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1. 发明授权

US07476540B2 Monoclonal antibodies to mesenchymal stem cells 有权
标题翻译：间充质干细胞的单克隆抗体
公开(公告)号：US07476540B2
公开(公告)日：2009-01-13
申请号：US11329523
申请日：2006-01-10
申请人： Yeong-Wook Song , Hyun-Jung Yoo , Sung-Soo Yoon , Seonyang Park , Weon-Seo Park , Dong-Jo Kim , Eun-Bong Lee
发明人： Yeong-Wook Song , Hyun-Jung Yoo , Sung-Soo Yoon , Seonyang Park , Weon-Seo Park , Dong-Jo Kim , Eun-Bong Lee
IPC分类号： C12N5/00 , C07K16/00
CPC分类号： G01N33/56966 , C07K16/28
摘要： The present invention relates to monoclonal antibodies specifically binding to a membrane antigen of human mesenchymal stem cells, hybridoma cell lines producing the same, and methods for identifying or isolating human mesenchymal stem cells using the same. The monoclonal antibodies of this invention exhibit excellent specificity to human mesenchymal stem cells, inter alia, bone marrow-derived human mesenchymal stem cells, so that it allows for the identification and isolation of human mesenchymal stem cells with much higher specificity.
摘要翻译：本发明涉及特异性结合人间充质干细胞的膜抗原的单克隆抗体，产生其的杂交瘤细胞系以及使用其的鉴定或分离人间充质干细胞的方法。本发明的单克隆抗体对人类间充质干细胞，特别是对骨髓来源的人间充质干细胞表现出极好的特异性，从而允许以更高的特异性鉴定和分离人间充质干细胞。

2. 发明申请

US20080030961A1 Multi-layered printed circuit board 有权
标题翻译：多层印刷电路板
公开(公告)号：US20080030961A1
公开(公告)日：2008-02-07
申请号：US11783508
申请日：2007-04-10
申请人： Chang-Woo Koo , Jin-Sook Lee , Do-Hyung Kim , Hyun-Jung Yoo
发明人： Chang-Woo Koo , Jin-Sook Lee , Do-Hyung Kim , Hyun-Jung Yoo
IPC分类号： H05K7/20
CPC分类号： H05K1/0216 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H05K1/0203 , H05K1/025 , H05K1/0259 , H05K1/0298 , H05K2201/0191 , H05K2201/0209 , H05K2201/066 , H01L2224/0401
摘要： A printed circuit board (PCB) has a multi-layered substrate including a plurality of signal lines and a ground voltage plate disposed below the signal lines and by which a common ground voltage is applied to the signal lines, a heat sink disposed on the multi-layered substrate, and thermal interface material interposed between the signal lines and the heat sink to transfer heat from the multi-layered substrate to the heat sink. The heat sink thus dissipates the heat generating from the multi-layered substrate and along with the ground voltage plate suppresses electromagnetic interference of signal transmitted through adjacent ones of the signal lines. The thermal interface material also serves in the design phase as a means to tune the impedance of the signal lines.
摘要翻译：印刷电路板（PCB）具有包括多个信号线的多层基板和设置在信号线下方的接地电压板，并且公共接地电压施加到信号线，设置在多个信号线上的散热片层间衬底和介于信号线和散热器之间的热界面材料，以将热量从多层衬底转移到散热器。因此，散热器消散了从多层基板产生的热量，并且与接地电压板一起抑制了通过相邻信号线传输的信号的电磁干扰。热界面材料在设计阶段也起着调谐信号线阻抗的作用。

3. 发明申请

US20220007751A1 WORK SUIT HAVING LIFESAVING FUNCTION 有权
公开(公告)号：US20220007751A1
公开(公告)日：2022-01-13
申请号：US16925741
申请日：2020-07-10
申请人： Won Ki YOO , Hye Ryeong LEE , Geon Woo LEE , Sa Rang YOO , Hyun Jung YOO , Si Won KANG
发明人： Won Ki YOO , Hye Ryeong LEE , Geon Woo LEE , Sa Rang YOO , Hyun Jung YOO , Si Won KANG
IPC分类号： A41D13/012 , B63C9/105
摘要： A work suit having a lifesaving function is provided where the work suit is made of two or more sheets of fabric, at least one variable contact tube keeping air in an amount smaller than a maximum capacity is formed in the uppermost part of a side of the work suit that corresponds to the girth of the body of a wearer, and when the variable contact tube gets into water, air in a lower portion is moved up by water pressure such that the thickness of an upper portion changes to the thickness when the variable contact tube is fully filled with air, so the variable contact tube come is in close contact with the body of the wearer.

4. 发明授权

US07872876B2 Multi-layered printed circuit board 有权
标题翻译：多层印刷电路板
公开(公告)号：US07872876B2
公开(公告)日：2011-01-18
申请号：US11783508
申请日：2007-04-10
申请人： Chang-Woo Koo , Jin-Sook Lee , Do-Hyung Kim , Hyun-Jung Yoo
发明人： Chang-Woo Koo , Jin-Sook Lee , Do-Hyung Kim , Hyun-Jung Yoo
IPC分类号： H05K1/11 , H05K1/14
CPC分类号： H05K1/0216 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H05K1/0203 , H05K1/025 , H05K1/0259 , H05K1/0298 , H05K2201/0191 , H05K2201/0209 , H05K2201/066 , H01L2224/0401
摘要： A printed circuit board (PCB) has a multi-layered substrate including a plurality of signal lines and a ground voltage plate disposed below the signal lines and by which a common ground voltage is applied to the signal lines, a heat sink disposed on the multi-layered substrate, and thermal interface material interposed between the signal lines and the heat sink to transfer heat from the multi-layered substrate to the heat sink. The heat sink thus dissipates the heat generating from the multi-layered substrate and along with the ground voltage plate suppresses electromagnetic interference of signal transmitted through adjacent ones of the signal lines. The thermal interface material also serves in the design phase as a means to tune the impedance of the signal lines.
摘要翻译：印刷电路板（PCB）具有包括多个信号线的多层基板和设置在信号线下方的接地电压板，并且公共接地电压施加到信号线，设置在多个信号线上的散热片层间衬底和介于信号线和散热器之间的热界面材料，以将热量从多层衬底转移到散热器。因此，散热器消散了从多层基板产生的热量，并且与接地电压板一起抑制了通过相邻信号线传输的信号的电磁干扰。热界面材料在设计阶段也起着调谐信号线阻抗的作用。

5. 发明授权

US08369099B2 Electronics device module 有权
标题翻译：电子设备模块
公开(公告)号：US08369099B2
公开(公告)日：2013-02-05
申请号：US12656451
申请日：2010-01-29
申请人： Do Hyung Kim , Jung-Mo Yang , Hyun Jung Yoo , Dong-Yoon Seo , In-Young Park
发明人： Do Hyung Kim , Jung-Mo Yang , Hyun Jung Yoo , Dong-Yoon Seo , In-Young Park
IPC分类号： H05K7/00
CPC分类号： H05K1/181 , H05K2201/09227 , H05K2201/09254 , H05K2201/10159 , Y02P70/611
摘要： Disclosed is an electronic device module including a module substrate having first and second electronic device pair portions. The first electronic device pair portion may include a first and a second contact pad area and a first via area between the first and second contact pad areas. The first electronic device pair portion may also include a first layer and a second layer. The first layer may include a plurality of first lines connecting a plurality of contact pads in the first contact pad area on one side of the module substrate to a plurality of vias. The second layer may include a plurality of second lines connecting a plurality of contact pads in the second contact pad area to a plurality of vias in the via area. The second layer may also include a plurality of third lines connecting the first and second electronic device pair portions.
摘要翻译：公开了一种电子设备模块，包括具有第一和第二电子设备对部分的模块基板。第一电子器件对部分可以包括第一和第二接触焊盘区域和第一和第二接触焊盘区域之间的第一通孔区域。第一电子设备对部分还可以包括第一层和第二层。第一层可以包括将模块衬底的一侧上的第一接触焊盘区域中的多个接触焊盘连接到多个通孔的多条第一线。第二层可以包括将第二接触焊盘区域中的多个接触焊盘连接到通孔区域中的多个通孔的多条第二线路。第二层还可以包括连接第一和第二电子设备对部分的多条第三线。

6. 发明申请

US20100195300A1 Electronics device module 有权
标题翻译：电子设备模块
公开(公告)号：US20100195300A1
公开(公告)日：2010-08-05
申请号：US12656451
申请日：2010-01-29
申请人： Do Hyung Kim , Jung-Mo Yang , Hyun Jung Yoo , Dong-Yoon Seo , In-Young Park
发明人： Do Hyung Kim , Jung-Mo Yang , Hyun Jung Yoo , Dong-Yoon Seo , In-Young Park
IPC分类号： H05K7/00
CPC分类号： H05K1/181 , H05K2201/09227 , H05K2201/09254 , H05K2201/10159 , Y02P70/611
摘要： Disclosed is an electronic device module including a module substrate having first and second electronic device pair portions. The first electronic device pair portion may include a first and a second contact pad area and a first via area between the first and second contact pad areas. The first electronic device pair portion may also include a first layer and a second layer. The first layer may include a plurality of first lines connecting a plurality of contact pads in the first contact pad area on one side of the module substrate to a plurality of vias. The second layer may include a plurality of second lines connecting a plurality of contact pads in the second contact pad area to a plurality of vias in the via area. The second layer may also include a plurality of third lines connecting the first and second electronic device pair portions.
摘要翻译：公开了一种电子设备模块，包括具有第一和第二电子设备对部分的模块基板。第一电子器件对部分可以包括第一和第二接触焊盘区域和第一和第二接触焊盘区域之间的第一通孔区域。第一电子设备对部分还可以包括第一层和第二层。第一层可以包括将模块衬底的一侧上的第一接触焊盘区域中的多个接触焊盘连接到多个通孔的多条第一线。第二层可以包括将第二接触焊盘区域中的多个接触焊盘连接到通孔区域中的多个通孔的多条第二线路。第二层还可以包括连接第一和第二电子设备对部分的多条第三线。

7. 发明申请

US20070161050A1 Monoclonal antibodies to mesenchymal stem cells 有权
标题翻译：间充质干细胞的单克隆抗体
公开(公告)号：US20070161050A1
公开(公告)日：2007-07-12
申请号：US11329523
申请日：2006-01-10
申请人： Yeong-Wook Song , Hyun-Jung Yoo , Sung-Soo Yoon , Seonyang Park , Weon-Seo Park , Dong-Jo Kim , Eun-Bong Lee
发明人： Yeong-Wook Song , Hyun-Jung Yoo , Sung-Soo Yoon , Seonyang Park , Weon-Seo Park , Dong-Jo Kim , Eun-Bong Lee
IPC分类号： G01N33/567 , C12N5/06 , C12N5/08 , C07K16/28
CPC分类号： G01N33/56966 , C07K16/28
摘要： The present invention relates to monoclonal antibodies specifically binding to a membrane antigen of human mesenchymal stem cells, hybridoma cell lines producing the same, and methods for identifying or isolating human mesenchymal stem cells using the same. The monoclonal antibodies of this invention exhibit excellent specificity to human mesenchymal stem cells, inter alia, bone marrow-derived human mesenchymal stem cells, so that it allows for the identification and isolation of human mesenchymal stem cells with much higher specificity.
摘要翻译：本发明涉及特异性结合人间充质干细胞的膜抗原的单克隆抗体，产生其的杂交瘤细胞系以及使用其的鉴定或分离人间充质干细胞的方法。本发明的单克隆抗体对人类间充质干细胞，特别是对骨髓来源的人间充质干细胞表现出极好的特异性，从而允许以更高的特异性鉴定和分离人间充质干细胞。

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