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91. 发明授权

US07960744B2 Multi-light emitting diode package 有权
标题翻译：多发光二极管封装
公开(公告)号：US07960744B2
公开(公告)日：2011-06-14
申请号：US12164456
申请日：2008-06-30
申请人： Jung Hoo Seo , Do Hyung Kim , Byoung Ki Pyo , You Jin Kwon , Ju Yong Shim
发明人： Jung Hoo Seo , Do Hyung Kim , Byoung Ki Pyo , You Jin Kwon , Ju Yong Shim
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/504 , H01L33/58 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/12041 , Y10S362/80 , H01L2924/00014 , H01L2924/00
摘要： A multi-LED package includes a heat sink including a primary slug and a secondary slug separated from each other, a primary LED chip mounted on the primary slug, one or more secondary LED chips mounted on the secondary slug, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip. Another multi-LED package includes a heat sink having an upper surface and partitions protruding therefrom, a primary LED chip mounted inside the partitions, one or more secondary LED chips mounted outside the partitions, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip.
摘要翻译：多LED封装包括散热器，其包括彼此分离的初级芯片和次级芯片，安装在初级芯片上的主要LED芯片，安装在次级芯片上的一个或多个次级LED芯片，电连接的引线框架结构到主要和次要LED芯片以及覆盖主要LED芯片的至少一部分的荧光体。另一个多LED封装包括具有上表面和从其突出的隔板的散热器，安装在隔板内的主LED芯片，安装在隔板外部的一个或多个次级LED芯片，电连接到主和次级LED的引线框架结构芯片和覆盖主LED芯片的至少一部分的荧光体。

92. 发明授权

US07906855B1 Stacked semiconductor package and method of making same 有权
标题翻译：堆叠式半导体封装及其制作方法
公开(公告)号：US07906855B1
公开(公告)日：2011-03-15
申请号：US12758583
申请日：2010-04-12
申请人： Yoon Joo Kim , In Tae Kim , Ji Young Chung , Bong Chan Kim , Do Hyung Kim , Sung Chul Ha , Sung Min Lee , Jae Kyu Song
发明人： Yoon Joo Kim , In Tae Kim , Ji Young Chung , Bong Chan Kim , Do Hyung Kim , Sung Chul Ha , Sung Min Lee , Jae Kyu Song
IPC分类号： H01L23/48
CPC分类号： H01L24/27 , H01L23/3128 , H01L23/3135 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/0652 , H01L25/0657 , H01L2224/29101 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/48465 , H01L2224/73215 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/838 , H01L2224/85447 , H01L2224/92 , H01L2224/92247 , H01L2225/0651 , H01L2225/06565 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： In accordance with the present invention, there is provided multiple embodiments of a semiconductor package including two or more semiconductor dies which are electrically connected to an underlying substrate through the use of conductive wires, some of which may be fully or partially encapsulated by an adhesive or insulating layer of the package. In a basic embodiment of the present invention, the semiconductor package comprises a substrate having a conductive pattern disposed thereon. Electrically connected to the conductive pattern of the substrate are first and second semiconductor dies. The first semiconductor die and a portion of the substrate are covered by an adhesive layer. The second semiconductor die, the adhesive layer and a portion of the substrate are in turn covered by a package body of the semiconductor package.
摘要翻译：根据本发明，提供了包括两个或更多个半导体管芯的半导体封装的多个实施例，所述半导体管芯通过使用导电线电连接到下面的衬底，其中一些可以被粘合剂完全或部分封装，绝缘层包装。在本发明的基本实施例中，半导体封装包括其上布置有导电图案的衬底。电连接到衬底的导电图案是第一和第二半导体管芯。第一半导体管芯和衬底的一部分被粘合剂层覆盖。第二半导体管芯，粘合剂层和衬底的一部分又由半导体封装的封装主体覆盖。

93. 发明申请

US20100303922A1 METHOD FOR THE PREPARATION OF BIOCOMPATIBLE POLYMERIC NANOPARTICLES FOR DRUG DELIVERY AND NANOPARTICLES PREPARED THEREBY 审中-公开
标题翻译：用于制备药物递送的生物成分聚合物纳米颗粒的方法及其制备的纳米颗粒
公开(公告)号：US20100303922A1
公开(公告)日：2010-12-02
申请号：US12597451
申请日：2008-04-22
申请人： Soon Hong Yuk , Keun Sang Oh , Won Tae Jung , Youn Woong Choi , Sang Min Cho , Dae Chul Ha , Do Hyung Kim , Seong Woo Ahn , Jeong Hyun Choi
发明人： Soon Hong Yuk , Keun Sang Oh , Won Tae Jung , Youn Woong Choi , Sang Min Cho , Dae Chul Ha , Do Hyung Kim , Seong Woo Ahn , Jeong Hyun Choi
IPC分类号： A61K9/14 , A61K31/337 , A61P35/00
CPC分类号： C08L71/02 , A61K9/1273 , A61K9/5146 , A61K9/5192 , A61K31/337 , B82Y30/00 , C08G2650/58 , C08J5/005 , C08L2203/02
摘要： Disclosed are biocompatible polymeric nanoparticles for drug delivery and a method for preparing the same. They can be prepared by mixing a tri-block copolymer, PEG, and a drug at a predetermined temperature to give a homogeneous polymeric mixture; solidifying the homogeneous polymeric mixture at room temperature; and dissolving the solidified polymeric mixture in an aqueous solution. Based on a polymer melting process, the method makes it easy to produce poloxamer nanoparticles at low cost. The nanoparticles show desired particle sizes suitable for use in drug delivery and a uniform particle size distribution. Consisting of a bilayer structure, the nanoparticles can contain sparingly soluble drugs. Also, the nanoparticles contain no organic solvents and are thus safe to the body because they are free of organic solvent residuals. Further, after being administered into the body, the nanoparticles with a high content of sparingly soluble drug entrapped therein can safely deliver the drug to target sites and stably release the drug at a controlled rate.
摘要翻译：公开了用于药物递送的生物相容性聚合物纳米颗粒及其制备方法。它们可以通过在预定温度下混合三嵌段共聚物PEG和药物来制备均匀的聚合物混合物; 在室温下固化均匀的聚合物混合物; 并将固化的聚合物混合物溶解在水溶液中。基于聚合物熔融工艺，该方法可以以低成本制备泊洛沙姆纳米粒子。纳米颗粒显示适合用于药物递送和均匀粒度分布的所需粒度。由双层结构构成，纳米粒子可以含有微溶药物。此外，纳米颗粒不含有机溶剂，因此对身体是安全的，因为它们不含有机溶剂残留物。此外，在被施用于体内之后，具有高含量的微溶药物的纳米颗粒被包埋在其中可以将药物安全地递送到靶位点并以受控的速率稳定地释放药物。

94. 发明授权

US07801080B2 Root mobile router and the operating method thereof in dynamically composed moving network 失效
标题翻译：根移动路由器及其在动态组合移动网络中的操作方法
公开(公告)号：US07801080B2
公开(公告)日：2010-09-21
申请号：US11834838
申请日：2007-08-07
申请人： Won Tae Kim , Heung Nam Kim , Sun Ja Kim , Do Hyung Kim , Jae Pyeong Kim , Hwan Gu Lee
发明人： Won Tae Kim , Heung Nam Kim , Sun Ja Kim , Do Hyung Kim , Jae Pyeong Kim , Hwan Gu Lee
IPC分类号： H04W4/00
CPC分类号： H04W40/24 , H04W84/005
摘要： Provided is a root mobile router and the operating method thereof in a dynamically composed moving network, capable of forming a self-configuring ad-hoc network between wireless personal area networks (WPANs) of each user in a moving network and supporting a stable connection between the network and the Internet. The method includes the steps of: receiving state information of multiple access networks and selecting an optimal access network in order to connect to the Internet; receiving a result of the selection and activating an interface of the selected access network; changing the selected access network to the activated access network interface; and updating routing path information automatically and stably transmitting an IP packet to the Internet through the selected access network interface. Therefore, a personal mobile terminal can be utilized as a mobile router.
摘要翻译：提供了一种根据移动路由器及其在动态组合的移动网络中的操作方法，其能够在移动网络中的每个用户的无线个域网（WPAN）之间形成自配置的自组织网络，并且支持在网络和互联网。该方法包括以下步骤：接收多个接入网络的状态信息并选择最佳接入网络以便连接到因特网; 接收所选择的接入网络的接口的选择和激活结果; 将所选择的接入网络改变为激活的接入网络接口; 以及通过所选择的接入网络接口，将路由路径信息自动且稳定地发送到因特网。因此，个人移动终端可以用作移动路由器。

95. 发明申请

US20100195300A1 Electronics device module 有权
标题翻译：电子设备模块
公开(公告)号：US20100195300A1
公开(公告)日：2010-08-05
申请号：US12656451
申请日：2010-01-29
申请人： Do Hyung Kim , Jung-Mo Yang , Hyun Jung Yoo , Dong-Yoon Seo , In-Young Park
发明人： Do Hyung Kim , Jung-Mo Yang , Hyun Jung Yoo , Dong-Yoon Seo , In-Young Park
IPC分类号： H05K7/00
CPC分类号： H05K1/181 , H05K2201/09227 , H05K2201/09254 , H05K2201/10159 , Y02P70/611
摘要： Disclosed is an electronic device module including a module substrate having first and second electronic device pair portions. The first electronic device pair portion may include a first and a second contact pad area and a first via area between the first and second contact pad areas. The first electronic device pair portion may also include a first layer and a second layer. The first layer may include a plurality of first lines connecting a plurality of contact pads in the first contact pad area on one side of the module substrate to a plurality of vias. The second layer may include a plurality of second lines connecting a plurality of contact pads in the second contact pad area to a plurality of vias in the via area. The second layer may also include a plurality of third lines connecting the first and second electronic device pair portions.
摘要翻译：公开了一种电子设备模块，包括具有第一和第二电子设备对部分的模块基板。第一电子器件对部分可以包括第一和第二接触焊盘区域和第一和第二接触焊盘区域之间的第一通孔区域。第一电子设备对部分还可以包括第一层和第二层。第一层可以包括将模块衬底的一侧上的第一接触焊盘区域中的多个接触焊盘连接到多个通孔的多条第一线。第二层可以包括将第二接触焊盘区域中的多个接触焊盘连接到通孔区域中的多个通孔的多条第二线路。第二层还可以包括连接第一和第二电子设备对部分的多条第三线。

96. 发明申请

US20100072506A1 ULTRAVIOLET LIGHT EMITTING DIODE PACKAGE 有权
标题翻译：超紫外线发光二极管封装
公开(公告)号：US20100072506A1
公开(公告)日：2010-03-25
申请号：US12443380
申请日：2007-09-18
申请人： Jeong Suk Bae , Jae Jo Kim , Do Hyung Kim , Dae Sung Kal
发明人： Jeong Suk Bae , Jae Jo Kim , Do Hyung Kim , Dae Sung Kal
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L25/0753 , H01L33/56 , H01L33/642 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： An ultraviolet light emitting diode package for emitting ultraviolet light is disclosed. The ultraviolet light emitting diode package comprises an LED chip emitting light with a peak wavelength of 350 nm or less, and a protective member provided so that surroundings of the LED chip is covered to protect the LED chip, the protective member having a non-yellowing property to energy from the LED chip.
摘要翻译：公开了一种用于发射紫外光的紫外线发光二极管封装。紫外线发光二极管封装包括发射峰值波长为350nm以下的光的LED芯片，以及设置为使得LED芯片的周围被覆盖以保护LED芯片的保护构件，保护构件具有不变黄性能来自LED芯片的能量。

97. 发明申请

US20090242979A1 Vertical Transistor of Semiconductor Device and Method of Forming the Same 有权
标题翻译：半导体器件的垂直晶体管及其形成方法
公开(公告)号：US20090242979A1
公开(公告)日：2009-10-01
申请号：US12341583
申请日：2008-12-22
申请人： Ki Ro Hong , Do Hyung Kim
发明人： Ki Ro Hong , Do Hyung Kim
IPC分类号： H01L29/78 , H01L27/088 , H01L21/3205 , H01L21/20
CPC分类号： H01L29/66666 , H01L21/823418 , H01L21/823487 , H01L29/7827
摘要： A vertical transistor of a semiconductor device has a channel area formed in a vertical direction to a semiconductor substrate. After semiconductor poles corresponding to the length of semiconductor channels and gate electrodes surrounding sidewalls of the semiconductor poles are formed, subsequent processes of forming silicon patterns corresponding to junction areas, etc. are performed. The gate electrodes support the semiconductor poles during these subsequent processes. The height of the semiconductor poles corresponding to the length of the channel is increased, yet the semiconductor poles do not collapse or incline since the gate electrodes support the semiconductor poles.
摘要翻译：半导体器件的垂直晶体管具有在与半导体衬底垂直的方向上形成的沟道区。在形成与半导体沟道的长度对应的半导体极和形成半导体极的侧壁的栅电极之后，形成对应于结区等的硅图案的后续工序。在这些后续工艺期间，栅电极支撑半导体极。与通道长度相对应的半导体极的高度增加，但由于栅极支撑半导体极，所以半导体极不会倒塌或倾斜。

98. 发明申请

US20090166744A1 Semiconductor device with deep trench structure 有权
标题翻译：具有深沟槽结构的半导体器件
公开(公告)号：US20090166744A1
公开(公告)日：2009-07-02
申请号：US12318302
申请日：2008-12-24
申请人： Do Hyung Kim , Yong Gyu Lim
发明人： Do Hyung Kim , Yong Gyu Lim
IPC分类号： H01L29/78 , H01L21/336
CPC分类号： H01L29/7833 , H01L29/0653 , H01L29/1087 , H01L29/6659
摘要： Disclosed herein is a semiconductor device with a deep trench structure for effectively isolating heavily doped wells of neighboring elements from each other at a high operating voltage. The semiconductor device with a deep trench structure includes a semiconductor substrate in which a first conductivity type well and a second conductivity type well having conductivity opposite to that of the first conductivity type well are formed, a gate oxide film and a gate electrode laminated on each of the first conductivity type well and the second conductivity type well, second conductivity type drift regions formed on both sides of the gate electrode formed on the first conductivity type well, first conductivity type drift regions formed on both sides of the gate electrode formed on the second conductivity type well, and a first isolation layer having a trench structure deeper than the first and second conductivity type wells and isolating the first conductivity type well and the second conductivity type well from each other.
摘要翻译：本文公开了具有深沟槽结构的半导体器件，用于在高工作电压下有效地隔离相邻元件的重掺杂阱。具有深沟槽结构的半导体器件包括其中形成具有与第一导电类型阱的导电性相反的导电性的第一导电类型阱和第二导电类型阱的半导体衬底，每个上形成栅氧化物膜和栅电极的第一导电型阱和第二导电型阱形成在形成在第一导电类型阱上的栅电极的两侧上的第二导电类型漂移区，形成在形成在第一导电类型阱上的栅电极的两侧上的第一导电类型漂移区第二导电类型阱以及具有比第一和第二导电类型阱更深的沟槽结构的第一隔离层，并且将第一导电类型阱和第二导电类型彼此良好地隔离。

99. 发明申请

US20080237624A1 LED PACKAGE WITH METAL PCB 有权
标题翻译： LED包装与金属PCB
公开(公告)号：US20080237624A1
公开(公告)日：2008-10-02
申请号：US12058417
申请日：2008-03-28
申请人： Suk Jin Kang , Do Hyung Kim
发明人： Suk Jin Kang , Do Hyung Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H01L33/647 , H01L2224/48091 , H01L2924/00012 , H01L2924/00014
摘要： The present invention relates to a light emitting diode (LED) package. An object of the present invention is to provide an LED package having a metal PCB, which has a superior heat dissipation property and a compact structure, does not largely restrict use of conventional equipments, and is compatible with an electronic device or illumination device currently used widely.To this end, an LED package according to the present invention comprises a metal printed circuit board (PCB) formed by laminating first and second sheet metal plates with an electric insulating layer interposed therebetween; and an LED chip mounted on the first sheet metal plate of the metal PCB, wherein the first sheet metal plate has electrode patterns and leads respectively extending from the electrode patterns.
摘要翻译：本发明涉及发光二极管（LED）封装。本发明的目的是提供一种具有优异的散热性和紧凑结构的具有金属PCB的LED封装，不会大大限制常规设备的使用，并且与目前使用的电子设备或照明设备兼容广泛。为此，根据本发明的LED封装包括通过层叠第一和第二金属板与介于其间的电绝缘层形成的金属印刷电路板（PCB）; 以及安装在金属PCB的第一金属板上的LED芯片，其中第一金属板具有分别从电极图案延伸的电极图案和引线。

100. 外观设计

USD534503S1 Light emitting diode (LED) 有权
公开(公告)号：USD534503S1
公开(公告)日：2007-01-02
申请号：US29236857
申请日：2005-08-22
申请人： Jung Hwa Jung , Jung Hoo Seo , Do Hyung Kim
设计人： Jung Hwa Jung , Jung Hoo Seo , Do Hyung Kim

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