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91. 发明申请

US20100206340A1 Method for Removing Contamination from a Substrate and for Making a Cleaning Solution 有权
标题翻译：从基材去除污染物和清洁溶液的方法
公开(公告)号：US20100206340A1
公开(公告)日：2010-08-19
申请号：US12768349
申请日：2010-04-27
申请人： Erik M. Freer , John M. deLarios , Katrina Mikhaylichenko , Michael Ravkin , Mikhail Korolik , Fred C. Redeker
发明人： Erik M. Freer , John M. deLarios , Katrina Mikhaylichenko , Michael Ravkin , Mikhail Korolik , Fred C. Redeker
IPC分类号： B08B3/00
CPC分类号： H01L21/02052 , B08B7/02 , C11D9/00 , C11D9/02 , C11D9/267 , C11D11/0047 , C11D17/0013 , C11D17/0017 , C23G1/18 , G03F7/42 , H01L21/02057 , H01L21/02096
摘要： A method is provided for removing contamination from a substrate. The method includes applying a cleaning solution having a dispersed phase, a continuous phase and particles dispersed within the continuous phase to a surface of the substrate. The method includes forcing one of the particles dispersed within the continuous phase proximate to one of the surface contaminants. The forcing is sufficient to overcome any repulsive forces between the particles and the surface contaminants so that the one of the particles and the one of the surface contaminants are engaged. The method also includes removing the engaged particle and surface contaminant from the surface of the substrate. A process to manufacture the cleaning material is also provided.
摘要翻译：提供了一种用于从衬底去除污染物的方法。该方法包括将具有分散相，连续相和分散在连续相内的颗粒的清洗溶液施加到基材的表面。该方法包括迫使分散在连续相内的颗粒中的一种接近一种表面污染物。强制足以克服颗粒和表面污染物之间的任何排斥力，使得颗粒中的一个和表面污染物之一接合。该方法还包括从基材的表面除去接合的颗粒和表面污染物。还提供了制造清洁材料的方法。

92. 发明授权

US07749689B2 Methods for providing a confined liquid for immersion lithography 失效
标题翻译：提供用于浸没光刻的限制液体的方法
公开(公告)号：US07749689B2
公开(公告)日：2010-07-06
申请号：US12055219
申请日：2008-03-25
申请人： David Hemker , Fred C. Redeker , John Boyd , John M. de Larios , Michael Ravkin , Mikhail Korolik
发明人： David Hemker , Fred C. Redeker , John Boyd , John M. de Larios , Michael Ravkin , Mikhail Korolik
IPC分类号： G03F7/26
CPC分类号： G03F7/70341 , Y10S134/902
摘要： A method for processing a substrate is provided which includes generating a meniscus on the surface of the substrate and applying photolithography light through the meniscus to enable photolithography processing of a surface of the substrate.
摘要翻译：提供了一种用于处理衬底的方法，其包括在衬底的表面上产生弯月面并且通过弯月面施加光刻光以使得能够对衬底的表面进行光刻处理。

93. 发明申请

US20100108652A1 SYSTEM METHOD AND APPARATUS FOR DRY-IN, DRY-OUT, LOW DEFECT LASER DICING USING PROXIMITY TECHNOLOGY 有权
标题翻译：使用接近技术进行干燥，干燥，低缺陷激光打印的系统方法和装置
公开(公告)号：US20100108652A1
公开(公告)日：2010-05-06
申请号：US12687106
申请日：2010-01-13
申请人： John M. Boyd , Fred C. Redeker
发明人： John M. Boyd , Fred C. Redeker
IPC分类号： B23K26/00
CPC分类号： H01L21/02052 , B08B3/04 , B23K26/1224 , B23K26/146 , B23K26/40 , B23K2103/50 , H01L21/02057 , H01L21/3065 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/67092 , H01L21/78
摘要： A substrate processing system includes a first, movable surface tension gradient device, a dicing device and a system controller. The first, movable surface tension gradient device is capable of supporting a first process within a first meniscus. The first meniscus being supported between the first surface tension gradient device and a first surface of the substrate. The first movable surface tension gradient device capable of being moved relative to the first surface of the substrate. The dicing device is oriented to a desired dicing location. The desired dicing location being encompassed by the meniscus. The system controller is coupled to the dicing device and the surface tension gradient device. The system controller includes a process recipe. A method for dicing a substrate is also described. The method of dicing a substrate including placing a substrate in a substrate dicing system, forming a meniscus between a proximity head and a first surface of the substrate, dicing the substrate at a desired dicing location and simultaneously capturing any particles and contaminants generated by dicing the substrate within the meniscus, the meniscus including the desired dicing location and moving the meniscus in a desired dicing direction.
摘要翻译：基板处理系统包括第一可动表面张力梯度装置，切割装置和系统控制器。第一可移动表面张力梯度装置能够支撑第一弯液面内的第一过程。第一弯液面被支撑在第一表面张力梯度装置和基板的第一表面之间。能够相对于基板的第一表面移动的第一可动表面张力梯度装置。切割装置被定向到期望的切割位置。期望的切割位置被弯液面包围。系统控制器耦合到切割装置和表面张力梯度装置。系统控制器包括处理配方。还描述了用于切割基底的方法。一种切割衬底的方法，包括将衬底放置在衬底切割系统中，在接近头部和衬底的第一表面之间形成弯液面，将衬底切割在期望的切割位置，同时捕获通过切割所产生的任何颗粒和污染物底物在弯液面内，弯月面包括期望的切割位置，并且以期望的切割方向移动弯月面。

94. 发明授权

US07696141B2 Cleaning compound and method and system for using the cleaning compound 有权
标题翻译：清洁剂及使用清洁剂的方法和系统
公开(公告)号：US07696141B2
公开(公告)日：2010-04-13
申请号：US11347154
申请日：2006-02-03
申请人： Erik M. Freer , John M. de Larios , Katrina Mikhaylichenko , Michael Ravkin , Mikhail Korolik , Fred C. Redeker
发明人： Erik M. Freer , John M. de Larios , Katrina Mikhaylichenko , Michael Ravkin , Mikhail Korolik , Fred C. Redeker
IPC分类号： C11D1/02
CPC分类号： H01L21/02052 , B08B7/02 , C11D3/2079 , C11D9/02 , C11D9/26 , C11D9/267 , C11D11/0047 , C11D17/0013 , C11D17/0017 , C23G1/18 , G03F7/425 , G03F7/426 , H05K3/26
摘要： A cleaning compound is provided. The cleaning compound includes about 0.1 weight percent to about 10 weight percent of a fatty acid dispersed in water. The cleaning compound includes an amount of a base sufficient to bring a pH of the fatty acid water solution to about a level where above about 50% of the dispersed fatty acid is ionized. A method for cleaning a substrate, a system for cleaning a substrate, and a cleaning solution prepared by a process are also provided.
摘要翻译：提供清洁化合物。清洁化合物包括分散在水中的约0.1重量％至约10重量％的脂肪酸。清洁化合物包括一定量的足以使脂肪酸水溶液的pH达到大约50％的分散脂肪酸被离子化的水平的碱。还提供了清洁基板的方法，用于清洁基板的系统以及通过工艺制备的清洁溶液。

95. 发明授权

US07675000B2 System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology 失效
标题翻译：使用接近技术的干式，干式，低缺陷激光切割的系统方法和装置
公开(公告)号：US07675000B2
公开(公告)日：2010-03-09
申请号：US11016381
申请日：2004-12-16
申请人： John M. Boyd , Fred C. Redeker
发明人： John M. Boyd , Fred C. Redeker
IPC分类号： B23K26/14 , B23K26/16
CPC分类号： H01L21/02052 , B08B3/04 , B23K26/1224 , B23K26/146 , B23K26/40 , B23K2103/50 , H01L21/02057 , H01L21/3065 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/67092 , H01L21/78
摘要： A substrate processing system includes a first, movable surface tension gradient device, a dicing device and a system controller. The first, movable surface tension gradient device is capable of supporting a first process within a first meniscus. The first meniscus being supported between the first surface tension gradient device and a first surface of the substrate. The first movable surface tension gradient device capable of being moved relative to the first surface of the substrate. The dicing device is oriented to a desired dicing location. The desired dicing location being encompassed by the meniscus. The system controller is coupled to the dicing device and the surface tension gradient device. The system controller includes a process recipe. A method for dicing a substrate is also described.
摘要翻译：基板处理系统包括第一可动表面张力梯度装置，切割装置和系统控制器。第一可移动表面张力梯度装置能够支撑第一弯液面内的第一过程。第一弯液面被支撑在第一表面张力梯度装置和基板的第一表面之间。能够相对于基板的第一表面移动的第一可动表面张力梯度装置。切割装置被定向到期望的切割位置。期望的切割位置被弯液面包围。系统控制器耦合到切割装置和表面张力梯度装置。系统控制器包括处理配方。还描述了用于切割衬底的方法。

96. 发明授权

US07591613B2 Method and apparatus for transporting a substrate using non-newtonian fluid 失效
标题翻译：使用非牛顿流体输送基材的方法和装置
公开(公告)号：US07591613B2
公开(公告)日：2009-09-22
申请号：US12173661
申请日：2008-07-15
申请人： John M. de Larios , Mike Ravkin , John Parks , Mikhail Korolik , Fred C. Redeker
发明人： John M. de Larios , Mike Ravkin , John Parks , Mikhail Korolik , Fred C. Redeker
IPC分类号： B65G51/16
CPC分类号： H01L21/67784 , H01L21/67057
摘要： A method for transporting a substrate is provided. In this method, a non-Newtonian fluid is provided and the substrate is suspended in the non-Newtonian fluid. The non-Newtonian fluid is capable of supporting the substrate. Thereafter, a supply force is applied on the non-Newtonian fluid to cause the non-Newtonian fluid to flow, whereby the flow is capable of moving the substrate along a direction of the flow. Apparatuses and systems for transporting the substrate using the non-Newtonian fluid also are described.
摘要翻译：提供了一种输送基板的方法。在该方法中，提供了非牛顿流体，并将基底悬挂在非牛顿流体中。非牛顿流体能够支撑基底。此后，向非牛顿流体施加供应力以使非牛顿流体流动，由此流动能够沿着流动方向移动基底。还描述了使用非牛顿流体输送基底的装置和系统。

97. 发明授权

US07395611B2 System processing a substrate using dynamic liquid meniscus 失效
标题翻译：使用动态液体半月板处理衬底的系统
公开(公告)号：US07395611B2
公开(公告)日：2008-07-08
申请号：US11525278
申请日：2006-09-21
申请人： James P. Garcia , John M. de Larios , Michael Ravkin , Fred C. Redeker , Carl Woods
发明人： James P. Garcia , John M. de Larios , Michael Ravkin , Fred C. Redeker , Carl Woods
IPC分类号： F26B21/06
CPC分类号： C25D5/22 , C25D7/12 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/68707 , Y10S134/902
摘要： A system and method of moving a meniscus from a first surface to a second surface includes forming a meniscus between a head and a first surface. The meniscus can be moved from the first surface to an adjacent second surface, the adjacent second surface being parallel to the first surface. The system and method of moving the meniscus can also be used to move the meniscus along an edge of a substrate.
摘要翻译：将弯液面从第一表面移动到第二表面的系统和方法包括在头部和第一表面之间形成弯液面。弯液面可以从第一表面移动到相邻的第二表面，相邻的第二表面平行于第一表面。移动弯液面的系统和方法也可以用于沿着基板的边缘移动弯月面。

98. 发明申请

US20080153291A1 Method and Apparatus for Material Deposition 有权
标题翻译：材料沉积方法和装置
公开(公告)号：US20080153291A1
公开(公告)日：2008-06-26
申请号：US12044537
申请日：2008-03-07
申请人： Yezdi Dordi , John Boyd , William Thie , Bob Maraschin , Fred C. Redeker , Joel M. Cook
发明人： Yezdi Dordi , John Boyd , William Thie , Bob Maraschin , Fred C. Redeker , Joel M. Cook
IPC分类号： H01L21/44 , C23C16/00
CPC分类号： C23C18/1612 , C23C18/14 , C23C18/161 , C23C18/1619 , C23C18/1651 , C23C18/1667 , C23C18/168 , C23C18/31 , H01L21/288
摘要： Broadly speaking, a method and an apparatus are provided for depositing a material on a semiconductor wafer (“wafer”). More specifically, the method and apparatus provide for selective heating of a surface of the wafer exposed to an electroless plating solution. The selective heating is provided by applying radiant energy to the wafer surface. The selective heating of the wafer surface causes a temperature increase at an interface between the wafer surface and the electroless plating solution. The temperature increase at the interface in turn causes a plating reaction to occur at the wafer surface. Thus, material is deposited on the wafer surface through an electroless plating reaction that is initiated and controlled by varying the temperature of the wafer surface using an appropriately defined radiant energy source.
摘要翻译：概括地说，提供了一种在半导体晶片（“晶片”）上沉积材料的方法和装置。更具体地，该方法和装置提供了暴露于化学镀溶液的晶片的表面的选择性加热。通过向晶片表面施加辐射能来提供选择性加热。晶片表面的选择性加热导致晶片表面和化学镀溶液之间的界面处的温度升高。界面处的温度升高又导致在晶片表面发生电镀反应。因此，通过化学镀反应将材料沉积在晶片表面上，该电镀反应通过使用适当限定的辐射能源改变晶片表面的温度来启动和控制。

99. 发明授权

US07350315B2 Edge wheel dry manifold 有权
标题翻译：边缘轮干歧管
公开(公告)号：US07350315B2
公开(公告)日：2008-04-01
申请号：US10745219
申请日：2003-12-22
申请人： Glenn W. Davis , Carl Woods , John Parks , Fred C. Redeker , Mike Ravkin , Michael L. Orbock
发明人： Glenn W. Davis , Carl Woods , John Parks , Fred C. Redeker , Mike Ravkin , Michael L. Orbock
IPC分类号： F26B13/30 , B08B5/04
CPC分类号： H01L21/67023 , H01L21/67028 , H01L21/67034 , H01L21/6704 , H01L21/68707
摘要： A apparatus for drying a substrate includes a vacuum manifold positioned adjacent to an edge wheel. The edge wheel includes an edge wheel groove for receiving a peripheral edge of a substrate, and the edge wheel is capable of rotating the substrate at a desired set velocity. The vacuum manifold includes a proximity end having one or more vacuum ports defined therein. The proximity end is positioned at least partially within the edge wheel groove, and using supplied vacuum removes fluids that accumulate in the edge wheel groove and prevents re-deposit of trapped fluids around the peripheral edge of the substrate.
摘要翻译：用于干燥衬底的设备包括邻近边缘轮定位的真空歧管。边缘轮包括用于接收基板周边的边缘轮槽，并且边缘轮能够以所需的设定速度旋转基板。真空歧管包括具有限定在其中的一个或多个真空端口的邻近端。邻近端部至少部分地定位在边缘轮槽内，并且使用提供的真空去除积聚在边缘轮槽中的流体并且防止捕获的流体围绕衬底的周边边缘重新沉积。

100. 发明授权

US07252736B1 Compliant grinding wheel 有权
标题翻译：合格砂轮
公开(公告)号：US07252736B1
公开(公告)日：2007-08-07
申请号：US10816504
申请日：2004-03-31
申请人： John M. Boyd , Fred C. Redeker , Yezdi Dordi
发明人： John M. Boyd , Fred C. Redeker , Yezdi Dordi
IPC分类号： B24B1/00 , B24B5/02
CPC分类号： B24B7/228 , B24D13/142
摘要： A pre-planarization module configured to perform a long range planarization operation is provided. The pre-planarization module includes a semiconductor substrate support configured to rotate about a first axis. The pre-planarization module also includes an annular ring having a first side with a compliant layer affixed thereto. The second side of the compliant layer is affixed to a planarizing surface. The annular ring is configured to move perpendicular and parallel to a plane associated with the substrate support. Additionally, the annular ring is configured to rotate about a second axis, where the second axis is offset from the first axis. The substrate support and the annular ring rotate in the same direction. A method for performing a planarization process and a substrate grinding device are also provided.
摘要翻译：提供了一种配置成执行长距离平面化操作的预平面化模块。预平坦化模块包括构造成围绕第一轴线旋转的半导体衬底支撑件。预平坦化模块还包括环形环，其具有固定到其上的柔性层的第一侧。柔性层的第二面固定在平坦化表面上。环形环被配置为垂直并平行于与衬底支撑件相关联的平面移动。另外，环形环被构造成围绕第二轴线旋转，其中第二轴线从第一轴线偏移。基板支撑件和环形圈沿相同的方向旋转。还提供了一种用于执行平面化处理的方法和基板研磨装置。

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