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91. 发明申请

US20140061827A1 Metal Protection Layer over SiN Encapsulation for Spin-Torque MRAM Device Applications 审中-公开
标题翻译：用于自旋扭矩MRAM器件应用的SiN封装上的金属保护层
公开(公告)号：US20140061827A1
公开(公告)日：2014-03-06
申请号：US13597465
申请日：2012-08-29
申请人： Kenlin Huang , Yuan-Tung Chin , Tom Zhong , Chyu-Jiuh Torng
发明人： Kenlin Huang , Yuan-Tung Chin , Tom Zhong , Chyu-Jiuh Torng
IPC分类号： H01L29/82 , H01L21/8239
CPC分类号： G01R33/098 , B82Y40/00 , G11C11/161 , H01F10/3254 , H01F41/308 , H01F41/325 , H01L43/02 , H01L43/08 , H01L43/12
摘要： A magnetic thin film deposition is patterned and protected from oxidation during subsequent processes, such as bit line formation, by an oxidation-prevention encapsulation layer of SiN. The SiN layer is then itself protected during the processing by a metal overlayer, preferably of Ta, Al, TiN, TaN or W. A sequence of low pressure plasma etches, using Oxygen, Cl2, BCl3 and C2H4 chemistries provide selectivity of the metal overlayer to various oxide layers and to the photo-resist hard masks used in patterning and metal layer and thereby allow the formation of bit lines while maintaining the integrity of the SiN layer.
摘要翻译：通过SiN的防氧化封装层，在随后的工艺（例如位线形成）中图案化和保护磁性薄膜沉积物免于氧化。然后，SiN层在金属覆盖层，优选Ta，Al，TiN，TaN或W的加工过程中自身受到保护。使用氧气，Cl2，BCl3和C2H4化学物质的低压等离子体蚀刻序列提供金属覆层的选择性到各种氧化物层和用于图案化和金属层中的光刻胶硬掩模，从而允许形成位线，同时保持SiN层的完整性。

92. 发明授权

US08636911B2 Process for MEMS scanning mirror with mass remove from mirror backside 有权
标题翻译：从镜面背面去除质量的MEMS扫描镜的工艺
公开(公告)号：US08636911B2
公开(公告)日：2014-01-28
申请号：US12924873
申请日：2010-10-07
申请人： Jun Chen , Guomin Mao , Tom Zhong , Wei Cao , Yee-Chung Fu , Chyu-Jiuh Torng
发明人： Jun Chen , Guomin Mao , Tom Zhong , Wei Cao , Yee-Chung Fu , Chyu-Jiuh Torng
IPC分类号： B81C1/00
CPC分类号： B81B3/0045 , B81B2201/042 , G02B26/0841
摘要： Two methods of fabricating a MEMS scanning mirror having a tunable resonance frequency are described. The resonance frequency of the mirror is set to a particular value by mass removal from the backside of the mirror during fabrication.
摘要翻译：描述制造具有可调共振频率的MEMS扫描反射镜的两种方法。反射镜的共振频率通过在制造期间从反射镜的背面质量去除而被设定为特定的值。

93. 发明申请

US20130302912A1 Method to Reduce Magnetic Film Stress for Better Yield 有权
标题翻译：减少磁膜应力以获得更好的产量的方法
公开(公告)号：US20130302912A1
公开(公告)日：2013-11-14
申请号：US13469258
申请日：2012-05-11
申请人： Tom Zhong , Kenlin Huang , Chyu-Jiuh Torng
发明人： Tom Zhong , Kenlin Huang , Chyu-Jiuh Torng
IPC分类号： H01L21/02
CPC分类号： H01L43/12 , H01L43/08
摘要： A method of forming a thin-film deposition, such as an MTJ (magnetic tunneling junction) layer, on a wafer-scale CMOS substrate so that the thin-film deposition is segmented by walls or trenches and not affected by thin-film stresses due to wafer warpage or other subsequent annealing processes. An interface layer is formed on the CMOS substrate and is patterned by either forming undercut trenches extending into its upper surface or by fabricating T-shaped walls that extend along its upper surface. The thin-film is deposited continuously over the patterned surface, whereupon either the trenches or walls segment the deposition and serve as stress-relief mechanisms to eliminate adverse effects of processing as stresses such as those caused by wafer warpage.
摘要翻译：在晶片级CMOS衬底上形成诸如MTJ（磁性隧道结）层的薄膜沉积的方法，使得薄膜沉积被壁或沟槽分段，并且不受薄膜应力的影响晶圆翘曲或其他后续退火工艺。在CMOS衬底上形成界面层，并且通过形成延伸到其上表面的底切沟槽或通过制造沿其上表面延伸的T形壁而被图案化。薄膜连续地沉积在图案化表面上，于是沟槽或壁分隔沉积物并用作应力消除机制，以消除作为诸如由晶片翘曲引起的应力的加工的不利影响。

94. 发明申请

US20120169331A1 GMR Sensor Stripe for a Biosensor with Enhanced Sensitivity 有权
标题翻译：用于具有增强灵敏度的生物传感器的GMR传感器条带
公开(公告)号：US20120169331A1
公开(公告)日：2012-07-05
申请号：US13417398
申请日：2012-03-12
申请人： Po-Kang Wang , Xizeng Shi , Chyu-Jiuh Torng
发明人： Po-Kang Wang , Xizeng Shi , Chyu-Jiuh Torng
IPC分类号： G01R33/02 , H05K3/00
CPC分类号： G01R33/0052 , B82Y25/00 , G01N15/0656 , G01N27/745 , G01N2015/0065 , G01R33/05 , G01R33/093 , G01R33/098 , Y10T29/49124 , Y10T29/49986
摘要： A GMR sensor stripe provides a sensitive mechanism for detecting the presence of magnetized particles bonded to biological molecules that are affixed to a substrate. The adverse effect of hysteresis on the maintenance of a stable bias point for the magnetic moment of the sensor stripe free layer is eliminated by a combination of biasing the sensor stripe along its longitudinal direction rather than the usual transverse direction and by using the overcoat stress and magnetostriction of magnetic layers to create a compensatory transverse magnetic anisotropy. By connecting the stripes in an array and making the spaces between the stripes narrower than the dimension of the magnetized particle and by making the width of the stripes equal to the dimension of the particle, the sensitivity of the sensor array is enhanced.
摘要翻译： GMR传感器条带提供用于检测粘附到固定到基底上的生物分子的磁化颗粒的存在的敏感机制。通过将传感器条沿其纵向而不是通常的横向方向偏置并通过使用外涂层应力和组合来消除滞后对传感器无条纹层的磁矩的稳定偏置点的维持的不利影响磁层的磁致伸缩产生补偿横向磁各向异性。通过将条纹连接在阵列中，使得条纹之间的空间比磁化粒子的尺寸窄，并且通过使条纹的宽度等于粒子的尺寸，增强了传感器阵列的灵敏度。

95. 发明授权

US08012316B2 FCC-like trilayer AP2 structure for CPP GMR EM improvement 有权
标题翻译： FCC类三层AP2结构，用于CPP GMR EM改进
公开(公告)号：US08012316B2
公开(公告)日：2011-09-06
申请号：US12583742
申请日：2009-08-25
申请人： Kunliang Zhang , Dan Abels , Min Li , Chyu-Jiuh Torng , Chen-Jung Chien , Yu-Hsia Chen
发明人： Kunliang Zhang , Dan Abels , Min Li , Chyu-Jiuh Torng , Chen-Jung Chien , Yu-Hsia Chen
IPC分类号： C23C14/14
CPC分类号： H01L43/10 , B82Y10/00 , B82Y25/00 , B82Y40/00 , G11B5/3906 , H01F10/16 , H01F10/3236 , H01F10/3259 , H01F10/3272 , H01F41/302
摘要： A method of forming a CPP-GMR spin valve having a pinned layer with an AP2/coupling/AP1 configuration is disclosed wherein the AP2 portion is a FCC-like trilayer having a composition represented by CoZFe(100-Z)/Fe(100-X)TaX/CoZFe(100-Z) or CoZFe(100-Z)/FeYCo(100-Y)/CoZFe(100-Z) where x is 3 to 30 atomic %, y is 40 to 100 atomic %, and z is 75 to 100 atomic %. Preferably, z is 90 to provide a face centered cubic structure that minimizes electromigration. Optionally, the middle layer is comprised of an Fe rich alloy such as FeCr, FeV, FeW, FeZr, FeNb, FeHf, or FeMo. EM performance is improved significantly compared to a spin valve with a conventional AP2 Co50Fe50 or Co75Fe25 single layer. MR ratio is also increased and RA is maintained at an acceptable level. The coupling layer is preferably Ru and the AP1 layer may be comprised of a lamination of CoFe and Cu layers as in [CoFe/Cu]2/CoFe.
摘要翻译：公开了一种形成具有AP2 /偶联/ AP1构型的钉扎层的CPP-GMR自旋阀的方法，其中AP2部分是具有由CoZFe（100-Z）/ Fe（100-Z）/ Fe X）TaX / CoZFe（100-Z）或CoZFe（100-Z）/ FeYCo（100-Y）/ CoZFe（100-Z），其中x为3至30原子％，y为40至100原子％为75〜100原子％。优选地，z为90以提供使电迁移最小化的面心立方结构。任选地，中间层由富Fe合金如FeCr，FeV，FeW，FeZr，FeNb，FeHf或FeMo组成。与具有常规AP2 Co50Fe50或Co75Fe25单层的自旋阀相比，EM性能显着提高。 MR比也增加，RA维持在可接受的水平。耦合层优选为Ru，并且AP1层可以由如[CoFe / Cu] 2 / CoFe中的CoFe和Cu层的层叠构成。

96. 发明申请

US20110073917A1 Method of high density memory fabrication 有权
标题翻译：高密度存储器制造方法
公开(公告)号：US20110073917A1
公开(公告)日：2011-03-31
申请号：US12586900
申请日：2009-09-29
申请人： Tom Zhong , Adam Zhong , Wai-Ming J. Kan , Chyu-Jiuh Torng
发明人： Tom Zhong , Adam Zhong , Wai-Ming J. Kan , Chyu-Jiuh Torng
IPC分类号： H01L29/66 , H01L21/4763
CPC分类号： H01L27/105 , H01L21/76819 , H01L21/7684 , H01L23/522 , H01L27/228 , H01L2924/0002 , H01L2924/00
摘要： The structure and method of formation of an integrated CMOS level and active device level that can be a memory device level. The integration includes the formation of a “super-flat” interface between the two levels formed by the patterning of a full complement of active and dummy interconnecting vias using two separate patterning and etch processes. The active vias connect memory devices in the upper device level to connecting pads in the lower CMOS level. The dummy vias may extend up to an etch stop layer formed over the CMOS layer or may be stopped at an intermediate etch stop layer formed within the device level. The dummy vias thereby contact memory devices but do not connect them to active elements in the CMOS level.
摘要翻译：集成CMOS级别和有源器件级别的结构和方法可以是存储器件级。整合包括通过使用两个单独的图案化和蚀刻工艺对完整的有源和虚拟互连通孔进行图案化形成的两层之间形成“超平面”界面。有源通孔将上部器件电平的存储器件连接到较低CMOS电平的连接焊盘。虚拟通孔可以延伸到在CMOS层上形成的蚀刻停止层，或者可以在形成在器件级内的中间蚀刻停止层处停止。因此，虚拟通孔接触存储器件，但不将它们连接到CMOS电平中的有源元件。

97. 发明授权

US07863060B2 Method of double patterning and etching magnetic tunnel junction structures for spin-transfer torque MRAM devices 有权
标题翻译：双重图案化和蚀刻用于自旋转移转矩MRAM器件的磁性隧道结结构的方法
公开(公告)号：US07863060B2
公开(公告)日：2011-01-04
申请号：US12383298
申请日：2009-03-23
申请人： Rodolfo Belen , Tom Zhong , Witold Kula , Chyu-Jiuh Torng
发明人： Rodolfo Belen , Tom Zhong , Witold Kula , Chyu-Jiuh Torng
IPC分类号： H01L21/00
CPC分类号： H01L27/228 , H01L43/12
摘要： A method for forming a MTJ in a STT-MRAM is disclosed in which the easy-axis CD is determined independently of the hard-axis CD. One approach involves two photolithography steps each followed by two plasma etch steps to form a post in a hard mask which is transferred through a MTJ stack of layers. The hard mask has an upper Ta layer with a thickness of 300 to 400 Angstroms and a lower NiCr layer less than 50 Angstroms thick. The upper Ta layer is etched with a fluorocarbon etch while lower NiCr layer and underlying MTJ layers are etched with a CH3OH. Preferably, a photoresist mask layer is removed by oxygen plasma between the fluorocarbon and CH3OH plasma etches. A lower hard mask layer made of NiCr or the like is inserted to prevent formation and buildup of Ta etch residues that can cause device shunting.
摘要翻译：公开了一种用于在STT-MRAM中形成MTJ的方法，其中容易轴CD独立于硬轴CD来确定。一种方法涉及两个光刻步骤，每个步骤分别采用两个等离子体蚀刻步骤，以在通过MTJ堆叠层传送的硬掩模中形成柱。硬掩模具有厚度为300至400埃的上层Ta层和小于50埃厚的较低NiCr层。用氟碳蚀刻蚀刻上层Ta层，同时用CH3OH蚀刻下层NiCr层和下层MTJ层。优选地，在碳氟化合物和CH 3 OH等离子蚀刻之间的氧等离子体去除光致抗蚀剂掩模层。插入由NiCr等制成的下部硬掩模层以防止可能导致器件分流的Ta蚀刻残留物的形成和积累。

98. 发明授权

US07750421B2 High performance MTJ element for STT-RAM and method for making the same 有权
标题翻译：用于STT-RAM的高性能MTJ元件和制作相同的方法
公开(公告)号：US07750421B2
公开(公告)日：2010-07-06
申请号：US11880583
申请日：2007-07-23
申请人： Cheng T. Horng , Ru-Ying Tong , Chyu-Jiuh Torng , Witold Kula
发明人： Cheng T. Horng , Ru-Ying Tong , Chyu-Jiuh Torng , Witold Kula
IPC分类号： H01L29/82
CPC分类号： H01L43/08 , B82Y25/00 , B82Y40/00 , G11C11/161 , H01F10/3272 , H01F10/329 , H01F10/3295 , H01F41/307 , H01L43/10 , H01L43/12
摘要： A STT-MTJ MRAM cell that utilizes transfer of spin angular momentum as a mechanism for changing the magnetic moment direction of a free layer includes an IrMn pinning layer, a SyAP pinned layer, a naturally oxidized, crystalline MgO tunneling barrier layer that is formed on an Ar-ion plasma smoothed surface of the pinned layer and, in one embodiment, a free layer that comprises an amorphous layer of Co60Fe20B20 of approximately 20 angstroms thickness formed between two crystalline layers of Fe of 3 and 6 angstroms thickness respectively or on a single such layer. The free layer is characterized by a low Gilbert damping factor and by very strong polarizing action on conduction electrons. The resulting cell has a low critical current, a high dR/R and a plurality of such cells will exhibit a low variation of both resistance and pinned layer magnetization angular dispersion.
摘要翻译：利用自旋角度动量的转移作为改变自由层的磁矩方向的机构的STT-MTJ MRAM单元包括IrMn钉扎层，SyAP钉扎层，自然氧化的结晶的MgO隧穿势垒层，其形成于钉扎层的Ar离子等离子体平滑表面，并且在一个实施例中，自由层包括分别在3和6埃厚度的Fe的两个结晶层之间形成的约20埃厚度的Co60Fe20B20的非晶层，或者在单个这样的层。自由层的特征在于低吉尔伯特阻尼因子和对传导电子的非常强的偏振作用。所得到的电池具有低临界电流，高dR / R，并且多个这样的电池将呈现电阻和钉扎层磁化角分散的低变化。

99. 发明申请

US20100136713A1 Hafnium doped cap and free layer for mram device 有权
标题翻译：铪掺杂帽和自由层用于mram器件
公开(公告)号：US20100136713A1
公开(公告)日：2010-06-03
申请号：US12657775
申请日：2010-01-27
申请人： Cheng T. Horng , Ru-Ying Tong , Chyu-Jiuh Torng , Witold Kula
发明人： Cheng T. Horng , Ru-Ying Tong , Chyu-Jiuh Torng , Witold Kula
IPC分类号： H01L43/12
CPC分类号： H01F10/3254 , B82Y25/00 , G11B5/3163 , G11B5/3906 , G11C11/161 , H01F10/3281 , H01F10/3295 , H01F41/325 , H01L43/08 , H01L43/10 , H01L43/12 , Y10T29/49041 , Y10T29/49043 , Y10T29/49044 , Y10T29/49046 , Y10T29/49048 , Y10T29/49052
摘要： A high performance MTJ, and a process for manufacturing it, are described. A capping layer of NiFeHf is used to getter oxygen out of the free layer, thereby increasing the sharpness of the free layer-tunneling layer interface. The free layer comprises two NiFe layers whose magnetostriction constants are of opposite sign, thereby largely canceling one another.
摘要翻译：描述了高性能MTJ及其制造方法。使用NiFeHf的覆盖层将氧气从自由层中吸出，从而增加了自由层 - 隧道层界面的清晰度。自由层包含两个NiFe层，它们的磁致伸缩常数是相反的，从而很大程度地相互抵消。

100. 发明授权

US07688555B2 Hard bias design for extra high density recording 有权
标题翻译：用于超高密度记录的硬偏置设计
公开(公告)号：US07688555B2
公开(公告)日：2010-03-30
申请号：US10868716
申请日：2004-06-15
申请人： Kunliang Zhang , Yun-Fei Li , Chyu-Jiuh Torng , Chen-Jung Chien
发明人： Kunliang Zhang , Yun-Fei Li , Chyu-Jiuh Torng , Chen-Jung Chien
IPC分类号： G11B5/39 , G11B5/127
CPC分类号： B82Y25/00 , B82Y10/00 , G11B5/3912 , G11B5/3932 , G11B2005/3996
摘要： A hard bias structure for biasing a free layer in a MR element within a read head is comprised of a composite hard bias layer having a Co78.6Cr5.2Pt16.2/Co65Cr15Pt20 configuration. The upper Co65Cr15Pt20 layer has a larger Hc value and a thickness about 2 to 10 times greater than that of the Co78.6Cr5.2Pt16.2 layer. The hard bias structure may also include a BCC underlayer such as FeCoMo which enhances the magnetic moment of the hard bias structure. Optionally, the thickness of the Co78.6Cr5.2Pt16.2 layer is zero and the Co65Cr15Pt20 layer is formed on the BCC underlayer. The present invention also encompasses a laminated hard bias structure. The Mrt value for the hard bias structure may be optimized by adjusting the thicknesses of the BCC underlayer and CoCrPt layers. As a result, a larger process window is realized and lower asymmetry output during a read operation is achieved.
摘要翻译：用于偏置读取头内的MR元件中的自由层的硬偏置结构由具有Co78.6Cr5.2Pt16.2 / Co65Cr15Pt20配置的复合硬偏置层组成。 Co65Cr15Pt20上层具有较大的Hc值，厚度约为Co78.6Cr5.2Pt16.2层的2〜10倍。硬偏压结构还可以包括诸如FeCoMo的BCC底层，其增强了硬偏压结构的磁矩。可选地，Co78.6Cr5.2Pt16.2层的厚度为零，Co65Cr15Pt20层形成在BCC底层上。本发明还包括层压硬偏置结构。可以通过调整BCC底层和CoCrPt层的厚度来优化硬偏置结构的Mrt值。结果，实现了更大的处理窗口，并且在读取操作期间实现了较低的不对称输出。

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