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91. 发明申请

US20070091568A1 HEAT SINK 失效
标题翻译：散热器
公开(公告)号：US20070091568A1
公开(公告)日：2007-04-26
申请号：US11163573
申请日：2005-10-24
申请人： Chun-Chi Chen , Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Jin-Biao Liu
发明人： Chun-Chi Chen , Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Jin-Biao Liu
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , F28D15/0275 , F28F3/02 , H01L23/3672 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat sink includes a fin assembly (20) including a plurality of fin plates (22) and a fan (30) mounted on the fin assembly. Each fin plate includes a plurality of cutouts (226) defined on one edge thereof, and the cutouts of the fin plates cooperatively form a scraggy surface when the fin plates are assembled together. Airflow produced by the fan directly impinges on the scraggy surface thereby enhancing heat transferring between the fin plates and the airflow.
摘要翻译：散热器包括包括多个翅片板（22）和安装在翅片组件上的风扇（30）的翅片组件（20）。每个鳍板包括限定在其一个边缘上的多个切口（226），并且当翅片板组装在一起时，翅片板的切口协同地形成刮屑表面。由风扇产生的气流直接撞击在肮脏的表面上，从而增强翅片与气流之间的热传递。

92. 发明授权

US07447035B2 Heat dissipation device assembly 失效
标题翻译：散热装置总成
公开(公告)号：US07447035B2
公开(公告)日：2008-11-04
申请号：US11566015
申请日：2006-12-01
申请人： Jin-Biao Liu , Guang Yu , Shih-Hsun Wung , Chun-Chi Chen
发明人： Jin-Biao Liu , Guang Yu , Shih-Hsun Wung , Chun-Chi Chen
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： H01L23/4006 , H01L23/3672 , H01L23/427 , H01L2023/4056 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device assembly is mounted on a printed circuit board (80). First and second electronic components (82, 84) are mounted on the printed circuit board. The heat dissipation device assembly includes a first heat sink (10) in thermal contact with the first electronic component, and a second heat sink (20) in thermal contact with the second electronic component. A spring tab (24) is sandwiched between the first and second heat sinks for providing spring force between the first and second heat sinks thus securely mounting the second heat sink on the second electronic component.
摘要翻译：散热装置组件安装在印刷电路板（80）上。第一和第二电子部件（82,84）安装在印刷电路板上。散热装置组件包括与第一电子部件热接触的第一散热器（10）和与第二电子部件热接触的第二散热器（20）。在第一和第二散热器之间夹有弹簧片（24），以在第一和第二散热器之间提供弹簧力，从而将第二散热器牢固地安装在第二电子部件上。

93. 发明授权

US07414841B2 Electronic cooling system having a ventilating duct 失效
标题翻译：具有通风管的电子冷却系统
公开(公告)号：US07414841B2
公开(公告)日：2008-08-19
申请号：US11307011
申请日：2006-01-19
申请人： Chun-Chi Chen , Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Jin-Biao Liu
发明人： Chun-Chi Chen , Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Jin-Biao Liu
IPC分类号： H05K7/20 , H05K5/00 , F28D15/00
CPC分类号： G06F1/20 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device in a computer enclosure includes a heat spreader (20) mounted on a CPU (12), a first heat sink (30), a cooling fan (40) coupled to the first heat sink, a second heat sink (50), a heat pipe (80) mounted on the heat spreader and thermally connected the first heat sink and the second heat sink, a system fan (60) attached to the second heat sink, and a fan duct (70) interconnected between the cooling fan and the second heat sink. The system fan is positioned adjacent to louvers of the computer enclosure. An airflow generated by the cooling fan and the system fan flows through the first heat sink, then the fan duct, the second heat sink, and finally the louvers to leave the computer enclosure.
摘要翻译：计算机外壳中的散热装置包括安装在CPU（12）上的散热器（20），第一散热器（30），耦合到第一散热器的冷却风扇（40），第二散热器（50）），安装在所述散热器上并热连接所述第一散热器和所述第二散热器的热管（80），附接到所述第二散热器的系统风扇（60）和在所述冷却风扇和第二个散热器。系统风扇位于计算机外壳的百叶窗附近。由冷却风扇和系统风扇产生的气流流过第一散热器，然后流过风扇导管，第二散热器，最后通风百叶窗离开电脑外壳。

94. 发明申请

US20070263355A1 HEAT DISSIPATION SYSTEM 审中-公开
标题翻译：散热系统
公开(公告)号：US20070263355A1
公开(公告)日：2007-11-15
申请号：US11309837
申请日：2006-10-09
申请人： Guang Yu , Da-Yuan Zhou , Shih-Hsun Wung , Chun-Chi Chen
发明人： Guang Yu , Da-Yuan Zhou , Shih-Hsun Wung , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation system is used for dissipating heat generated by an electronic device. The heat dissipation system includes a computer enclosure containing the electronic device therein. The computer enclosure has a heat dissipating member formed thereon. A base contacts the electronic device in the computer enclosure. At least a heat pipe includes a first end thermally engaged in at least a groove defined in the base and a second end thermally contacting the computer enclosure. A heat sink is mounted on the base and thermally connects with the base and the first end of the at least a heat pipe.
摘要翻译：散热系统用于散发由电子设备产生的热量。散热系统包括其中包含电子设备的计算机外壳。计算机外壳具有形成在其上的散热构件。基座接触电脑机箱中的电子设备。至少热管包括热接合在限定在基部中的至少一个凹槽中的第一端和与该计算机外壳热接触的第二端。散热器安装在基座上并与基座和至少一个热管的第一端热连接。

95. 发明授权

US07286357B2 Computer system with cooling device for CPU 失效
标题翻译：具有CPU冷却装置的计算机系统
公开(公告)号：US07286357B2
公开(公告)日：2007-10-23
申请号：US11164534
申请日：2005-11-29
申请人： Shih-Hsun Wung , Chun-Chi Chen , Bao-Chun Chen
发明人： Shih-Hsun Wung , Chun-Chi Chen , Bao-Chun Chen
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A computer system includes a casing, a motherboard, a CPU mounted on the motherboard and a cooling device. The casing includes a pair of parallel panels. Air inlets and air outlets are respectively defined in the parallel panels and oriented toward each other. The motherboard is parallelly positioned between the parallel panels. The cooling device has a base portion contacting the CPU, a heat dissipation portion defining a plurality of channels communicating with the air outlets, at least one heat pipe thermally connecting the heat dissipation portion to the base portion, and a fan communicating with the air inlets and the channels.
摘要翻译：计算机系统包括壳体，母板，安装在母板上的CPU和冷却装置。壳体包括一对平行板。空气入口和出气口分别定义在平行面板上并相互朝向。主板平行地位于平行板之间。冷却装置具有接触CPU的基部，限定与空气出口连通的多个通道的散热部，至少一个将散热部热连接到基部的热管，以及与空气入口连通的风扇和频道。

96. 发明申请

US20060273137A1 HEAT DISSIPATION DEVICE WITH HEAT PIPES 失效
标题翻译：带热管的散热装置
公开(公告)号：US20060273137A1
公开(公告)日：2006-12-07
申请号：US11308383
申请日：2006-03-20
申请人： Chun-Chi Chen , Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Jin-Biao Liu
发明人： Chun-Chi Chen , Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Jin-Biao Liu
IPC分类号： A47J36/02
CPC分类号： H01L23/4006 , H01L23/427 , H01L2023/4056 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device comprises a seat for absorbing heat from a heat generating device. At least a heat pipe has a first section thereof thermally combined to the seat, and two second sections thereof extending from the first section and remotely from the seat. Pluralities of heat sinks are located on the seat. Each of the pluralities of heat sinks has a base and a plurality of fins integrally extending from the base and is made of aluminum extrusion. The bases of the heat sinks thermally sandwich the two second sections of the at least a heat pipe therebetween. At least one of the bases of the heat sinks is angled or perpendicular to the seat.
摘要翻译：散热装置包括用于从发热装置吸收热量的座。至少一个热管具有与座椅热结合的第一部分，并且其第二部分从第一部分延伸并远离座椅。多个散热片位于座椅上。多个散热器中的每一个具有基部和从基部一体地延伸并由铝挤压制成的多个翅片。散热器的基部将其中的至少一个热管的两个第二部分热夹心。散热器的至少一个基座成角度或垂直于座椅。

97. 发明授权

US07690418B2 Heat sink 失效
标题翻译：散热器
公开(公告)号：US07690418B2
公开(公告)日：2010-04-06
申请号：US11306423
申请日：2005-12-28
申请人： Chun-Chi Chen , Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Jin-Biao Liu
发明人： Chun-Chi Chen , Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Jin-Biao Liu
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0275 , F28F3/048 , F28F3/06 , H01L23/4006 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink for dissipating heat from an electronic element comprises a base with a plurality of first fins extending upwardly therefrom, a conducting member thermally contacting the base with a plurality of second fins extending from two opposite lateral face of the conducting member toward different directions and perpendicular to the first fins, a heat pipe connecting the base and the conducting member to transfer heat from the base to the conducting member.
摘要翻译：用于从电子元件散热的散热器包括：底座，其具有从其向上延伸的多个第一鳍片;导电构件，其与底座热接触;以及多个第二翅片，其从导电构件的两个相对的侧面向不同方向延伸，垂直于第一散热片的热管，连接基座和导电构件以将热量从基座传导到导电构件的热管。

98. 发明授权

US07283368B2 Heat dissipating assembly 失效
标题翻译：散热组件
公开(公告)号：US07283368B2
公开(公告)日：2007-10-16
申请号：US11163516
申请日：2005-10-21
申请人： Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Chun-Chi Chen
发明人： Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Chun-Chi Chen
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating assembly includes a heat sink (10) having a chassis (12), a back plate (30) and a plurality of fasteners (40). Each fastener includes a screw cap (42), a spring (44) and a sleeve (46). The screw cap and the sleeve are movably connected together. The screw cap includes a head (420) and a tube (422) extending from the head. The tube includes a first cavity (424) and a second cavity (426). The back plate forms a plurality of posts (34) passing through the chassis and threadedly engaging in the first cavities of the tubes. A spring (44) is compressed between the first cavity of the tube and a bottom wall of the sleeve, for providing appropriate downwardly pressing force on the chassis of the heat sink against a CPU (22) mounted on a PCB (20).
摘要翻译：散热组件包括具有底盘（12），后板（30）和多个紧固件（40）的散热器（10）。每个紧固件包括螺帽（42），弹簧（44）和套筒（46）。螺帽和套筒可移动地连接在一起。螺旋盖包括头部（420）和从头部延伸的管（422）。管包括第一腔（424）和第二腔（426）。后板形成穿过底盘并且螺纹地接合在管的第一腔中的多个柱（34）。弹簧（44）在管的第一腔和套筒的底壁之间被压缩，用于在安装在PCB（20）上的CPU（22）的散热片的底盘上提供适当的向下按压力。

99. 发明授权

US07277287B2 Heat dissipation device with heat pipes 失效
标题翻译：带热管的散热装置
公开(公告)号：US07277287B2
公开(公告)日：2007-10-02
申请号：US11308383
申请日：2006-03-20
申请人： Chun-Chi Chen , Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Jin-Biao Liu
发明人： Chun-Chi Chen , Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Jin-Biao Liu
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L23/427 , H01L2023/4056 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device comprises a seat for absorbing heat from a heat generating device. At least a heat pipe has a first section thereof thermally combined to the seat, and two second sections thereof extending from the first section and remotely from the seat. Pluralities of heat sinks are located on the seat. Each of the pluralities of heat sinks has a base and a plurality of fins integrally extending from the base and is made of aluminum extrusion. The bases of the heat sinks thermally sandwich the two second sections of the at least a heat pipe therebetween. At least one of the bases of the heat sinks is angled or perpendicular to the seat.
摘要翻译：散热装置包括用于从发热装置吸收热量的座。至少一个热管具有与座椅热结合的第一部分，并且其第二部分从第一部分延伸并远离座椅。多个散热片位于座椅上。多个散热器中的每一个具有基部和从基部一体地延伸并由铝挤压制成的多个翅片。散热器的基部将其中的至少一个热管的两个第二部分热夹心。散热器的至少一个基座成角度或垂直于座椅。

100. 发明申请

US20070114006A1 HEAT-DISSIPATING FIN ASSEMBLY FOR HEAT SINK 审中-公开
标题翻译：散热装置用于散热
公开(公告)号：US20070114006A1
公开(公告)日：2007-05-24
申请号：US11164366
申请日：2005-11-21
申请人： Chun-Chi Chen , Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Jin-Biao Liu
发明人： Chun-Chi Chen , Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Jin-Biao Liu
IPC分类号： H05K7/20
CPC分类号： H01L23/3672 , F28F3/02 , H01L2924/0002 , H01L2924/00
摘要： A heat-dissipating fin assembly (1) includes a plurality of individual fin plates (10) arranged side by side. Each of the fin plates includes a main body (14) and a pair of flanges extending perpendicularly from opposite top and bottom sides of the main body. Each flange comprises a first plane extending from the main body and a second plane extending from the first plane. The second plane comprises a pair of engaging projections extending from two ends thereof. The second plane of a rear fin plate covers the first plane of an adjacent front fin plate. The rear and front fin plates are interlocked by the engaging projections of the rear fin plate bent to respectively engage two ends of the first plane of the front fin plate.
摘要翻译：散热翅片组件（1）包括并排布置的多个单独翅片（10）。每个鳍板包括主体（14）和从主体的相对的上侧和下侧垂直延伸的一对凸缘。每个凸缘包括从主体延伸的第一平面和从第一平面延伸的第二平面。第二平面包括从其两端延伸的一对接合凸起。后翅片板的第二平面覆盖相邻前翅片板的第一平面。后翅片和前翅片由后翅片板的接合突起互锁，后翼板弯曲以分别接合前翅片板的第一平面的两端。

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