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    • 92. 发明申请
    • METHOD AND SYSTEM FOR PROVIDING PROCESS TOOL CORRECTABLES
    • 提供过程工具修正的方法和系统
    • US20120029856A1
    • 2012-02-02
    • US13185033
    • 2011-07-18
    • Guy CohenDana KleinPavel Izikson
    • Guy CohenDana KleinPavel Izikson
    • G06F19/00
    • G05B19/41875G05B2219/32182Y02P90/22
    • The present invention may include performing a first measurement process on a wafer of a lot of wafers, wherein the first measurement process includes measuring one or more characteristics of a plurality of targets distributed across one or more fields of the wafer, determining a set of process tool correctables for a residual larger than a selected threshold level utilizing a loss function, wherein the loss function is configured to fit a model for one or more process tools, as a function of field position, to one or more of the measured characteristics of the plurality of targets, wherein the set of process tool correctables includes one or more parameters of the model that act to minimize the difference between a norm of the residual and the selected threshold, and utilizing the determined process tool correctables to monitor or adjust one or more processes of the process tools.
    • 本发明可以包括对许多晶片的晶片执行第一测量过程,其中第一测量过程包括测量分布在晶片的一个或多个场上的多个目标的一个或多个特性,确定一组过程 用于利用损失函数对大于所选阈值的残差的工具进行校正,其中所述损失函数被配置为将作为场位置的函数的一个或多个处理工具的模型拟合到一个或多个所测量的特征 多个目标,其中所述一组处理工具可校正包括模型的一个或多个参数,其用于最小化残差范数与所选择的阈值之间的差异,并且利用所确定的处理工具可校正来监视或调整一个或多个 流程工具的流程。
    • 94. 发明申请
    • p-FET with a Strained Nanowire Channel and Embedded SiGe Source and Drain Stressors
    • 具有应变纳米线通道和嵌入式SiGe源极和漏极应力的p-FET
    • US20110233522A1
    • 2011-09-29
    • US12731241
    • 2010-03-25
    • Guy CohenConal E. MurrayMichael J. Rooks
    • Guy CohenConal E. MurrayMichael J. Rooks
    • H01L29/267H01L21/84
    • H01L29/78696H01L29/0673H01L29/42392H01L29/7848H01L29/785
    • Techniques for embedding silicon germanium (e-SiGe) source and drain stressors in nanoscale channel-based field effect transistors (FETs) are provided. In one aspect, a method of fabricating a FET includes the following steps. A doped substrate having a dielectric thereon is provided. At least one silicon (Si) nanowire is placed on the dielectric. One or more portions of the nanowire are masked off leaving other portions of the nanowire exposed. Epitaxial germanium (Ge) is grown on the exposed portions of the nanowire. The epitaxial Ge is interdiffused with Si in the nanowire to form SiGe regions embedded in the nanowire that introduce compressive strain in the nanowire. The doped substrate serves as a gate of the FET, the masked off portions of the nanowire serve as channels of the FET and the embedded SiGe regions serve as source and drain regions of the FET.
    • 提供了在纳米级基于沟道的场效应晶体管(FET)中嵌入硅锗(e-SiGe)源极和漏极应力的技术。 一方面,制造FET的方法包括以下步骤。 提供其上具有电介质的掺杂衬底。 在电介质上放置至少一个硅(Si)纳米线。 掩模纳米线的一个或多个部分,使纳米线的其它部分暴露出来。 外延锗(Ge)生长在纳米线的暴露部分上。 外延Ge与纳米线中的Si相互扩散以形成纳米线中嵌入纳米线中的压应变的SiGe区域。 掺杂衬底用作FET的栅极,纳米线的掩蔽掉的部分用作FET的沟道,并且嵌入的SiGe区域用作FET的源极和漏极区域。
    • 97. 发明申请
    • CONTINUOUS METAL SEMICONDUCTOR ALLOY VIA FOR INTERCONNECTS
    • 连续金属半导体合金通过互连
    • US20100052018A1
    • 2010-03-04
    • US12198592
    • 2008-08-26
    • Guy CohenChristos D. DimitrakopoulosAlfred Grill
    • Guy CohenChristos D. DimitrakopoulosAlfred Grill
    • H01L21/768H01L29/78
    • H01L29/7848B82Y10/00H01L21/28518H01L21/76885H01L23/481H01L29/665H01L29/78H01L2221/1094H01L2924/0002H01L2924/00
    • A contact structure is disclosed in which a continuous metal semiconductor alloy is located within a via contained within a dielectric material. The continuous semiconductor metal alloy is in direct contact with an upper metal line of a first metal level located atop the continuous semiconductor metal alloy and at least a surface of each source and drain diffusion region located beneath the continuous metal semiconductor alloy. The continuous metal semiconductor alloy can be derived from either a semiconductor nanowire or an epitaxial grown semiconductor material. The continuous metal semiconductor alloy includes a lower portion that is contained within an upper surface of each source and drain region, and a vertical pillar portion extending upward from the lower portion. The lower portion of the continuous metal semiconductor alloy and the vertical pillar portion are not separated by a material interface. Instead, the two portions of the continuous metal semiconductor alloy are of unitary construction, i.e., a single piece.
    • 公开了一种接触结构,其中连续的金属半导体合金位于包含在电介质材料内的通孔内。 连续半导体金属合金与位于连续半导体金属合金顶部的第一金属水平的上金属线和至少位于连续金属半导体合金下方的源极和漏极扩散区的表面直接接触。 连续金属半导体合金可以衍生自半导体纳米线或外延生长半导体材料。 连续金属半导体合金包括包含在每个源极和漏极区域的上表面内的下部以及从下部向上延伸的垂直柱部分。 连续金属半导体合金的下部和垂直支柱部分不被材料界面分离。 相反,连续金属半导体合金的两个部分是单一结构,即单件。
    • 99. 发明申请
    • Rd Algorithm Improvement for Nrom Technology
    • Nrom技术的Rd算法改进
    • US20090003073A1
    • 2009-01-01
    • US12087594
    • 2007-01-10
    • Arik RizelGuy Cohen
    • Arik RizelGuy Cohen
    • G11C16/06G11C7/00
    • G11C16/0475G11C16/26
    • Selecting a read voltage level for a NVM cell by using an initial value for the read voltage and performing a read operation, comparing an actual number of bits found to an expected number of bits and, if there is a discrepancy between the actual number and the expected number, adjusting the read voltage level, based on variable data such as statistics available, level occupation, neighbor level, previous chunks data, and other data used during read, program or erase. For example, based on a number of missing bits, or upon a result of a previous read operation, or a result obtained at another program level, or upon how many times the memory cell has been cycled, or upon how many memory cells are at each program level, or on a number of bits at another program level in a selected chunk of memory.
    • 通过使用读取电压的初始值并执行读取操作来选择NVM单元的读取电压电平,将发现的实际位数与预期位数进行比较,如果实际数字与 基于可用数据,如可用统计数据,级别占用,邻居级别,先前块数据以及在读取,编程或擦除期间使用的其他数据的可变数据来调整读取电压电平。 例如,基于多个丢失比特,或者基于先前读取操作的结果,或者在另一程序级别获得的结果,或者存储器单元已循环多少次,或者存储器单元处于多少 每个节目级别,或者在所选择的存储器块中的另一程序级别的多个位上。