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1. 外观设计

USD542743S1 LED with a lens 有权
标题翻译： LED带镜头
公开(公告)号：USD542743S1
公开(公告)日：2007-05-15
申请号：US29263651
申请日：2006-07-26
申请人： Jung Hwa Jung , Jung Hoo Seo , Do Hyung Kim
设计人： Jung Hwa Jung , Jung Hoo Seo , Do Hyung Kim

2. 外观设计

USD528997S1 Light emitting diode (LED) 有权
公开(公告)号：USD528997S1
公开(公告)日：2006-09-26
申请号：US29237082
申请日：2005-08-24
申请人： Jung Hwa Jung , Jung Hoo Seo , Do Hyung Kim
设计人： Jung Hwa Jung , Jung Hoo Seo , Do Hyung Kim

3. 外观设计

USD534504S1 Light emitting diode (LED) 有权
公开(公告)号：USD534504S1
公开(公告)日：2007-01-02
申请号：US29236915
申请日：2005-08-23
申请人： Do Hyung Kim , Jung Hoo Seo , Jung Hwa Jung
设计人： Do Hyung Kim , Jung Hoo Seo , Jung Hwa Jung

4. 外观设计

USD534503S1 Light emitting diode (LED) 有权
公开(公告)号：USD534503S1
公开(公告)日：2007-01-02
申请号：US29236857
申请日：2005-08-22
申请人： Jung Hwa Jung , Jung Hoo Seo , Do Hyung Kim
设计人： Jung Hwa Jung , Jung Hoo Seo , Do Hyung Kim

5. 发明授权

US08482023B2 Leadframe having a heat sink supporting part, fabricating method of a light emitting diode package using the same, and light emitting diode package fabricated by the method 有权
标题翻译：具有散热器支撑部件的引线框架，使用其的发光二极管封装的制造方法以及通过该方法制造的发光二极管封装
公开(公告)号：US08482023B2
公开(公告)日：2013-07-09
申请号：US12304663
申请日：2007-06-28
申请人： Do Hyung Kim , Suk Jin Kang , Hyuck Jung Choi , Jung Hoo Seo
发明人： Do Hyung Kim , Suk Jin Kang , Hyuck Jung Choi , Jung Hoo Seo
IPC分类号： H01L33/00 , H01L23/495 , H01L21/50
CPC分类号： H01L33/62 , H01L23/4334 , H01L23/49861 , H01L33/486 , H01L33/642 , H01L2224/45139 , H01L2224/48247 , H01L2924/00011 , H01L2224/48091 , H01L2924/00014 , H01L2924/00 , H01L2924/01049 , H01L2924/01005
摘要： Disclosed are a leadframe having heat sink supporting parts, a light emitting diode package in which the leadframe is employed, and a fabricating method of a light emitting diode package using the leadframe. The leadframe includes an outer frame surrounding a predetermined region. The heat sink supporting parts extend inward to face each other from the outer frame. Each of the supporting parts has an end portion coupled to a heat sink. Further, lead terminals extend inward to face each other from the outer frame. The lead terminals are spaced apart from the supporting parts. Accordingly, a package main body can be formed by an insert molding technique after the heat sink is coupled to the end portions of the supporting parts, and the heat sink and the lead terminals can be easily aligned.
摘要翻译：公开了具有散热器支撑部件的引线框架，使用引线框架的发光二极管封装以及使用引线框架的发光二极管封装件的制造方法。引线框架包括围绕预定区域的外框架。散热器支撑部件向内延伸以从外框架彼此面对。每个支撑部分具有联接到散热器的端部。此外，引线端子向内延伸以从外框架彼此面对。引线端子与支撑部分间隔开。因此，在散热器连接到支撑部件的端部之后，可以通过插入成型技术形成封装主体，并且散热器和引线端子可以容易地对准。

6. 发明授权

US08860049B2 Multi-light emitting diode package 有权
标题翻译：多发光二极管封装
公开(公告)号：US08860049B2
公开(公告)日：2014-10-14
申请号：US13090862
申请日：2011-04-20
申请人： Jung Hoo Seo , Do Hyung Kim , Byoung Ki Pyo , You Jin Kwon , Ju Yong Shim
发明人： Jung Hoo Seo , Do Hyung Kim , Byoung Ki Pyo , You Jin Kwon , Ju Yong Shim
IPC分类号： H01L33/62 , H01L33/58 , H01L25/075 , H01L33/50 , H01L33/64
CPC分类号： H01L25/0753 , H01L33/504 , H01L33/58 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/12041 , Y10S362/80 , H01L2924/00014 , H01L2924/00
摘要： A multi-LED package includes a heat sink including a primary slug and a secondary slug separated from each other, a primary LED chip mounted on the primary slug, one or more secondary LED chips mounted on the secondary slug, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip. Another multi-LED package includes a heat sink having an upper surface and partitions protruding therefrom, a primary LED chip mounted inside the partitions, one or more secondary LED chips mounted outside the partitions, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip.
摘要翻译：多LED封装包括散热器，其包括彼此分离的初级芯片和次级芯片，安装在初级芯片上的主要LED芯片，安装在次级芯片上的一个或多个次级LED芯片，电连接的引线框架结构到主要和次要LED芯片以及覆盖主要LED芯片的至少一部分的荧光体。另一个多LED封装包括具有上表面和从其突出的隔板的散热器，安装在隔板内的主LED芯片，安装在隔板外部的一个或多个次级LED芯片，电连接到主和次级LED的引线框架结构芯片和覆盖主LED芯片的至少一部分的荧光体。

7. 发明申请

US20090189178A1 LEADFRAME HAVING A HEAT SINK SUPPORTING PART, FABRICATING METHOD OF A LIGHT EMITTING DIODE PACKAGE USING THE SAME, AND LIGHT EMITTING DIODE PACKAGE FABRICATED BY THE METHOD 有权
标题翻译：具有散热支撑部件的铅笔，使用其的发光二极管封装的制造方法和由该方法制成的发光二极管封装
公开(公告)号：US20090189178A1
公开(公告)日：2009-07-30
申请号：US12304663
申请日：2007-06-28
申请人： Do Hyung Kim , Suk Jin Kang , Hyuck Jung Choi , Jung Hoo Seo
发明人： Do Hyung Kim , Suk Jin Kang , Hyuck Jung Choi , Jung Hoo Seo
IPC分类号： H01L33/00 , H01L23/495 , H01L21/50 , H01L23/36
CPC分类号： H01L33/62 , H01L23/4334 , H01L23/49861 , H01L33/486 , H01L33/642 , H01L2224/45139 , H01L2224/48247 , H01L2924/00011 , H01L2224/48091 , H01L2924/00014 , H01L2924/00 , H01L2924/01049 , H01L2924/01005
摘要： Disclosed are a leadframe having heat sink supporting parts, a light emitting diode package in which the leadframe is employed, and a fabricating method of a light emitting diode package using the leadframe. The leadframe includes an outer frame surrounding a predetermined region. The heat sink supporting parts extend inward to face each other from the outer frame. Each of the supporting parts has an end portion coupled to a heat sink. Further, lead terminals extend inward to face each other from the outer frame. The lead terminals are spaced apart from the supporting parts. Accordingly, a package main body can be formed by an insert molding technique after the heat sink is coupled to the end portions of the supporting parts, and the heat sink and the lead terminals can be easily aligned.
摘要翻译：公开了具有散热器支撑部件的引线框架，使用引线框架的发光二极管封装以及使用引线框架的发光二极管封装件的制造方法。引线框架包括围绕预定区域的外框架。散热器支撑部件向内延伸以从外框架彼此面对。每个支撑部分具有联接到散热器的端部。此外，引线端子向内延伸以从外框架彼此面对。引线端子与支撑部分间隔开。因此，在散热器连接到支撑部件的端部之后，可以通过插入成型技术形成封装主体，并且散热器和引线端子可以容易地对准。

8. 发明授权

US07960744B2 Multi-light emitting diode package 有权
标题翻译：多发光二极管封装
公开(公告)号：US07960744B2
公开(公告)日：2011-06-14
申请号：US12164456
申请日：2008-06-30
申请人： Jung Hoo Seo , Do Hyung Kim , Byoung Ki Pyo , You Jin Kwon , Ju Yong Shim
发明人： Jung Hoo Seo , Do Hyung Kim , Byoung Ki Pyo , You Jin Kwon , Ju Yong Shim
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/504 , H01L33/58 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/12041 , Y10S362/80 , H01L2924/00014 , H01L2924/00
摘要： A multi-LED package includes a heat sink including a primary slug and a secondary slug separated from each other, a primary LED chip mounted on the primary slug, one or more secondary LED chips mounted on the secondary slug, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip. Another multi-LED package includes a heat sink having an upper surface and partitions protruding therefrom, a primary LED chip mounted inside the partitions, one or more secondary LED chips mounted outside the partitions, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip.
摘要翻译：多LED封装包括散热器，其包括彼此分离的初级芯片和次级芯片，安装在初级芯片上的主要LED芯片，安装在次级芯片上的一个或多个次级LED芯片，电连接的引线框架结构到主要和次要LED芯片以及覆盖主要LED芯片的至少一部分的荧光体。另一个多LED封装包括具有上表面和从其突出的隔板的散热器，安装在隔板内的主LED芯片，安装在隔板外部的一个或多个次级LED芯片，电连接到主和次级LED的引线框架结构芯片和覆盖主LED芯片的至少一部分的荧光体。

9. 发明授权

US07994526B2 Light emitting diode package and light emitting diode system having at least two heat sinks 有权
标题翻译：发光二极管封装和具有至少两个散热器的发光二极管系统
公开(公告)号：US07994526B2
公开(公告)日：2011-08-09
申请号：US10557820
申请日：2004-05-14
申请人： Kwan Young Han , Kwang Il Park , Jae Ho Cho , Jung Hoo Seo , Seong Ryeol Ryu
发明人： Kwan Young Han , Kwang Il Park , Jae Ho Cho , Jung Hoo Seo , Seong Ryeol Ryu
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , F21Y2113/17 , F21Y2115/10 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2224/49113 , H01L2924/00014
摘要： There is provided a light emitting diode package having at least two heat sinks. The light emitting diode package includes a main body, at least two lead terminals fixed to the main body, and at least two heat sinks of electrically and thermally conductive materials, the heat sinks being fixed to the main body. The at least two heat sinks are separated from each other. Thus, high luminous power can be obtained mounting a plurality of light emitting diode dies in one LED package. Further, it is possible to embody polychromatic lights mounting LED dies emitting different wavelengths of light each other in the LED package.
摘要翻译：提供了具有至少两个散热器的发光二极管封装。发光二极管封装包括主体，固定到主体的至少两个引线端子和至少两个导电和导热材料的散热片，散热片固定在主体上。至少两个散热器彼此分离。因此，可以获得将多个发光二极管管芯安装在一个LED封装中的高发光功率。此外，可以实现在LED封装中安装发射不同波长的光的LED管的多色光。

10. 发明授权

US07705366B2 LED package having lead frames 有权
标题翻译： LED封装具有引线框架
公开(公告)号：US07705366B2
公开(公告)日：2010-04-27
申请号：US12059296
申请日：2008-03-31
申请人： Jung Hoo Seo , Suk Jin Kang
发明人： Jung Hoo Seo , Suk Jin Kang
IPC分类号： H01L29/22
CPC分类号： H01L33/483 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2924/01322 , H01L2924/00014
摘要： The present invention relates a light emitting diode (LED) package. The present invention provides an LED package, wherein one cavity for defining a circumference of an LED chip and other cavities necessary for exposing lead frames are separately formed in a supporting member for supporting lead frames, and the cavity defining the circumference of the LED chip is separately filled with a resin, whereby it is possible to prevent an irregular interface between the resin portions, and when a phosphor is contained in the resin portion formed to be confined in the circumference of the LED chip, it is possible to reduce color deviation for each light directional angle and to prevent unnecessary waste of the phosphor.
摘要翻译：本发明涉及发光二极管（LED）封装。本发明提供了一种LED封装，其中，用于限定LED芯片的周边的空腔和用于暴露引线框架所需的其它空腔分别形成在用于支撑引线框架的支撑构件中，并且限定LED芯片的圆周的空腔是分别填充树脂，由此可以防止树脂部分之间的不规则界面，并且当形成为限制在LED芯片周围的树脂部分中含有荧光体时，可以减少颜色偏差每个光方向角度，并防止不必要的磷光体浪费。

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