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91. 发明申请

US20070209684A1 Copper deposition chamber having integrated bevel clean with edge bevel removal detection 审中-公开
标题翻译：铜沉积室具有整体斜面清洁和边缘斜面去除检测
公开(公告)号：US20070209684A1
公开(公告)日：2007-09-13
申请号：US11369590
申请日：2006-03-07
申请人： Chen-An Chen , Anh Nguyen , Manoocher Birang
发明人： Chen-An Chen , Anh Nguyen , Manoocher Birang
IPC分类号： B08B3/02
CPC分类号： H01L21/6708 , H01L21/67253
摘要： Embodiments of the invention generally provide apparatus and method for detecting and controlling edge bevel removal of a semiconductor substrate. One embodiment of the present invention provides an apparatus for inspecting a rotating substrate. The apparatus comprises a substrate support configured to support the rotating substrate on a back side and rotate the substrate about a central axis, and a sensor positioned above the substrate support, the sensor being configured to inspect a front side of the rotating substrate while moving simultaneously radially across the substrate.
摘要翻译：本发明的实施例通常提供用于检测和控制半导体衬底的边缘斜面去除的装置和方法。本发明的一个实施例提供一种用于检查旋转基片的装置。该装置包括：衬底支撑件，被配置为在后侧支撑旋转衬底并围绕中心轴线旋转衬底;以及位于衬底支撑件上方的传感器，该传感器被配置为在同时移动的同时检查旋转衬底的前侧径向穿过衬底。

92. 发明申请

US20070111519A1 INTEGRATED ELECTROLESS DEPOSITION SYSTEM 审中-公开
标题翻译：集成电沉积系统
公开(公告)号：US20070111519A1
公开(公告)日：2007-05-17
申请号：US11428230
申请日：2006-06-30
申请人： Dmitry Lubomirsky , Arulkumar Shanmugasundram , Allen D'Ambra , Timothy Weidman , Michael Stewart , Eugene Rabinovich , Svetlana Sherman , Manoocher Birang , Yaxin Wang , Michael Yang , Bradley Hansen
发明人： Dmitry Lubomirsky , Arulkumar Shanmugasundram , Allen D'Ambra , Timothy Weidman , Michael Stewart , Eugene Rabinovich , Svetlana Sherman , Manoocher Birang , Yaxin Wang , Michael Yang , Bradley Hansen
IPC分类号： H01L21/44
CPC分类号： H01L21/288 , C23C18/1619 , C23C18/1653 , C23C18/168 , C23C18/1682 , C23C18/1685 , C23C18/1689 , C25D7/123 , C25D17/001 , H01L21/02063 , H01L21/02068 , H01L21/02087 , H01L21/28518 , H01L21/28562 , H01L21/67051 , H01L21/6719 , H01L21/6723 , H01L21/67751 , H01L21/68785 , H01L21/76814 , H01L21/76843 , H01L21/76856 , H01L21/76873 , H01L21/76874
摘要： Embodiments of the invention provide methods for depositing a material onto a surface of a substrate by using one or more electroless, electrochemical plating, CVD and/or ALD processes. Embodiments of the invention provide a method for depositing a seed layer on a substrate with an electroless process and to subsequently fill interconnect features on the substrate with an ECP process on a single substrate processing platform. Other aspects provide a method for depositing a seed layer on a substrate, fill interconnect features on a substrate, or sequentially deposit both a seed layer and fill interconnect features on the substrate. One embodiment provides a method for forming a capping layer over substrate interconnects. Methods include the use of a vapor dryer for pre- and post-deposition cleaning of substrates as well as a brush box chamber for post-deposition cleaning.
摘要翻译：本发明的实施方案提供了通过使用一种或多种化学镀，CVD和/或ALD工艺将材料沉积到衬底的表面上的方法。本发明的实施方案提供了一种用于在基板上沉积种子层的方法，该方法具有无电解方法，并随后在单个基板处理平台上用ECP工艺填充基板上的互连特征。其它方面提供了一种用于在衬底上沉积种子层的方法，在衬底上填充互连特征，或者在衬底上顺序地沉积种子层和填充互连特征。一个实施例提供了一种在衬底互连上形成覆盖层的方法。方法包括使用蒸气干燥器进行基板的沉积前和沉积后清洁以及用于后沉积清洁的刷盒室。

93. 发明授权

US07118457B2 Method of forming a polishing pad for endpoint detection 失效
标题翻译：形成用于端点检测的抛光垫的方法
公开(公告)号：US07118457B2
公开(公告)日：2006-10-10
申请号：US11031440
申请日：2005-01-07
申请人： Boguslaw A. Swedek , Manoocher Birang
发明人： Boguslaw A. Swedek , Manoocher Birang
IPC分类号： B24D11/00 , B24B1/00
CPC分类号： B24B37/26 , B24B37/013 , B24B37/205 , B24B49/02 , B24B49/10 , B24B49/105 , B24B49/12 , B24D11/02 , G01B7/105
摘要： A method of forming a polishing pad with a polishing layer having a polishing surface and a back surface. A plurality of grooves are formed on the polishing surface, and an indentation is formed in the back surface of the polishing layer. A region on the polishing surface corresponding to the indentation in the back surface is free of grooves or has shallower grooves.
摘要翻译：一种用具有研磨面和背面的研磨层形成研磨垫的方法。在研磨面上形成有多个凹槽，在研磨层的背面形成有凹部。与后表面的凹部对应的研磨面上的区域没有凹槽或具有较浅的凹槽。

94. 发明授权

US07118450B2 Polishing pad with window and method of fabricating a window in a polishing pad 有权
标题翻译：具有窗口的抛光垫和在抛光垫中制造窗口的方法
公开(公告)号：US07118450B2
公开(公告)日：2006-10-10
申请号：US11225838
申请日：2005-09-12
申请人： Manoocher Birang , Allan Gleason , William L. Guthrie
发明人： Manoocher Birang , Allan Gleason , William L. Guthrie
IPC分类号： B24B49/00 , B24B51/00
CPC分类号： B24B37/205 , B24B37/013 , B24B47/12 , B24B49/04 , B24B49/12 , B24B51/00 , B24D18/00 , G01B11/06 , G01B11/0683
摘要： The polishing pad for a chemical mechanical polishing apparatus, and a method of making the same. The polishing pad has a covering layer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and a second opening in the backing layer with a second, different cross-sectional area form an aperture through the polishing pad. A substantially transparent polyurethane plug is positioned in the aperture, and an adhesive material fixes the plug in the aperture.
摘要翻译：用于化学机械抛光装置的抛光垫及其制造方法。抛光垫具有与抛光表面相邻的覆盖层和与压板相邻的背衬层。具有第一横截面积的覆盖层中的第一开口和具有第二不同横截面积的背衬层中的第二开口形成穿过抛光垫的孔。基本上透明的聚氨酯塞被定位在孔中，并且粘合剂材料将塞子固定在孔中。

95. 发明授权

US07018275B2 Closed-loop control of wafer polishing in a chemical mechanical polishing system 有权
标题翻译：在化学机械抛光系统中晶圆抛光的闭环控制
公开(公告)号：US07018275B2
公开(公告)日：2006-03-28
申请号：US10886000
申请日：2004-07-06
申请人： Steven Zuniga , Manoocher Birang
发明人： Steven Zuniga , Manoocher Birang
IPC分类号： B24B11/00
CPC分类号： B24B37/013 , B24B49/04 , B24B49/12 , B24B49/16
摘要： Techniques for polishing a wafer (10) include closed-loop control. The wafer can be held by a carrier head (100) having at least one chamber whose pressure is controlled to apply a downward force on the wafer. Thickness-related measurements of the wafer can be obtained during polishing and a thickness profile for the wafer is calculated based on the thickness-related measurements. The calculated thickness profile is compared to a target thickness profile. The pressure in at least one carrier head chamber is adjusted based on results of the comparison. The carrier head chamber pressures can be adjusted to control the amount of downward force applied to the wafer during polishing and/or to control the size of a loading area on the wafer against which the downward force is applied.
摘要翻译：抛光晶片（10）的技术包括闭环控制。晶片可以由具有至少一个室的承载头（100）保持，其压力被控制以在晶片上施加向下的力。在抛光期间可以获得晶片的厚度相关测量，并且基于厚度相关测量计算晶片的厚度分布。将计算出的厚度分布与目标厚度分布进行比较。基于比较的结果调整至少一个载体头部腔室中的压力。可以调节承载头室压力以控制在抛光期间施加到晶片的向下的力的量和/或控制施加向下的力的晶片上的装载区域的尺寸。

96. 发明授权

US07016795B2 Signal improvement in eddy current sensing 有权
标题翻译：涡流检测信号改进
公开(公告)号：US07016795B2
公开(公告)日：2006-03-21
申请号：US10359107
申请日：2003-02-04
申请人： Boguslaw A. Swedek , Manoocher Birang
发明人： Boguslaw A. Swedek , Manoocher Birang
IPC分类号： G06F19/00 , G01B7/06
CPC分类号： B24B37/013 , B24B37/042 , B24B49/105 , G01N27/90 , H01L21/67253
摘要： Improved endpoint detection and/or thickness measurements may be obtained by correcting sensor data using calibration parameters and/or drift compensation parameters. Calibration parameters may include an offset and a slope, or other parameters. Drift compensation parameters may include off-wafer measurements.
摘要翻译：可以通过使用校准参数和/或漂移补偿参数校正传感器数据来获得改进的端点检测和/或厚度测量。校准参数可以包括偏移和斜率，或其他参数。漂移补偿参数可能包括晶圆外测量。

97. 发明授权

US07008875B2 Methods and apparatus for polishing control 有权
标题翻译：抛光控制方法和装置
公开(公告)号：US07008875B2
公开(公告)日：2006-03-07
申请号：US10721769
申请日：2003-11-24
申请人： Manoocher Birang , Konstantin Y. Smekalin , David A. Chan
发明人： Manoocher Birang , Konstantin Y. Smekalin , David A. Chan
IPC分类号： H01L21/302 , H01L21/461
CPC分类号： B24B37/013 , B24B37/042 , B24B49/003 , B24B49/12
摘要： A CMP station can be closed loop controlled by using data obtained by an inline metrology station from a first polished wafer to affect the processing of subsequent polished wafers. The first wafer is polished and measured by the inline metrology station. The metrology station measures at various points the array dielectric thickness, field dielectric thickness, barrier residue thickness and metal residue thickness. The data is then inputted into an algorithm and polishing parameter outputs are calculated. The outputs are sent to the CMP station and used to supplement or replace the previous polishing parameters. Subsequent wafers are polished on the CMP station using the revised polishing parameters.
摘要翻译： CMP站可以通过使用由第一抛光晶片的在线计量站获得的数据来闭环控制，以影响后续抛光晶片的处理。第一个晶片经过内联计量站的抛光和测量。测量站在各点测量阵列电介质厚度，场介电厚度，阻挡残留厚度和金属残留厚度。然后将数据输入算法，并计算抛光参数输出。输出被发送到CMP站，用于补充或替换以前的抛光参数。随后的晶片在CMP站上使用修改的抛光参数进行研磨。

98. 发明授权

US07008296B2 Data processing for monitoring chemical mechanical polishing 有权
公开(公告)号：US07008296B2
公开(公告)日：2006-03-07
申请号：US10464673
申请日：2003-06-18
申请人： Boguslaw A. Swedek , Nils Johansson , Manoocher Birang
发明人： Boguslaw A. Swedek , Nils Johansson , Manoocher Birang
IPC分类号： B24B49/00
CPC分类号： B24B37/013 , B24B49/10
摘要： Methods and apparatus to implement techniques for monitoring polishing a substrate. Two or more data points are acquired, where each data point has a value affected by features inside a sensing region of a sensor and corresponds to a relative position of the substrate and the sensor as the sensing region traverses through the substrate. A set of reference points is used to modify the acquired data points. The modification compensates for distortions in the acquired data points caused by the sensing region traversing through the substrate. Based on the modified data points, a local property of the substrate is evaluated to monitor polishing.

99. 发明授权

US07001242B2 Method and apparatus of eddy current monitoring for chemical mechanical polishing 有权
公开(公告)号：US07001242B2
公开(公告)日：2006-02-21
申请号：US10124507
申请日：2002-04-16
申请人： Manoocher Birang , Boguslaw A. Swedek , Hyeong Cheol Kim
发明人： Manoocher Birang , Boguslaw A. Swedek , Hyeong Cheol Kim
IPC分类号： B24B1/00
CPC分类号： B24B49/10 , B24B37/013 , B24B37/205 , B24B49/105 , B24B49/12
摘要： A polishing system can have a rotatable platen, a polishing pad secured to the platen, a carrier head to hold a substrate against the polishing pad, and an eddy current monitoring system including a coil or ferromagnetic body that extends at least partially through the polishing pad. A polishing pad can have a polishing layer and a coil or ferromagnetic body secured to the polishing layer. Recesses can be formed in a transparent window in the polishing pad.

100. 发明申请

US20060033678A1 Integrated electroless deposition system 审中-公开
标题翻译：集成无电沉积系统
公开(公告)号：US20060033678A1
公开(公告)日：2006-02-16
申请号：US11192993
申请日：2005-07-29
申请人： Dmitry Lubomirsky , Arulkumar Shanmugasundram , Allen D'Ambra , Timothy Weidman , Eugene Rabinovich , Svetlana Sherman , Manoocher Birang , Yaxin Wang , Michael Yang , Bradley Hansen
发明人： Dmitry Lubomirsky , Arulkumar Shanmugasundram , Allen D'Ambra , Timothy Weidman , Eugene Rabinovich , Svetlana Sherman , Manoocher Birang , Yaxin Wang , Michael Yang , Bradley Hansen
IPC分类号： G09G3/00 , H05H1/24 , C23C16/00
CPC分类号： H01L21/67167 , C23C16/06 , C23C16/34 , C23C16/4488 , C23C18/1632 , C23C18/1653 , H01L21/28556 , H01L21/288 , H01L21/6719 , H01L21/67207 , H01L21/6723 , H01L21/67742 , H01L21/67745 , H01L21/76843 , H01L21/76873 , H01L21/76877
摘要： Embodiments of the invention provide a cluster tool configured to deposit a material onto a substrate surface by using one or more electroless, electrochemical plating, CVD and/or ALD processing chambers. In one aspect, a ruthenium-containing catalytic layer is formed. Embodiments of the invention provide a hybrid deposition system configured to deposit a seed layer on a substrate with an electroless process and to subsequently fill interconnect features on the substrate with an ECP cell. Other aspects provide an electroless deposition system configured to deposit a seed layer on a substrate, fill interconnect features on a substrate, or sequentially deposit both a seed layer and fill interconnect features on the substrate. One embodiment provides an electroless deposition system configured to form a capping layer over substrate interconnects. The system includes a vapor dryer for pre- and post-deposition cleaning of substrates as well as a brush box chamber for post-deposition cleaning.
摘要翻译：本发明的实施例提供了一种集群工具，其被配置为通过使用一个或多个化学镀，CVD和/或ALD处理室将材料沉积到衬底表面上。一方面，形成含钌催化剂层。本发明的实施例提供了一种混合沉积系统，其被配置为利用无电解方法将种子层沉积在衬底上，并随后用ECP单元填充衬底上的互连特征。其它方面提供一种无电镀沉积系统，其被配置为将衬底层沉积在衬底上，填充衬底上的互连特征，或者顺序地沉积衬底上的晶种层和填充互连特征。一个实施例提供了一种配置成在衬底互连上形成覆盖层的无电沉积系统。该系统包括蒸发干燥器，用于底物的沉积前和沉积后清洁以及用于后沉积清洁的刷盒室。

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