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    • 93. 发明授权
    • Method and arrangement for preconditioning in a destructive read memory
    • 在破坏性读取存储器中预处理的方法和装置
    • US06445611B1
    • 2002-09-03
    • US09966142
    • 2001-09-28
    • John A. FifieldChorng-Lii HwangDaniel W. Storaska
    • John A. FifieldChorng-Lii HwangDaniel W. Storaska
    • G11C1124
    • G11C8/08G11C11/4076G11C11/408G11C2207/104
    • An arrangement and method is disclosed which works toward shortening the machine cycle of a DRAM. A data value is written to a storage capacitor of a memory cell of the DRAM, the data value being stored in the storage capacitor as one of low state and high state. During a first wordline activation cycle, a storage capacitor is preconditioned to a preconditioned voltage level. In a subsequent wordline activation cycle, a low state or a high state is written to the storage capacitor. In an aspect of the invention, the wordline is activated in a first wordline activation cycle to begin clearing any previously stored state of the storage capacitor. This cycle may include the reading of a stored data value from the storage capacitor. Then, immediately thereafter, while maintaining the wordline activated, the storage capacitor is preconditioned to a preconditioned voltage level, as by clamping the bitline through a bitline restore device. The wordline is then deactivated. Subsequently, the wordline is activated again during a write cycle to write one of a low state and a high state to the storage capacitor to indicate a stored data value.
    • 公开了用于缩短DRAM的机器周期的布置和方法。 将数据值写入到DRAM的存储单元的存储电容器中,将数据值存储在存储电容器中作为低状态和高状态之一。 在第一字线激活周期期间,存储电容器被预处理成预处理的电压电平。 在随后的字线激活周期中,将低状态或高状态写入存储电容器。在本发明的一个方面,字线在第一字线激活周期中被激活,以开始清除存储电容器的任何先前存储的状态。 该周期可以包括从存储电容器读取存储的数据值。 然后,紧接其后,在保持字线被激活的同时,将存储电容器预先处理为预处理的电压电平,如通过位线恢复装置夹紧位线。 然后禁用字线。 随后,在写入周期期间再次激活字线以将低状态和高状态中的一个写入存储电容器以指示存储的数据值。
    • 94. 发明授权
    • Impedance control using fuses
    • 使用熔断器进行阻抗控制
    • US06243283B1
    • 2001-06-05
    • US09589922
    • 2000-06-07
    • Claude Louis BertinJohn A. FifieldErik Leigh HedbergRussell J. HoughtonTimothy Dooling SullivanSteven William TomashotWilliam Robert Tonti
    • Claude Louis BertinJohn A. FifieldErik Leigh HedbergRussell J. HoughtonTimothy Dooling SullivanSteven William TomashotWilliam Robert Tonti
    • G11C506
    • H01L23/481G11C17/16H01L25/0657H01L2224/06181H01L2224/13025H01L2224/16H01L2224/16145H01L2224/16225H01L2224/17181H01L2224/48227H01L2224/4826H01L2225/06517H01L2225/06541H01L2225/06555H01L2225/06562H01L2225/06589H01L2225/06596H01L2924/01012H01L2924/01019H01L2924/01046H01L2924/10253H01L2924/13091H01L2924/15192H01L2924/181H01L2924/3011H01L2924/00H01L2924/00012
    • A system and method for reducing impedance loading of semiconductor integrated circuit devices implementing protective device structures that contributes to impedance loading at an I/O pad connection. The method comprises providing a fuse device between the I/O pad connection and the protective device; connecting a current source device associated with each fuse device in the integrated circuit, the current source device connected to one end of the fuse device; providing fuse selection circuit for activating current flow through a selected fuse device between the current source and the I/O connection, the current flow being of an amount sufficient for blowing the fuse and disconnecting the protective device from the circuit structure, thereby reducing impedance loading at the I/O connection. Such a system and method is employed in a memory system comprising integrated circuit chips disposed in a stacked relation, with each chip including: a layer of active circuitry formed at a first layer of each chip; a plurality of through conducting structures disposed substantially vertically through each chip for enabling electronic connection with active circuitry at the first layer; second conducting device disposed at an end of the through conducting structure at an opposite side of a chip for connection with a corresponding through conductive structure of an adjacent stacked chip, the stacked chip structure formed by aligning one or more through conducting structures and second conducting devices of adjacent chips, whereby a chip of the stack is electronically connected to active circuitry formed on other chips of the stack. The stacked chip structure is ideal for reducing data access latency in memory systems employing memory chips such as DRAM.
    • 一种用于减少半导体集成电路器件的阻抗负载的系统和方法,其实现了有助于I / O焊盘连接处的阻抗加载的保护器件结构。 该方法包括在I / O焊盘连接和保护装置之间设置熔丝装置; 连接与所述集成电路中的每个熔丝装置相关联的电流源装置,所述电流源装置连接到所述熔丝装置的一端; 提供保险丝选择电路,用于在电流源和I / O连接之间激活通过选定的保险丝装置的电流流动,电流量足以吹入保险丝并将保护装置与电路结构断开,从而减少阻抗负载 在I / O连接。 这种系统和方法被用在包括以堆叠关系布置的集成电路芯片的存储器系统中,每个芯片包括:形成在每个芯片的第一层的有源电路层; 多个通过导电结构,其基本垂直设置穿过每个芯片,以使得能够与第一层处的有源电路电连接; 第二导电装置,其设置在通孔导电结构的与芯片相对侧的端部处,与相邻的堆叠芯片的相应的贯穿导电结构相连接,所述堆叠的芯片结构通过将一个或多个穿过导电结构和第二导电装置 的相邻芯片,由此堆叠的芯片电连接到形成在堆叠的其他芯片上的有源电路。 堆叠式芯片结构非常适用于采用诸如DRAM之类的存储器芯片的存储器系统中的数据访问延迟。
    • 95. 发明授权
    • Impedance control using fuses
    • 使用熔断器进行阻抗控制
    • US6141245A
    • 2000-10-31
    • US302902
    • 1999-04-30
    • Claude Louis BertinJohn A. FifieldErik Leigh HedbergRussell J. HoughtonTimothy Dooling SullivanSteven William TomashotWilliam Robert Tonti
    • Claude Louis BertinJohn A. FifieldErik Leigh HedbergRussell J. HoughtonTimothy Dooling SullivanSteven William TomashotWilliam Robert Tonti
    • H01L27/02G11C17/16H01L25/065G11C16/04
    • H01L23/481G11C17/16H01L25/0657H01L2224/06181H01L2224/13025H01L2224/16H01L2224/16145H01L2224/16225H01L2224/17181H01L2224/48227H01L2224/4826H01L2225/06517H01L2225/06541H01L2225/06555H01L2225/06562H01L2225/06589H01L2225/06596H01L2924/01012H01L2924/01019H01L2924/01046H01L2924/10253H01L2924/13091H01L2924/15192H01L2924/181H01L2924/3011
    • A system and method for reducing impedance loading of semiconductor integrated circuit devices implementing protective device structures that contributes to impedance loading at an I/O pad connection. The method comprises providing a fuse device between the I/O pad connection and the protective device; connecting a current source device associated with each fuse device in the integrated circuit, the current source device connected to one end of the fuse device; providing fuse selection circuit for activating current flow through a selected fuse device between the current source and the I/O connection, the current flow being of an amount sufficient for blowing the fuse and disconnecting the protective device from the circuit structure, thereby reducing impedance loading at the I/O connection. Such a system and method is employed in a memory system comprising integrated circuit chips disposed in a stacked relation, with each chip including: a layer of active circuitry formed at a first layer of each chip; a plurality of through conducting structures disposed substantially vertically through each chip for enabling electronic connection with active circuitry at the first layer; second conducting device disposed at an end of the through conducting structure at an opposite side of a chip for connection with a corresponding through conductive structure of an adjacent stacked chip, the stacked chip structure formed by aligning one or more through conducting structures and second conducting devices of adjacent chips, whereby a chip of the stack is electronically connected to active circuitry formed on other chips of the stack. The stacked chip structure is ideal for reducing data access latency in memory systems employing memory chips such as DRAM.
    • 一种用于减少半导体集成电路器件的阻抗负载的系统和方法,其实现了有助于I / O焊盘连接处的阻抗加载的保护器件结构。 该方法包括在I / O焊盘连接和保护装置之间设置熔丝装置; 连接与所述集成电路中的每个熔丝装置相关联的电流源装置,所述电流源装置连接到所述熔丝装置的一端; 提供保险丝选择电路,用于在电流源和I / O连接之间激活通过选定的保险丝装置的电流流动,电流量足以吹入保险丝并将保护装置与电路结构断开,从而减少阻抗负载 在I / O连接。 这种系统和方法被用在包括以堆叠关系布置的集成电路芯片的存储器系统中,每个芯片包括:形成在每个芯片的第一层的有源电路层; 多个通过导电结构,其基本垂直设置穿过每个芯片,以使得能够与第一层处的有源电路电连接; 第二导电装置,其设置在通孔导电结构的与芯片相对侧的端部处,与相邻的堆叠芯片的相应的贯穿导电结构相连接,所述堆叠的芯片结构通过将一个或多个穿过导电结构和第二导电装置 的相邻芯片,由此堆叠的芯片电连接到形成在堆叠的其他芯片上的有源电路。 堆叠式芯片结构非常适用于采用诸如DRAM之类的存储器芯片的存储器系统中的数据访问延迟。
    • 96. 发明授权
    • Memory system reset circuit
    • 存储器系统复位电路
    • US5604755A
    • 1997-02-18
    • US565627
    • 1995-11-20
    • Claude L. BertinCharles E. DrakeJohn A. FifieldErik Hedberg
    • Claude L. BertinCharles E. DrakeJohn A. FifieldErik Hedberg
    • G06F11/00G06F11/07G06F11/10G11C5/00
    • G06F11/1024G06F11/073G06F11/0793G11C5/005G06F11/0796
    • A reset circuit for resetting a memory system following a radiation event includes an error detect circuit for producing an error signal in response to detection of an uncorrectable error in the systems memory arrays, and includes a control circuit for selectively resetting at least select portions of the memory system in response to the error detect signal. All or portions of the memory arrays can be reset by the control circuit, and complete or selective latch reset, or selective power recycling are provided. In one embodiment, the control circuit provides latch reset in response to the error detect signal so as to reset the memory latches without recycling power, and in another embodiment, the control circuit selectively cycles power to independent memory zones of the system to reset only those zones whose memory array is identified as having an uncorrectable error. Preferably, the control circuit, and perhaps the detect circuit, are radiation hardened to further ensure dependable operation of the reset circuit following a radiation event.
    • 用于在辐射事件之后复位存储器系统的复位电路包括:误差检测电路,用于响应于系统存储器阵列中的不可校正误差的检测而产生误差信号,并且包括控制电路,用于至少选择性地复位 存储器系统响应于错误检测信号。 存储器阵列的全部或部分可由控制电路复位,并提供完整的或选择性的锁存复位或选择性的电力回收。 在一个实施例中,控制电路响应于错误检测信号提供锁存器复位,以便在不再循环功率的情况下复位存储器锁存器,并且在另一实施例中,控制电路选择性地将电力循环到系统的独立存储器区域,以仅复位那些 存储器阵列被识别为具有不可校正错误的区域。 优选地,控制电路以及可能的检测电路被辐射硬化,以进一步确保在辐射事件之后复位电路的可靠操作。
    • 98. 发明申请
    • MULTI-BANK RANDOM ACCESS MEMORY STRUCTURE WITH GLOBAL AND LOCAL SIGNAL BUFFERING FOR IMPROVED PERFORMANCE
    • 具有全球和本地信号缓存的多银行随机存取存储器结构,用于改进性能
    • US20130315022A1
    • 2013-11-28
    • US13479448
    • 2012-05-24
    • Darren L. AnandJohn A. FifieldMark D. JacunskiMatthew C. Lanahan
    • Darren L. AnandJohn A. FifieldMark D. JacunskiMatthew C. Lanahan
    • G11C8/00
    • G11C11/4097G11C5/025G11C7/10G11C7/1048G11C7/18G11C8/12
    • Disclosed are embodiments of a multi-bank random access memory (RAM) structure that provides signal buffering at both the global and local connector level for improved performance. Specifically, inverters are incorporated into the global connector(s), which traverse groups of memory banks and which transmit signals (e.g., address signals, control signals, and/or data signals) from a memory controller, and also into alternating groups of local connectors, which connect nodes on the global connector(s) to corresponding groups of memory banks, such that any of the signals that are received by the memory banks from the memory controller via the global and local connectors are buffered by an even number of inverters and are thereby true signals. Signal buffering at both the global and local connector level results in relatively fast slews, short propagation delays, and low peak power consumption with minimal, if any, increase in area consumption.
    • 公开了多库随机存取存储器(RAM)结构的实施例,其在全局和本地连接器级提供信号缓冲以提高性能。 具体来说,逆变器被并入到全局连接器中,该连接器遍历存储体组并且从存储器控制器传送信号(例如,地址信号,控制信号和/或数据信号),并且还转换成局部的交替组 连接器,其将全局连接器上的节点连接到对应的存储体组,使得由存储器控制器经由全局和本地连接器的存储器组接收的任何信号由偶数个反相器缓冲 并且因此是真实的信号。 在全局和本地连接器级别的信号缓冲都会导致相对较快的转换速度,较短的传播延迟和低峰值功耗,同时面积消耗量的增加也会降低。