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91. 发明申请

US20070068620A1 System and method for transferring structured material to a substrate 审中-公开
标题翻译：将结构材料转移到基底的系统和方法
公开(公告)号：US20070068620A1
公开(公告)日：2007-03-29
申请号：US11604474
申请日：2006-11-27
申请人： Chien-Hua Chen , James McKinnell
发明人： Chien-Hua Chen , James McKinnell
IPC分类号： B44C1/17 , B44C1/165 , B32B37/00 , B32B38/18
CPC分类号： B81C1/00285 , H01L21/2007
摘要： A structured material is transferred to a substrate. A release film is applied to a carrier. A material is deposited on a surface of the release film. The material is processed to form the structured material. The structured material is coupled to the substrate. The release film is exposed to reduce adhesion strength between the release film and the carrier, and the carrier and the release film are removed from the structured material.
摘要翻译：将结构化材料转移到基底。将剥离膜应用于载体。材料沉积在脱模膜的表面上。处理该材料以形成结构化材料。结构材料耦合到基底。暴露脱模膜以降低剥离膜和载体之间的粘合强度，并且将载体和脱模膜从结构化材料中除去。

92. 发明授权

US07187124B2 Transparent electron source emitter device and method 失效
标题翻译：透明电子源发射装置及方法
公开(公告)号：US07187124B2
公开(公告)日：2007-03-06
申请号：US10781212
申请日：2004-02-17
申请人： Timothy F. Myers , John Chen , Chien-Hua Chen
发明人： Timothy F. Myers , John Chen , Chien-Hua Chen
IPC分类号： H01J1/62 , H01J63/04
CPC分类号： H01J1/312 , B82Y10/00 , H01J9/022 , H01J31/123
摘要： A photonic assisted emitter including an at least partially transparent electron source layer, a thin metal layer; and a tunneling layer disposed between said at least partially transparent electron source layer and said thin metal layer.
摘要翻译：一种光子辅助发射器，包括至少部分透明的电子源层，薄金属层; 以及设置在所述至少部分透明的电子源层和所述薄金属层之间的隧道层。

93. 外观设计

USD526282S1 Push-button for switch 有权
公开(公告)号：USD526282S1
公开(公告)日：2006-08-08
申请号：US29221826
申请日：2005-01-20
申请人： Chien-Hua Chen
设计人： Chien-Hua Chen

94. 发明授权

US07087134B2 System and method for direct-bonding of substrates 有权
标题翻译：用于直接粘合基材的系统和方法
公开(公告)号：US07087134B2
公开(公告)日：2006-08-08
申请号：US10816509
申请日：2004-03-31
申请人： Chien-Hua Chen , Charles C. Haluzak
发明人： Chien-Hua Chen , Charles C. Haluzak
IPC分类号： B32B37/00
CPC分类号： B81B7/0067 , B81C2203/036
摘要： A method of bonding substrates and devices having bonded substrates are disclosed. The method of bonding substrates includes depositing a layer of bonding substrate material onto a bonding surface of a first substrate. A bonding site density of at least one of the layer of bonding substrate material or a bonding surface of a second substrate is increased, and the bonding surface of the first substrate having the layer of bonding substrate material is bonded to the bonding surface of the second substrate.
摘要翻译：公开了一种接合具有接合基片的基片和器件的方法。接合基板的方法包括将接合基板材料层沉积到第一基板的接合表面上。粘接基板材料层或第二基板的接合面中的至少一方的接合位置密度增加，具有接合基板材料层的第一基板的接合面与第二基板材料的接合面接合基质。

95. 发明授权

US07026189B2 Wafer packaging and singulation method 有权
标题翻译：晶圆包装和切片方法
公开(公告)号：US07026189B2
公开(公告)日：2006-04-11
申请号：US10776084
申请日：2004-02-11
申请人： Chien-Hua Chen , Bradley C. John , Charlotte R. Lanig , Melissa A. Workman
发明人： Chien-Hua Chen , Bradley C. John , Charlotte R. Lanig , Melissa A. Workman
IPC分类号： H01L21/44
CPC分类号： B81B7/0077 , B81C1/00873 , B81C2203/0118
摘要： A method for packaging and singulating a wafer having a plurality of micro devices includes providing a multi-lid substrate having a trench having intersection portions and non-intersection portions formed on a first side of the multi-lid substrate. The multi-lid substrate is coupled to the wafer such that the intersection portions of the trench pattern extend adjacent to at least three micro devices. Portions of the multi-lid substrate between a second side of the multi-lid substrate and the trench pattern are removed while the multi-lid substrate is coupled to the wafer.
摘要翻译：一种用于封装和分离具有多个微器件的晶片的方法包括提供具有沟槽的多盖基板，所述沟槽具有形成在所述多盖基板的第一侧上的交叉部分和非交叉部分。多盖基板耦合到晶片，使得沟槽图案的相交部分相邻于至少三个微器件延伸。在多盖基板与晶片连接的同时，多盖基板的多盖基板的第二面与沟槽图案之间的部分被去除。

96. 发明授权

US06981759B2 Substrate and method forming substrate for fluid ejection device 失效
公开(公告)号：US06981759B2
公开(公告)日：2006-01-03
申请号：US10135236
申请日：2002-04-30
申请人： Chien-Hua Chen , Donald W. Schulte , Terry E. McMahon
发明人： Chien-Hua Chen , Donald W. Schulte , Terry E. McMahon
IPC分类号： B41J2/05
CPC分类号： B41J2/1603 , B41J2/14145 , B41J2/1607 , B41J2/1628 , B41J2/1631 , B41J2202/15 , G11B5/3103 , G11B5/313 , G11B5/3163
摘要： A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming spaced etch stops in the first side of the substrate, etching into the substrate from the second side toward the first side to the spaced etch stops, and etching into the substrate between the spaced etch stops from the second side. Etching into the substrate to the spaced etch stops includes forming a first portion of the opening and etching into the substrate between the spaced etch stops includes forming a second portion of the opening.

97. 发明授权

US06979585B2 Micro-electromechanical system 失效
标题翻译：微机电系统
公开(公告)号：US06979585B2
公开(公告)日：2005-12-27
申请号：US10683909
申请日：2003-10-10
申请人： Eric L. Nikkel , Stephen J Potochnik , Charles C Haluzak , Chien-Hua Chen , Mickey Szepesi
发明人： Eric L. Nikkel , Stephen J Potochnik , Charles C Haluzak , Chien-Hua Chen , Mickey Szepesi
IPC分类号： B81B7/00 , H01L21/00 , H01L23/12
CPC分类号： B81C1/00269 , B81C2203/0109 , B81C2203/019
摘要： A microelectromechanical system (MEMS) device is created by forming mechanical structures supported by a substrate having a bond ring area laterally spaced from the mechanical structures and having a sacrificial layer surrounding the mechanical structures. A bond ring material is formed on top of the sacrificial layer and the bond ring area. Some of the bond ring material is then removed to create a bond ring.
摘要翻译：微机电系统（MEMS）装置通过形成由衬底支撑的机械结构而形成，该衬底具有与机械结构横向间隔开的结合环区域并且具有围绕机械结构的牺牲层。在牺牲层和结合环区域的顶部上形成结合环材料。然后去除一些粘结环材料以形成粘结环。

98. 发明申请

US20050282331A1 Substrate and method of forming substrate for fluid ejection device 有权
标题翻译：用于流体喷射装置的基板的形成基板和方法
公开(公告)号：US20050282331A1
公开(公告)日：2005-12-22
申请号：US11211390
申请日：2005-08-25
申请人： Chien-Hua Chen , Donald Schulte , Terry McMahon
发明人： Chien-Hua Chen , Donald Schulte , Terry McMahon
IPC分类号： G11B5/31 , H01L21/8238
CPC分类号： B41J2/1603 , B41J2/14145 , B41J2/1607 , B41J2/1628 , B41J2/1631 , B41J2202/15 , G11B5/3103 , G11B5/313 , G11B5/3163
摘要： A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming spaced etch stops in the first side of the substrate, etching into the substrate from the second side toward the first side to the spaced etch stops, and etching into the substrate between the spaced etch stops from the second side. Etching into the substrate to the spaced etch stops includes forming a first portion of the opening and etching into the substrate between the spaced etch stops includes forming a second portion of the opening.
摘要翻译：通过具有第一侧和与第一侧相对的第二侧的衬底形成开口的方法包括在衬底的第一侧中形成间隔开的蚀刻停止层，从第二侧朝向第一侧蚀刻到衬底中至间隔蚀刻停止并在第二侧的间隔的蚀刻停止之间蚀刻到衬底中。蚀刻到衬底到间隔的蚀刻停止件包括形成开口的第一部分并且在间隔开的蚀刻停止之间蚀刻到衬底中，包括形成开口的第二部分。

99. 发明授权

US06679587B2 Fluid ejection device with a composite substrate 失效
公开(公告)号：US06679587B2
公开(公告)日：2004-01-20
申请号：US10003600
申请日：2001-10-31
申请人： Chien-Hua Chen , Charles C Haluzak
发明人： Chien-Hua Chen , Charles C Haluzak
IPC分类号： B41J205
CPC分类号： B41J2/1642 , B41J2/1404 , B41J2/14201 , B41J2/1603 , B41J2/1607 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2002/041 , B41J2002/043 , B41J2002/1437 , B41J2002/14403 , B41J2202/03 , B41J2202/15 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/494 , Y10T29/49401
摘要： A fluid ejection device comprising a composite substrate, wherein the composite substrate has two substrates with a patterned etch mask therebetween, and a fluid channel.

100. 发明授权

US06481832B2 Fluid-jet ejection device 失效
标题翻译：流体喷射装置
公开(公告)号：US06481832B2
公开(公告)日：2002-11-19
申请号：US09774259
申请日：2001-01-29
申请人： Qin Liu , Naoto Kawamura , Chien-Hua Chen
发明人： Qin Liu , Naoto Kawamura , Chien-Hua Chen
IPC分类号： B41J205
CPC分类号： B41J2/1645 , B41J2/1404 , B41J2/14145 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1634 , B41J2/1635 , Y10T29/49 , Y10T29/49085 , Y10T29/49401
摘要： The invention is a fluid ejection device, such as a printhead, that has a substrate with a first surface mating to an orifice layer, preferably through a stack of thin-film layers. The orifice layer defines a fluid chamber interfacing to an orifice opening or nozzle. The substrate has a second surface having a truncated pyramidal structure; either polyhedral or triangular ridge shaped defining an opening through the substrate to the fluid chamber. The substrate further has an ejection element, preferably disposed as a resistor in the stack of thin-film layers. When energy is transferred from the ejection element to the fluid in the fluid chamber, fluid is ejected from the orifice opening. The fluid ejection device may have one or a plurality of fluid chambers and one or a plurality of frustums of a truncated polyhedral, truncated pyramidal, truncated conical or truncated triangular cross-sectional ridge structures defining openings from the second surface of the substrate to the fluid chambers.
摘要翻译：本发明是一种流体喷射装置，例如打印头，其具有基底，其具有与孔层相匹配的第一表面，优选地通过一叠薄膜层。孔口层限定与孔口或喷嘴连接的流体室。基板具有具有截头棱锥结构的第二表面; 多面体或三角形脊形，限定通过基底的开口到流体室。衬底还具有优选地设置在薄膜层堆叠中作为电阻器的喷射元件。当能量从喷射元件转移到流体室中的流体时，流体从孔口排出。流体喷射装置可以具有一个或多个流体室和一个或多个截头圆锥体，其截断的多面体，截头锥体，截头圆锥形或截头三角形横截面脊结构限定从衬底的第二表面到流体的开口房间。

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