝化层，源极和漏极以及钝化层上的像素电极，其中欧姆接触层具有与数据线，源极和漏极以及有源层相同的形状具有与数据线相同的形状，源电极和漏电极除了源电极和漏电极之间的沟道区域之外，沟道区域具有“U”形状。

106. 发明申请

US20050128858A1 Negative word line driver 有权
标题翻译：负字线驱动
公开(公告)号：US20050128858A1
公开(公告)日：2005-06-16
申请号：US10881056
申请日：2004-06-30
申请人： Kang Lee , Yong Kim
发明人： Kang Lee , Yong Kim
IPC分类号： G11C8/00 , G11C8/08
CPC分类号： G11C8/08
摘要： Provided is directed to a negative word line driver, including: a block select address generation unit for generating first and second block select addresses having a block information according to an active signal; a row decoder controller for generating a control signal to disable a word line; a main word line driver for accessing a main word line by being driven in response to a signal coding the first block select address and the control signal; and a phi X driver for accessing a sub word line by being driven in response to a signal coding the second block select address and the control signal wloff.
摘要翻译：提供一种负字线驱动器，包括：块选择地址生成单元，用于根据有效信号产生具有块信息的第一和第二块选择地址; 行解码器控制器，用于产生禁止字线的控制信号; 主字线驱动器，用于响应于对第一块选择地址和控制信号进行编码的信号被驱动来访问主字线; 以及用于通过响应于编码第二块选择地址和控制信号wloff的信号来驱动来访问子字线的phi X驱动器。

107. 发明申请

US20050097802A1 Structure for supporting sign board 失效
公开(公告)号：US20050097802A1
公开(公告)日：2005-05-12
申请号：US11015215
申请日：2004-12-16
申请人： Yong Kim
发明人： Yong Kim
IPC分类号： E01F9/011 , E01F9/013 , E01F9/03 , G09F7/18 , G09F7/22 , A47G1/06
CPC分类号： G09F7/22
摘要： A structure for supporting a sign board is disclosed. The structure includes: a post clamp having a pair of arched clamping bands which are hingedly coupled and joined to each other by a fastening element, at least one clamping band having a pillar; a hanger having a socket pipe joined to the pillar of the post clamp, a support bar inserted into the socket pipe and joined by a fastening element, the support bar having an axial coupling groove; at least one connector having a first coupling plate with a coupling bulge adapted to be fitted into the coupling groove of the support bar and with a first arched hinge holder, and a second coupling plate coupled to the first coupling plate having a second arched hinge holder; and a sign board having a coupling bulge and a guide slot through which the hinge holders of the connector pass.

108. 发明申请

US20050073164A1 Cargo screen hanger fixture for a vehicle 有权
标题翻译：用于车辆的货架挂架夹具
公开(公告)号：US20050073164A1
公开(公告)日：2005-04-07
申请号：US10886491
申请日：2004-07-07
申请人： Yong Kim
发明人： Yong Kim
IPC分类号： B60R5/04 , B60R7/08 , B60R13/00 , B60R13/08
CPC分类号： B60R5/047
摘要： A cargo screen hanger fixture for a vehicle, wherein a hooking lug is formed in a projecting way on one side of the housing cover coupled to the left and right ends of the cargo screen housing. The cargo screen hanger is fastened by being inserted between the bottom of the hooking lug and the top of the side garnish hanger to which the housing cover is joined and fastened.
摘要翻译：一种用于车辆的货物吊架固定装置，其中挂钩在突出的方式形成在壳体盖的与货物屏幕壳体的左端和右端相连的一侧上。通过插入钩挂耳的底部和连接并紧固壳体盖的侧面装饰衣架的顶部来将货物吊架固定。

109. 发明授权

US06507527B1 Memory line discharge before sensing 有权
标题翻译：感应前存储线放电
公开(公告)号：US06507527B1
公开(公告)日：2003-01-14
申请号：US09698614
申请日：2000-10-27
申请人： Lee Cleveland , Jin-Lien Lin , Takao Akaogi , Ali Al-Shamma , Boon Tang Teh , Kendra Nguyen , Yong Kim
发明人： Lee Cleveland , Jin-Lien Lin , Takao Akaogi , Ali Al-Shamma , Boon Tang Teh , Kendra Nguyen , Yong Kim
IPC分类号： G11C700
CPC分类号： G11C7/06 , G11C7/12
摘要： A method of charging a data line to a desired voltage level prior to the data line being sensed in a low power memory device by discharging the data line from a voltage level above the desired voltage level to approximately the desired voltage level. By using N-type transistors to discharge the data line to the desired voltage level, the voltage level can be reached faster with cheaper components.
摘要翻译：一种通过将数据线从高于期望电压电平的电压电平放电到大约期望的电压电平，在数据线在低功率存储器件中被感测之前将数据线充电到期望的电压电平的方法。通过使用N型晶体管将数据线放电至期望的电压电平，可以用更便宜的组件更快地达到电压电平。

110. 发明授权

US06245490B1 Method of manufacturing a circuit board having metal bumps and a semiconductor device package comprising the same 失效
标题翻译：制造具有金属凸块的电路板的方法和包括该凸起的半导体器件封装的方法
公开(公告)号：US06245490B1
公开(公告)日：2001-06-12
申请号：US09506593
申请日：2000-02-18
申请人： Jin Hyun Yoon , Gi Bum Park , In Pyo Hong , Yong Kim , Myung Kee Chung
发明人： Jin Hyun Yoon , Gi Bum Park , In Pyo Hong , Yong Kim , Myung Kee Chung
IPC分类号： G03F700
CPC分类号： H01L23/3107 , H01L23/3114 , H01L23/49833 , H01L24/48 , H01L2224/32225 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/30107 , H05K1/113 , H05K3/064 , H05K3/244 , H05K3/4007 , H05K3/423 , H05K2201/0347 , H05K2201/0355 , H05K2201/0367 , H05K2201/0379 , H05K2201/0394 , H05K2201/09563 , H05K2203/0369 , H05K2203/0542 , Y10T29/49117 , Y10T29/49144 , Y10T29/49146 , Y10T29/49165 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399 , H01L2924/00012
摘要： A first method of manufacturing a printed circuit board includes steps of (a) preparing a board which has a chip mounting area and circuit patterns on an upper surface and metal pads to be electrically connected to the circuit patterns on a lower surface, (b) attaching a metal plate to the lower surface of the board, (c) forming metal patterns on the metal pads by etching the metal plate, and (d) forming metal bumps by plating the metal patterns. A second method of manufacturing a circuit board, in this case a flexible circuit board, includes the steps of (a) preparing a board having Cu patterns, plated with a Au layer, attached to a lower surface of a polyimide tape, (b) forming a plurality of via holes in the polyimide tape, which expose the Cu patterns to the upper surface of the polyimide tape, (c) coating the upper surface of the polyimide tape with a photoresist, and exposing and developing the photoresist to form openings therein which expose the via holes, (d) plating walls, defining the openings and the via holes, with Cu, (e) removing remaining portions of the photoresist to produce Cu bumps, and (f) plating the bumps to protect the Cu. The printed circuit boards of the present invention have advantages in that they are not subject to a misalignment of the metal bumps with their underlying conductive pattern, and eliminate the need to use flux, thereby being environmentally friendly.
摘要翻译：制造印刷电路板的第一种方法包括以下步骤：（a）制备具有芯片安装区域和上表面上的电路图案的板，以及与下表面上的电路图案电连接的金属焊盘;（b）将金属板附着到板的下表面，（c）通过蚀刻金属板在金属焊盘上形成金属图案，（d）通过镀金属图案形成金属凸块。制造电路板的第二种方法（在这种情况下为柔性电路板）包括以下步骤：（a）准备具有附着在聚酰亚胺胶带的下表面上的镀有Au层的Cu图案的板，（b）在聚酰亚胺胶带中形成多个通孔，将Cu图案暴露于聚酰亚胺胶带的上表面，（c）用光致抗蚀剂涂覆聚酰亚胺胶带的上表面，并曝光和显影光致抗蚀剂以在其中形成开口其暴露通孔，（d）用Cu限定开口和通孔的电镀壁，（e）除去光致抗蚀剂的剩余部分以产生Cu凸块，以及（f）电镀凸块以保护Cu。本发明的印刷电路板的优点在于，它们不会使金属凸块与其下面的导电图案不对准，并且不需要使用助焊剂，因此是环境友好的。

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