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91. 发明申请

US20050132548A1 Method for manufacturing multilayer ceramic capacitor 失效
标题翻译：多层陶瓷电容器制造方法
公开(公告)号：US20050132548A1
公开(公告)日：2005-06-23
申请号：US11002183
申请日：2004-12-03
申请人： Ho Choo , Seung Ra , Yong Kim , Jung Lee , Hyo Shin , Hyoung Kim
发明人： Ho Choo , Seung Ra , Yong Kim , Jung Lee , Hyo Shin , Hyoung Kim
IPC分类号： H01G4/005 , H01G4/12 , H01G4/232 , H01G4/30 , H01G9/00 , H01G4/06
CPC分类号： H01G4/005 , H01G4/12 , H01G4/30 , Y10T29/417
摘要： A method for manufacturing a multilayer ceramic capacitor, in which internal electrodes printed on each of a plurality of dielectric sheets have reduced thicknesses using an absorption member, thereby allowing the multilayer ceramic capacitor to have a high capacity and be minimized. The method includes printing the internal electrodes on each of the dielectric sheets, and stacking the dielectric sheets, wherein the internal electrodes formed on each of the dielectric sheets have a reduced thickness by causing an absorptive member to contact the surface of each of the dielectric sheets provided with the internal electrodes and then separating the absorptive member from the surface so that portions of the internal electrodes having a designated thickness are eliminated, and the dielectric sheets provided with the internal electrodes having the reduced thickness are stacked to form a chip element.
摘要翻译：一种制造多层陶瓷电容器的方法，其中印刷在多个电介质片材的每一个上的内部电极使用吸收构件具有减小的厚度，从而允许多层陶瓷电容器具有高容量并且被最小化。该方法包括在每个电介质片上印刷内部电极，并叠放电介质片，其中形成在每个电介质片上的内部电极通过使吸收构件接触每个电介质片的表面而具有减小的厚度设置有内部电极，然后将吸收构件从表面分离，使得部分具有指定厚度的内部电极被去除，并且设置有具有减小的厚度的内部电极的电介质层被堆叠以形成芯片元件。

92. 发明申请

US20050118443A1 Silicone release polyester film 审中-公开
标题翻译：硅胶脱模聚酯薄膜
公开(公告)号：US20050118443A1
公开(公告)日：2005-06-02
申请号：US10844338
申请日：2004-05-13
申请人： Jung Lee , Moon Lee , Hae Jun , Sang Kim
发明人： Jung Lee , Moon Lee , Hae Jun , Sang Kim
IPC分类号： B32B27/36 , C08J7/04 , C09J7/02
CPC分类号： B32B27/36 , B32B2307/538 , B32B2367/00 , C08J7/047 , C08J2367/02 , C09J7/40 , C09J2467/006 , C09J2483/005 , Y10T428/265 , Y10T428/31663 , Y10T428/31786
摘要： The invention illustrates herein several tests among various manufacturing methods and tests carried out by the inventors according to the method of manufacturing a silicone release polyester film. It should be noted that the technical spirit of the invention shall not be limited or restricted thereby, and can be modified and carried out variously by those skilled in the art. As described in the above, the silicone release polyester film according to the invention is very good in stabilization for pass-the-time and also very good in the property of rub-off after thermal ripening by improving adhesiveness between the polyester layer and the silicone layer by olgano resin having the vinyl radical in the silicone film layer. By improving easiness of release destruction behavior with the adhesive used for release by containing the olgano resin having the vinyl radical in hexenyl polysiloxane, the silicone release polyester film can be used for electronics and the field requiring uniform release. The silicone release polyester film according to the invention can solve the problems of weakened adhesiveness on an adhesive layer combined with the silicone layer resulting from silicone transfer in a process and of bad printing on the surface opposite to the adhesive layer, by allowing the property of minimized silicone transfer in which the content of silicone residue is below 10% by means of excellent silicone hardening.
摘要翻译：本发明说明了本发明人根据制造有机硅剥离聚酯膜的方法进行的各种制造方法和试验中的若干试验。应当注意，本发明的技术精神不受其限制或限制，并且可以由本领域技术人员进行各种修改和执行。如上所述，根据本发明的有机硅剥离聚酯膜在通过时稳定性非常好，并且通过改善聚酯层和硅氧烷之间的粘附性，热成熟后的擦去性能也非常好在硅酮薄膜层中具有乙烯基的奥尔诺树脂层。通过使用通过含有在己烯基聚硅氧烷中具有乙烯基的橄榄树脂来释放的粘合剂来改善剥离破坏行为的容易性，硅氧烷剥离聚酯膜可用于需要均匀释放的电子学和场地。根据本发明的硅氧烷剥离聚酯薄膜可以解决在与工艺中的硅酮转移和由与粘合剂层相反的表面上的不良印刷导致的与硅氧烷层结合的粘合剂层上的粘合性弱的问题，通过优异的硅酮硬化使硅氧烷残余物含量低于10％的硅氧烷转移最小化。

93. 发明申请

US20050110914A1 Portable TV-navigation system 审中-公开
标题翻译：便携式电视导航系统
公开(公告)号：US20050110914A1
公开(公告)日：2005-05-26
申请号：US10747444
申请日：2003-12-30
申请人： Jung Lee
发明人： Jung Lee
IPC分类号： G08G1/0962 , G01C21/36 , G01S1/00 , H04N5/64
CPC分类号： G01C21/36 , G01S19/13 , G01S19/35 , H04N5/64
摘要： A portable TV-navigation system includes a liquid crystal display panel, a TV board, a navigation board and a case panel. The TV board is mounted on a rear surface of the liquid crystal display panel to receive a TV signal and control an image outputted from the liquid crystal display panel. The navigation board is mounted on a rear surface of the TV board to receive a GPS signal and output an image signal relating to a vehicle position to the liquid crystal display panel. The case panel is mounted on a rear surface of the navigation board. This system allows a TV and a navigation system to be integrated into a single unit, while enabling the navigation system to be put on and taken off in the same fashion as an in-vehicle TV. Particularly, since the navigation system uses a CF memory chip, the navigation operating rate is increased and the system volume is reduced.
摘要翻译：便携式电视导航系统包括液晶显示面板，TV板，导航板和壳体面板。 TV板安装在液晶显示面板的后表面，以接收TV信号并控制从液晶显示面板输出的图像。导航板安装在TV板的后表面上，以接收GPS信号，并将与车辆位置有关的图像信号输出到液晶显示面板。外壳面板安装在导航板的后表面。该系统允许将电视和导航系统集成到单个单元中，同时使导航系统能够以与车载电视机相同的方式被放下。具体地说，由于导航系统使用CF存储器芯片，所以导航运行速度增加，系统容积减小。

94. 发明申请

US20050055704A1 Device of DISC-rejection pin 审中-公开
标题翻译： DISC拒绝引脚的设备
公开(公告)号：US20050055704A1
公开(公告)日：2005-03-10
申请号：US10930744
申请日：2004-09-01
申请人： Jung Lee
发明人： Jung Lee
IPC分类号： G11B33/02
CPC分类号： G11B33/022
摘要： A device of DISC-rejection-pin placed on the DISC drive, includes a holding device and a pin, wherein the holding device is comprised of two sets of extrusion, and each set of extrusion has two (upper and lower) circular extruding portions, the space between which is smaller than the diameter of the pin, and an appropriate distance between the two sets of extruding portion is smaller than the length of the pin, and the pin is held by the two sets of extruding portion.
摘要翻译：放置在DISC驱动器上的DISC排斥针的装置包括保持装置和销，其中保持装置由两组挤出组成，每组挤出具有两个（上下）圆形挤出部分，其间距小于销的直径，并且两组挤出部之间的适当距离小于销的长度，并且销由两组挤出部保持。

95. 发明申请

US20050047530A1 Method and arrangement for detecting a random access channel preamble using multiple antenna reception in a communication system 有权
标题翻译：用于在通信系统中使用多个天线接收来检测随机接入信道前同步码的方法和装置
公开(公告)号：US20050047530A1
公开(公告)日：2005-03-03
申请号：US10651200
申请日：2003-08-29
申请人： Jung Lee , Anil Rao
发明人： Jung Lee , Anil Rao
IPC分类号： H04B7/005 , H04B7/08 , H04L1/06 , H04L1/02
CPC分类号： H04B7/086 , H04L1/0618 , H04W52/50
摘要： In a method and arrangement for detecting a random access channel preamble in a received uplink signal, the uplink signal is received at one or more receive antennas and contains data related to a random access channel preamble. The received uplink signal is subjected to spatial processing and temporal processing in order to detect the random access channel preamble. A best cell portion for communicating with a user may also be determined based on the detected preamble. The best cell portion represents a portion of a cell where a received uplink signal from a user has a highest signal to interference ratio. The detected random access channel preamble is indicative of the best cell portion for communicating with the user.
摘要翻译：在用于检测接收到的上行链路信号中的随机接入信道前同步码的方法和装置中，在一个或多个接收天线处接收上行链路信号，并且包含与随机接入信道前导码有关的数据。接收到的上行链路信号经受空间处理和时间处理，以便检测随机接入信道前同步码。还可以基于检测到的前导码来确定用于与用户通信的最佳小区部分。最好的小区部分表示从用户接收的上行链路信号具有最高的信号与干扰比的小区的一部分。检测到的随机接入信道前导码指示用于与用户通信的最佳小区部分。

96. 发明申请

US20120098109A1 CHIP PACKAGE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：芯片包装及其制造方法
公开(公告)号：US20120098109A1
公开(公告)日：2012-04-26
申请号：US13315039
申请日：2011-12-08
申请人： Dongkyun Ko , Jung Lee , Jaesun An
发明人： Dongkyun Ko , Jung Lee , Jaesun An
IPC分类号： H01L23/552 , H01L21/56
CPC分类号： H01L21/78 , H01L21/561 , H01L23/3121 , H01L23/552 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15313 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0032 , H05K3/0052 , H05K3/284 , H05K2203/0415 , H01L2224/81 , H01L2924/00 , H01L2224/0401
摘要： A chip package including a shielding layer having a plurality of conductive connectors for better electromagnetic interferences shielding is provided. The conductive connectors can be flexibly arranged within the molding compound for better shielding performance. The shielding layer having the conductive connectors functions as the EMI shield and the shielding layer is electrically grounded within the package structure.
摘要翻译：提供一种芯片封装，其包括具有多个用于更好的电磁干扰屏蔽的导电连接器的屏蔽层。导电连接器可以灵活地布置在模塑料中，以更好的屏蔽性能。具有导电连接器的屏蔽层用作EMI屏蔽，屏蔽层在封装结构内电接地。

97. 发明授权

US07975164B2 DDR memory controller 有权
标题翻译： DDR内存控制器
公开(公告)号：US07975164B2
公开(公告)日：2011-07-05
申请号：US12157081
申请日：2008-06-06
申请人： Jung Lee , Mahesh Gopalan
发明人： Jung Lee , Mahesh Gopalan
IPC分类号： G06F1/04 , G06F1/12 , G06F12/00 , H03K19/173 , H03K19/00 , G11C7/00 , G11C8/00 , G11C29/00 , G01R35/00 , G01R31/00 , G01R31/28 , G01B5/02
CPC分类号： G06F13/4243 , G06F13/1689 , G11C29/02 , G11C29/028 , G11C29/50 , G11C29/50012
摘要： A DDR memory controller is described wherein a core domain capture clock is created by programmably delaying the core clock of the memory controller. The delay of this capture clock is calibrated during a power on the initialization sequence in concert with a DDR memory in a system environment, thereby minimizing the effects of system delays and increasing both device and system yield. An additional embodiment also includes programmably delaying the incoming dqs signal.
摘要翻译：描述了DDR存储器控制器，其中通过可编程地延迟存储器控制器的核心时钟来创建核心域捕获时钟。在系统环境中与DDR存储器一致地在初始化序列上电期间校准该捕获时钟的延迟，从而最小化系统延迟的影响并增加设备和系统产量。另外的实施例还包括可编程地延迟输入的dq信号。

98. 发明申请

US20100110656A1 CHIP PACKAGE AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：芯片包装及其制造方法
公开(公告)号：US20100110656A1
公开(公告)日：2010-05-06
申请号：US12388771
申请日：2009-02-19
申请人： Dongkyun Ko , Jung Lee , Jaesun An
发明人： Dongkyun Ko , Jung Lee , Jaesun An
IPC分类号： H05K9/00 , B29D31/00
CPC分类号： H01L21/78 , H01L21/561 , H01L23/3121 , H01L23/552 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15313 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0032 , H05K3/0052 , H05K3/284 , H05K2203/0415 , H01L2224/81 , H01L2924/00 , H01L2224/0401
摘要： A chip package including a plurality of conductive bodies and a shielding layer for better electromagnetic interferences shielding is provided. The shielding layer over the molding compound contacts with the conductive bodies disposed on the substrate, and the shielding layer and the conductive bodies function as EMI shield. The shielding layer is electrically grounded through the conductive bodies connected to the laminate substrate and the ground plane of the substrate.
摘要翻译：提供了包括多个导电体和用于更好的电磁干扰屏蔽的屏蔽层的芯片封装。模制化合物上的屏蔽层与设置在基板上的导电体接触，并且屏蔽层和导电体用作EMI屏蔽。屏蔽层通过连接到层叠基板的导电体和基板的接地平面进行电接地。

99. 发明申请

US20100109132A1 CHIP PACKAGE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：芯片包装及其制造方法
公开(公告)号：US20100109132A1
公开(公告)日：2010-05-06
申请号：US12414996
申请日：2009-03-31
申请人： Dongkyun Ko , Jung Lee , Jaesun An
发明人： Dongkyun Ko , Jung Lee , Jaesun An
IPC分类号： H01L23/552 , H01L21/78
CPC分类号： H01L21/78 , H01L21/561 , H01L23/3121 , H01L23/552 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15313 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0032 , H05K3/0052 , H05K3/284 , H05K2203/0415 , H01L2224/81 , H01L2924/00 , H01L2224/0401
摘要： A chip package including a shielding layer having a plurality of conductive connectors for better electromagnetic interferences shielding is provided. The conductive connectors can be flexibly arranged within the molding compound for better shielding performance. The shielding layer having the conductive connectors functions as the EMI shield and the shielding layer is electrically grounded within the package structure.
摘要翻译：提供一种芯片封装，其包括具有多个用于更好的电磁干扰屏蔽的导电连接器的屏蔽层。导电连接器可以灵活地布置在模塑料中，以更好的屏蔽性能。具有导电连接器的屏蔽层用作EMI屏蔽，屏蔽层在封装结构内电接地。

100. 发明申请

US20090307521A1 DDR memory controller 有权
标题翻译： DDR内存控制器
公开(公告)号：US20090307521A1
公开(公告)日：2009-12-10
申请号：US12157081
申请日：2008-06-06
申请人： Jung Lee , Mahesh Gopalan
发明人： Jung Lee , Mahesh Gopalan
IPC分类号： G06F1/04 , G06F12/00
CPC分类号： G06F13/4243 , G06F13/1689 , G11C29/02 , G11C29/028 , G11C29/50 , G11C29/50012
摘要： A DDR memory controller is described wherein a core domain capture clock is created by programmably delaying the core clock of the memory controller. The delay of this capture clock is calibrated during a power on the initialization sequence in concert with a DDR memory in a system environment, thereby minimizing the effects of system delays and increasing both device and system yield. An additional embodiment also includes programmably delaying the incoming dqs signal.
摘要翻译：描述了DDR存储器控制器，其中通过可编程地延迟存储器控制器的核心时钟来创建核心域捕获时钟。在系统环境中与DDR存储器一致地在初始化序列上电期间校准该捕获时钟的延迟，从而最小化系统延迟的影响并增加设备和系统产量。另外的实施例还包括可编程地延迟输入的dq信号。

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