专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

91. 发明申请

US20050227136A1 Fuel cell, electronic apparatus and camera 审中-公开
标题翻译：燃料电池，电子设备和相机
公开(公告)号：US20050227136A1
公开(公告)日：2005-10-13
申请号：US11079987
申请日：2005-03-15
申请人： Hiroshi Kikuchi , Yuki Totori , Toshifumi Urakami , Go Tokura
发明人： Hiroshi Kikuchi , Yuki Totori , Toshifumi Urakami , Go Tokura
IPC分类号： H01M8/04 , H01M8/06 , H01M8/24
CPC分类号： H01M8/2475 , H01M8/04089 , H01M8/04208 , H01M8/065 , H01M8/241 , H01M2250/30 , Y02B90/18
摘要： A fuel cell is disclosed, which can use space in an apparatus body effectively. The fuel cell comprises a plurality of cells laminated, and a cell box housing the plurality of cells. The plurality of cells include a cell whose size in a first direction orthogonal to a lamination direction is different from that of another cell. The cell box has a shape corresponding to the size of each cell. Furthermore, an electronic apparatus is disclosed, which comprises an apparatus body including a grip portion having a protruding shape; and a fuel cell that is housed in the grip portion and comprises a cell section in which a plurality of cells are laminated in a protrusion direction of the grip portion or a direction orthogonal to the protrusion direction.
摘要翻译：公开了一种能够有效地在设备主体中使用空间的燃料电池。燃料电池包括层叠的多个电池，以及容纳多个电池的电池盒。多个单元包括与层叠方向正交的第一方向的尺寸与另一个单元的尺寸不同的单元。细胞盒具有与每个细胞的大小对应的形状。此外，公开了一种电子设备，其包括：设备主体，包括具有突出形状的握持部; 以及燃料电池，其容纳在所述把手部中，并且包括其中多个电池在所述握持部的突出方向或与所述突出方向正交的方向上层叠的电池部。

92. 发明申请

US20050220856A1 Phospholipid derivative 有权
标题翻译：磷脂衍生物
公开(公告)号：US20050220856A1
公开(公告)日：2005-10-06
申请号：US10508704
申请日：2003-03-28
申请人： Chika Itoh , Kazuhiro Kubo , Syunsuke Ohhashi , Tohru Yasukohchi , Hiroshi Kikuchi , Norio Suzuki , Miho Kurosawa , Hitoshi Yamauchi
发明人： Chika Itoh , Kazuhiro Kubo , Syunsuke Ohhashi , Tohru Yasukohchi , Hiroshi Kikuchi , Norio Suzuki , Miho Kurosawa , Hitoshi Yamauchi
IPC分类号： A61K8/14 , A61K8/55 , A61K8/86 , A61K9/127 , A61P35/00 , A61Q19/00 , C07F9/10 , C08G65/26 , C08G65/335 , C07F9/02
CPC分类号： A61K47/24 , A61K8/14 , A61K8/553 , A61K8/556 , A61K8/86 , A61K9/1271 , A61Q19/00 , C07F9/10 , C08G65/2609 , C08G65/3353
摘要： A phospholipid derivative represented by the formula (1) (Z represents a residue of a compound having 3 to 10 hydroxyl groups; AO represents an oxyalkylene group having 2 to 4 carbon atoms; R1CO and R2CO represent an acyl group having 8 to 22 carbon atoms; X represents hydrogen atom, an alkali metal atom, ammonium or an organic ammonium; “a” represents an integer of 0 to 4; “b” represents 0 or 1; Q represents hydrogen atom or methyl group; m represents an average number of moles of the oxyalkylene group added; and m, k1, k2, and k3 are numbers satisfying the following conditions: 3≦m≦200, 9≦m×(k1+k2+k3)≦1000, 1≦k1≦2, 0≦k2≦9 and 0≦k3≦9, and 3≦k1+k2+k3≦10), which is highly safe for living bodies, and is suitably used for solubilization and dispersion of physiologically active substances and the like, or in the fields of drug delivery systems such as liposomes and cosmetics.
摘要翻译：由式（1）表示的磷脂衍生物（Z表示具有3〜10个羟基的化合物的残基; AO表示碳原子数2〜4的氧化烯基，R 1，CO， SO 2表示碳原子数为8〜22的酰基，X表示氢原子，碱金属原子，铵或有机铵，“a”表示0〜4的整数，“b”表示 0或1; Q表示氢原子或甲基; m表示加入的氧化烯基的平均摩尔数; m，k1，k2和k3为满足以下条件的数：3 <= m <= 200,9 <= mx（k1 + k2 + k3）<= 1000,1 <= k1 <= 2,0 <= k2 <= 9，0 <= k3 = 9，3 <= k1 + k2 + k3 = 10 ），其对于活体是高度安全的，并且适合用于生理活性物质等的溶解和分散，或者在药物递送系统如脂质体和化妆品领域中。

93. 发明授权

US06919622B2 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US06919622B2
公开(公告)日：2005-07-19
申请号：US10774405
申请日：2004-02-10
申请人： Gen Murakami , Kunihiro Tsubosaki , Masahiro Ichitani , Kunihiko Nishi , Ichiro Anjo , Asao Nishimura , Makoto Kitano , Akihiro Yaguchi , Sueo Kawai , Masatsugu Ogata , Syuuji Eguchi , Hiroyoshi Kokaku , Masanori Segawa , Hiroshi Hozoji , Takashi Yokoyama , Noriyuki Kinjo , Aizo Kaneda , Junichi Saeki , Shozo Nakamura , Akio Hasebe , Hiroshi Kikuchi , Isamu Yoshida , Takashi Yamazaki , Kazuyoshi Oshima , Tetsuro Matsumoto
发明人： Gen Murakami , Kunihiro Tsubosaki , Masahiro Ichitani , Kunihiko Nishi , Ichiro Anjo , Asao Nishimura , Makoto Kitano , Akihiro Yaguchi , Sueo Kawai , Masatsugu Ogata , Syuuji Eguchi , Hiroyoshi Kokaku , Masanori Segawa , Hiroshi Hozoji , Takashi Yokoyama , Noriyuki Kinjo , Aizo Kaneda , Junichi Saeki , Shozo Nakamura , Akio Hasebe , Hiroshi Kikuchi , Isamu Yoshida , Takashi Yamazaki , Kazuyoshi Oshima , Tetsuro Matsumoto
IPC分类号： H01L21/52 , H01L23/31 , H01L23/495 , H01L23/50 , H01L25/10 , H01L29/06 , H05K1/14 , H05K1/18 , H05K3/34
CPC分类号： H01L23/3107 , H01L23/4951 , H01L23/49555 , H01L23/49558 , H01L23/49568 , H01L23/49586 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/105 , H01L29/0657 , H01L2224/0401 , H01L2224/05554 , H01L2224/05599 , H01L2224/16245 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/4569 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/48599 , H01L2224/48699 , H01L2224/48799 , H01L2224/49171 , H01L2224/73215 , H01L2224/73265 , H01L2224/85205 , H01L2224/8592 , H01L2224/92147 , H01L2225/1005 , H01L2225/1029 , H01L2225/107 , H01L2225/1088 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01039 , H01L2924/01043 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01058 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01092 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/13091 , H01L2924/14 , H01L2924/15738 , H01L2924/15747 , H01L2924/1576 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/3511 , H05K1/144 , H05K1/181 , H05K3/3421 , H01L2924/00012 , H01L2924/00 , H01L2924/01026 , H01L2924/3512 , H01L2924/0695 , H01L2224/85399
摘要： As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the “Lead-On-Chip” or “Chip-On-Lead” structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.
摘要翻译：由于半导体芯片尺寸大，高集成度和加速度，所以难以将半导体芯片与包装中的引线组合在一起。鉴于这种困难，已经采用称为半导体和引线堆叠和封装的称为“片上引线”或“引线芯片”结构的封装结构。在该结构的封装中，根据本发明，内引线和半导体芯片的前端部之间的间隙比除引导端部和半导体芯片之外的内引线部分之间的间隙宽，从而减小杂散容量，提高信号传输速率和减少电气噪声。

94. 发明申请

US20050030419A1 Image-taking apparatus 有权
标题翻译：摄像仪
公开(公告)号：US20050030419A1
公开(公告)日：2005-02-10
申请号：US10895034
申请日：2004-07-21
申请人： Hiroshi Kikuchi
发明人： Hiroshi Kikuchi
IPC分类号： H04N5/225 , H04N101/00 , H05K1/02 , H05K1/14
CPC分类号： H04N5/2252 , H05K1/0218 , H05K1/14
摘要： An image-taking apparatus comprises a chassis which is disposed inside an outer package member of the image-taking apparatus and is a structural body of the image-taking apparatus, an image-pickup device which photoelectrically converts an object image, a first circuit which processes output signals from the image-pickup device, and a second circuit which generates an electromagnetic wave. Herein, the first circuit is disposed on the opposite side of the second circuit with respect to the chassis.
摘要翻译：摄像装置包括：底座，其设置在摄像装置的外包装构件的内部，并且是摄像装置的结构体，对物体图像进行光电转换的摄像装置;第一电路，处理来自图像拾取装置的输出信号和产生电磁波的第二电路。这里，第一电路相对于底架设置在第二电路的相反侧。

95. 发明授权

US06747846B2 Thin film magnetic head preventing corrosion and thin film magnetic head slider, and methods of producing the same 失效
标题翻译：薄膜磁头防腐蚀和薄膜磁头滑块及其制造方法
公开(公告)号：US06747846B2
公开(公告)日：2004-06-08
申请号：US10075269
申请日：2002-02-15
申请人： Takahiro Kato , Noriyuki Saiki , Yukihiro Isono , Hiroshi Kikuchi
发明人： Takahiro Kato , Noriyuki Saiki , Yukihiro Isono , Hiroshi Kikuchi
IPC分类号： G11B540
CPC分类号： G11B5/6005 , Y10T29/49032
摘要： The present invention forms a conductor that is in electrically conductive contact, through an inside metal layer, with the magnetic thin film of the recording magnetic pole of a thin film magnetic head, and is also exposed to the outside. The equilibrium electrode potential of the conductor in an aqueous solution is set higher than that of the magnetic thin film, and its surface area is larger than the cross-sectional area of the magnetic thin film on the air bearing surface facing the magnetic recording medium. This makes it possible to retard corrosion of the recording magnetic thin film in the process of manufacturing thin film magnetic heads, whereby depletion of the magnetic thin film due to corrosion can be prevented, resulting in improved recording and reproducing qualities.
摘要翻译：本发明通过内部金属层与薄膜磁头的记录磁极的磁性薄膜形成导电接触的导体，并且还暴露于外部。导体在水溶液中的平衡电极电位被设定为高于磁性薄膜的平衡电极电位，其表面积大于面向磁记录介质的空气轴承表面上的磁性薄膜的横截面面积。这使得可以在制造薄膜磁头的过程中延缓记录磁性薄膜的腐蚀，由此可以防止由于腐蚀导致的磁性薄膜的耗尽，从而改善了记录和再现质量。

96. 发明授权

US06746725B2 Acrylic foam pressure sensitive adhesive method thereof 有权
标题翻译：丙烯酸泡沫压敏粘合剂方法
公开(公告)号：US06746725B2
公开(公告)日：2004-06-08
申请号：US10344309
申请日：2003-02-10
申请人： Shojitsu Nakamuta , Hiroshi Kikuchi , Shinji Abiko
发明人： Shojitsu Nakamuta , Hiroshi Kikuchi , Shinji Abiko
IPC分类号： B05D300
CPC分类号： C08J9/122 , C08J2207/02 , C08J2333/06 , C08L33/00 , C09J5/08 , C09J7/10 , C09J2433/00
摘要： An acrylic foam pressure sensitive adhesive, having a low density and having cells finely and uniformly dispersed therein, and its production method. An acrylic foam pressure sensitive adhesive having a cell average diameter of no more than 300 &mgr;m and its standard deviation of no more than 115 &mgr;m. A production method of an acrylic foam pressure sensitive adhesive comprising: introducing an acrylic foam precursor composition and a cell forming gas into an agitation and mixing apparatus equipped with a casing provided with a flow path through which a fluid flows, and agitation blades disposed within said casing capable of vibrating in the axial direction of said casing, forming cells within the acrylic foam precursor composition by agitating and mixing the acrylic foam precursor composition and the cell forming gas in the agitation and mixing apparatus, coating the acrylic foam precursor composition containing the cells onto a substrate, and curing the coated acrylic foam precursor composition.
摘要翻译：一种丙烯酸泡沫压敏粘合剂及其制造方法，其密度低，细胞均匀分散。一种丙烯酸泡沫压敏粘合剂，其细胞平均直径不超过300μm，标准偏差不超过115μm。一种丙烯酸泡沫压敏粘合剂的生产方法，包括：将丙烯酸泡沫前体组合物和细胞形成气体引入搅拌和混合装置，所述搅拌和混合装置配备有设置有流体流过的流动路径的壳体，以及设置在所述壳体，其能够在所述壳体的轴向方向上振动，通过在搅拌和混合装置中搅拌和混合丙烯酸类泡沫前体组合物和细胞形成气体，在丙烯酸泡沫前体组合物中形成细胞，涂覆含有细胞的丙烯酸类泡沫前体组合物并固化涂覆的丙烯酸类泡沫前体组合物。

97. 发明授权

US06372714B1 Composition for gene introduction into cell 有权
标题翻译：用于基因转移到细胞中的组成
公开(公告)号：US06372714B1
公开(公告)日：2002-04-16
申请号：US09402452
申请日：1999-10-07
申请人： Kenichi Tanaka , Hiroshi Kikuchi , Norio Suzuki
发明人： Kenichi Tanaka , Hiroshi Kikuchi , Norio Suzuki
IPC分类号： A61K746
CPC分类号： A61K9/1272 , A61K48/00 , C12N15/88
摘要： The present invention is directed to a composition for gene transfer which composition contains a quaternary ammonium salt represented by formula (1): wherein A represents (wherein each of R1, R2, R3, R4 and R5, which are identical to or different from one another, represents a C9-C17 aliphatic group); X1 represents a halogen atom; and n is an integer from 1 to 10 inclusive; and a method for introducing a gene into a cell by use of the composition. The composition enables effective delivery and expression of a gene which previously could not be effectively expressed in cells due to the low ratio at which the gene is delivered into cells. Therefore, the composition is advantageously used as a gene transfer reagent or a pharmaceutical.
摘要翻译：本发明涉及一种用于基因转移的组合物，该组合物含有由式（1）表示的季铵盐：其中A表示（其中R 1，R 2，R 3，R 4和R 5各自与一个或多个相同或不同）另一个，代表C 9 -C 17脂族基团）; X1表示卤原子; n为1〜10的整数，以及通过使用该组合物将基因导入细胞的方法。由于将基因递送到细胞中的比例低，组合物能够有效地递送和表达以前不能在细胞中表达的基因。因此，该组合物有利地用作基因转移试剂或药物。

98. 发明授权

US06368631B1 Fine grain carriers and medicinal composition prepared with the use of the same 失效
标题翻译：精细的颗粒载体和使用相同的药物组合物
公开(公告)号：US06368631B1
公开(公告)日：2002-04-09
申请号：US09452371
申请日：1999-12-01
申请人： Mitsuru Akashi , Akio Kishida , Shinji Sakuma , Hiroshi Kikuchi
发明人： Mitsuru Akashi , Akio Kishida , Shinji Sakuma , Hiroshi Kikuchi
IPC分类号： A61K914
CPC分类号： A61K47/32 , A61K9/1635
摘要： The present invention is directed to particulate carriers useful as drug carriers in a drug delivery system (DDS) and to pharmaceutical compositions making use of such carriers. The invention is characterized by the use, as the particulate carrier, of: graft copolymer (A) whose graft chain is poly N-alkylacrylamide chain, poly N-alkylmethacrylamide chain, etc.; and a composition containing a combination of the graft copolymer (A) and at least one graft copolymers selected from the group consisting of graft copolymers (B-1) having polyacrylic acid or polymethacrylic acid as the graft chain and graft copolymers (B-2) having a polyvinyl amine compound as the graft chain.
摘要翻译：本发明涉及用作药物递送系统（DDS）中的药物载体的颗粒载体和利用这种载体的药物组合物。本发明的特征在于使用接枝共聚物（A）作为颗粒载体，其接枝链是聚N-烷基丙烯酰胺链，聚N-烷基甲基丙烯酰胺链等; 和含有接枝共聚物（A）和至少一种选自具有聚丙烯酸或聚甲基丙烯酸作为接枝链的接枝共聚物（B-1）和接枝共聚物（B-2）的组合的组合物，具有聚乙烯胺化合物作为接枝链。

99. 发明授权

US06326681B1 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US06326681B1
公开(公告)日：2001-12-04
申请号：US09482648
申请日：2000-01-13
申请人： Gen Murakami , Kunihiro Tsubosaki , Masahiro Ichitani , Kunihiko Nishi , Ichiro Anjo , Asao Nishimura , Makoto Kitano , Akihiro Yaguchi , Sueo Kawai , Masatsugu Ogata , Syuuji Eguchi , Hiroyoshi Kokaku , Masanori Segawa , Hiroshi Hozoji , Takashi Yokoyama , Noriyuki Kinjo , Aizo Kaneda , Junichi Saeki , Shozo Nakamura , Akio Hasebe , Hiroshi Kikuchi , Isamu Yoshida , Takashi Yamazaki , Kazuyoshi Oshima , Tetsuro Matsumoto
发明人： Gen Murakami , Kunihiro Tsubosaki , Masahiro Ichitani , Kunihiko Nishi , Ichiro Anjo , Asao Nishimura , Makoto Kitano , Akihiro Yaguchi , Sueo Kawai , Masatsugu Ogata , Syuuji Eguchi , Hiroyoshi Kokaku , Masanori Segawa , Hiroshi Hozoji , Takashi Yokoyama , Noriyuki Kinjo , Aizo Kaneda , Junichi Saeki , Shozo Nakamura , Akio Hasebe , Hiroshi Kikuchi , Isamu Yoshida , Takashi Yamazaki , Kazuyoshi Oshima , Tetsuro Matsumoto
IPC分类号： H01L23495
CPC分类号： H01L23/3107 , H01L23/4951 , H01L23/49555 , H01L23/49558 , H01L23/49568 , H01L23/49586 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/105 , H01L29/0657 , H01L2224/0401 , H01L2224/05554 , H01L2224/05599 , H01L2224/16245 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/4569 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/48599 , H01L2224/48699 , H01L2224/48799 , H01L2224/49171 , H01L2224/73215 , H01L2224/73265 , H01L2224/85205 , H01L2224/8592 , H01L2224/92147 , H01L2225/1005 , H01L2225/1029 , H01L2225/107 , H01L2225/1088 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01039 , H01L2924/01043 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01058 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01092 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/13091 , H01L2924/14 , H01L2924/15738 , H01L2924/15747 , H01L2924/1576 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/3511 , H05K1/144 , H05K1/181 , H05K3/3421 , H01L2924/00012 , H01L2924/00 , H01L2924/01026 , H01L2924/3512 , H01L2924/0695 , H01L2224/85399
摘要： As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the “Lead-On-Chip” or “Chip-On-Lead” structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.
摘要翻译：由于半导体芯片尺寸大，高集成度和加速度，所以难以将半导体芯片与包装中的引线组合在一起。鉴于这种困难，已经采用称为半导体和引线堆叠和封装的称为“片上引线”或“引线芯片”结构的封装结构。在该结构的封装中，根据本发明，内引线和半导体芯片的前端部之间的间隙比除引导端部和半导体芯片之外的内引线部分之间的间隙宽，从而减小杂散容量，提高信号传输速率和减少电气噪声。

100. 发明授权

US6130114A Semiconductor device 失效
公开(公告)号：US6130114A
公开(公告)日：2000-10-10
申请号：US290582
申请日：1999-04-13
申请人： Gen Murakami , Kunihiro Tsubosaki , Masahiro Ichitani , Kunihiko Nishi , Ichiro Anjoh , Asao Nishimura , Makoto Kitano , Akihiro Yaguchi , Sueo Kawai , Masatsugu Ogata , Syuuji Eguchi , Hiroyoshi Kokaku , Masanori Segawa , Hiroshi Hozoji , Takashi Yokoyama , Noriyuki Kinjo , Aizo Kaneda , Junichi Saeki , Shozo Nakamura , Akio Hasebe , Hiroshi Kikuchi , Isamu Yoshida , Takashi Yamazaki , Kazuyoshi Oshima , Tetsurou Matsumoto
发明人： Gen Murakami , Kunihiro Tsubosaki , Masahiro Ichitani , Kunihiko Nishi , Ichiro Anjoh , Asao Nishimura , Makoto Kitano , Akihiro Yaguchi , Sueo Kawai , Masatsugu Ogata , Syuuji Eguchi , Hiroyoshi Kokaku , Masanori Segawa , Hiroshi Hozoji , Takashi Yokoyama , Noriyuki Kinjo , Aizo Kaneda , Junichi Saeki , Shozo Nakamura , Akio Hasebe , Hiroshi Kikuchi , Isamu Yoshida , Takashi Yamazaki , Kazuyoshi Oshima , Tetsurou Matsumoto
IPC分类号： H01L21/52 , H01L23/31 , H01L23/495 , H01L23/50 , H01L25/10 , H01L29/06 , H05K1/14 , H05K1/18 , H05K3/34 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L23/3107 , H01L23/4951 , H01L23/49555 , H01L23/49558 , H01L23/49568 , H01L23/49586 , H01L24/32 , H01L24/49 , H01L25/105 , H01L29/0657 , H01L2224/0401 , H01L2224/05554 , H01L2224/05599 , H01L2224/16245 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/4569 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/48599 , H01L2224/48699 , H01L2224/48799 , H01L2224/49171 , H01L2224/73215 , H01L2224/73265 , H01L2224/85205 , H01L2224/8592 , H01L2224/92147 , H01L2225/1005 , H01L2225/1029 , H01L2225/107 , H01L2225/1088 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01043 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01058 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01092 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/13091 , H01L2924/14 , H01L2924/15738 , H01L2924/15747 , H01L2924/1576 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/3511 , H05K1/144 , H05K1/181 , H05K3/3421
摘要： As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式