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    • 105. 发明申请
    • Transistor, an inverter and a method of manufacturing the same
    • 晶体管,逆变器及其制造方法
    • US20080099834A1
    • 2008-05-01
    • US11589303
    • 2006-10-30
    • Josef Willer
    • Josef Willer
    • H01L29/94H01L21/336
    • H01L29/7851H01L21/823431H01L27/0886H01L29/66795H01L29/7854H01L2924/0002H01L2924/00
    • An inverter which is at least partially formed in a semiconductor substrate includes a first transistor with a first channel and a second transistor with a second channel, wherein each of the first and second transistors is formed as a FinFET with ridge shaped channels. The first and second gate electrodes of the first and second transistors are adjacent to the first and second channels on at least three sides of the corresponding channel. The first gate electrode extends from a top surface of the first channel ridge to a first ridge depth along the first channel, and the second gate electrode extends from a top surface of the second channel ridge to a second ridge depth along the second channel, wherein the first ridge depth is greater than the second ridge depth.
    • 至少部分地形成在半导体衬底中的反相器包括具有第一通道的第一晶体管和具有第二通道的第二晶体管,其中第一和第二晶体管中的每一个形成为具有脊形沟道的FinFET。 第一和第二晶体管的第一和第二栅电极在相应通道的至少三侧上与第一和第二通道相邻。 第一栅电极从第一通道脊的顶表面沿第一通道延伸到第一脊深度,并且第二栅极从第二通道脊的顶表面延伸到沿第二通道的第二脊深度,其中 第一脊深度大于第二脊深度。
    • 109. 发明授权
    • Integrated memory device and method for operating the same
    • 集成存储器件及其操作方法
    • US07280392B2
    • 2007-10-09
    • US11339846
    • 2006-01-26
    • Corvin LiawJosef Willer
    • Corvin LiawJosef Willer
    • G11C11/00
    • G11C13/0011G11C13/0069G11C2013/0076G11C2213/77H01L27/101
    • A memory device includes an array of memory cells that include a memory element having a non-reactive resistance whose magnitude is programmable to assume a high-resistance state or a low-resistance state. Sets of first and second lines provide access to the memory cells, wherein the memory element of each memory cell is coupled between one of the first lines and one of the second lines. A checking unit determines whether to invert data values to be stored in memory cells coupled to at least a section of respective ones of the first lines based on a number of memory cells that would be programmed in the high-resistance state or the low-resistance state as a result of the data values in order to reduce the number memory cells programmed in the low-resistance state and the resulting leakage current.
    • 存储器件包括存储器单元阵列,其包括具有非反应电阻的存储元件,其大小可编程为呈现高电阻状态或低电阻状态。 第一和第二行的集合提供对存储器单元的访问,其中每个存储器单元的存储元件耦合在第一行之一和第二行中的一个之间。 检查单元基于将以高电阻状态编程的存储器单元的数量或低电阻来确定是否反转要存储在耦合到第一行中的相应的第一行的至少一部分的存储器单元中的数据值 作为数据值的结果,为了减少在低电阻状态下编程的存储单元数量和所产生的漏电流。