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    • 110. 发明申请
    • INCREASING THE SURFACE AREA OF A MEMORY CELL CAPACITOR
    • 增加记忆体电容器的表面积
    • US20100181607A1
    • 2010-07-22
    • US12749389
    • 2010-03-29
    • Brian S. DoyleRobert S. ChauVivek DeSuman DattaDinesh Somasekhar
    • Brian S. DoyleRobert S. ChauVivek DeSuman DattaDinesh Somasekhar
    • H01L27/06
    • H01L28/91H01L27/10817H01L27/10852
    • Methods and apparatuses to increase a surface area of a memory cell capacitor are described. An opening in a second insulating layer deposited over a first insulating layer on a substrate is formed. The substrate has a fin. A first insulating layer is deposited over the substrate adjacent to the fin. The opening in the second insulating layer is formed over the fin. A first conducting layer is deposited over the second insulating layer and the fin. A third insulating layer is deposited on the first conducting layer. A second conducting layer is deposited on the third insulating layer. The second conducting layer fills the opening. The second conducting layer is to provide an interconnect to an upper metal layer. Portions of the second conducting layer, third insulating layer, and the first conducting layer are removed from a top surface of the second insulating layer.
    • 描述了增加存储单元电容器的表面积的方法和装置。 形成了沉积在基板上的第一绝缘层上的第二绝缘层中的开口。 衬底具有翅片。 第一绝缘层沉积在邻近鳍片的衬底上。 第二绝缘层上的开口形成在鳍上。 第一导电层沉积在第二绝缘层和鳍上。 第三绝缘层沉积在第一导电层上。 第二导电层沉积在第三绝缘层上。 第二导电层填充开口。 第二导电层是提供与上金属层的互连。 从第二绝缘层的顶表面去除第二导电层,第三绝缘层和第一导电层的部分。