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91. 发明授权

US07602962B2 Method of classifying defects using multiple inspection machines 失效
标题翻译：使用多台检测机分类缺陷的方法
公开(公告)号：US07602962B2
公开(公告)日：2009-10-13
申请号：US10762091
申请日：2004-01-20
申请人： Atsushi Miyamoto , Hirohito Okuda , Toshifumi Honda , Yuji Takagi , Takashi Hiroi
发明人： Atsushi Miyamoto , Hirohito Okuda , Toshifumi Honda , Yuji Takagi , Takashi Hiroi
IPC分类号： G06K9/00
CPC分类号： G06T7/0004 , G06K9/6253 , G06T2207/30148
摘要： The present invention provides a method of classifying defects wherein defects are detected in a first inspection machine. The detected defects are then reviewed by a second inspection machine. A sampling rate for review by the second inspection machine is determined by a defect classifier in the first inspection machine.
摘要翻译：本发明提供了在第一检查机中检测到缺陷的缺陷分类方法。然后检测到的缺陷由第二台检查机检查。由第二检查机检查的采样率由第一检查机中的缺陷分类器确定。

92. 发明授权

US07421110B2 Image processing unit for wafer inspection tool 失效
标题翻译：晶圆检测工具图像处理单元
公开(公告)号：US07421110B2
公开(公告)日：2008-09-02
申请号：US10780752
申请日：2004-02-19
申请人： Michio Nakano , Shigeya Tanaka , Yoshiyuki Momiyama , Takashi Hiroi , Kazuya Hayashi , Dai Fujii , Takako Fujisawa , Atsushi Ichige , Ichiro Kawashima
发明人： Michio Nakano , Shigeya Tanaka , Yoshiyuki Momiyama , Takashi Hiroi , Kazuya Hayashi , Dai Fujii , Takako Fujisawa , Atsushi Ichige , Ichiro Kawashima
IPC分类号： G06K9/00
CPC分类号： G06T7/001 , G06T2200/28 , G06T2207/30148
摘要： An image processing apparatus for wafer inspection tool that is able to perform continuously cell to cell comparison inspection, die to die comparison inspection, and cell-to-cell and die-to-die hybrid comparison inspection, employing a plurality of processors. This image processing apparatus for wafer inspection tool comprises a plurality of processors for performing parallel processing, means for cutting out image data including a forward end overlap and a rear end overlap at partition boundaries in order to cut serial data into a predetermined image size, means for distributing the cutout image data to the plurality of processors, and means for assembling results of processing performed by the plurality of processors. The forward end overlap is set greater than a pitch of the cell subject to cell to cell comparison inspection.
摘要翻译：一种用于晶片检查工具的图像处理装置，其能够执行连续的单元到单元比较检查，管芯到管芯比较检查，以及使用多个处理器的单元到单元和管芯到管芯的混合比较检查。这种晶片检查工具的图像处理装置包括用于执行并行处理的多个处理器，用于在分区边界处切出包括前端重叠和后端重叠的图像数据的装置，以便将串行数据切割成预定图像尺寸用于将剪切图像数据分配给多个处理器，以及用于组装由多个处理器执行的处理结果的装置。前端重叠被设定为大于细胞对细胞比较检查的细胞的间距。

93. 发明申请

US20080078933A1 Electron Beam Exposure or System Inspection Or Measurement Apparatus And Its Method And Height Detection Apparatus 有权
标题翻译：电子束曝光或系统检测或测量装置及其方法和高度检测装置
公开(公告)号：US20080078933A1
公开(公告)日：2008-04-03
申请号：US11925142
申请日：2007-10-26
申请人： Masahiro WATANABE , Takashi Hiroi , Maki Tanaka , Hiroyuki Shinada , Yasutsugu Usami
发明人： Masahiro WATANABE , Takashi Hiroi , Maki Tanaka , Hiroyuki Shinada , Yasutsugu Usami
IPC分类号： G21K5/04
CPC分类号： H01J37/3174 , B82Y10/00 , B82Y40/00 , H01J37/20 , H01J37/21 , H01J37/222 , H01J37/226 , H01J37/265 , H01J37/28 , H01J37/304 , H01J2237/20235 , H01J2237/20292 , H01J2237/216 , H01J2237/2445 , H01J2237/24578 , H01J2237/2482 , H01J2237/2487 , H01J2237/2814 , H01J2237/2817 , H01J2237/2826 , H01J2237/304 , H01J2237/3175
摘要： A method and apparatus for assessing a height of a specimen includes an electron beam unit having an electron beam source, lenses, a table for setting a specimen and controllable in a height direction, and a detector, and a height detection system for detecting height of the specimen set on the table while the specimen is irradiated by an electron beam. The height detection system further includes an illumination system, a collection system, first and second detectors, a device configured to receive output signals from the first and second detectors while the specimen is irradiated by the electron beam and to generate a comparison signal from the output signals, wherein the comparison signal is responsive to the height of the specimen.
摘要翻译：用于评价试样的高度的方法和装置包括：电子束单元，具有电子束源，透镜，用于设置样本的台面并可在高度方向上控制;以及检测器，以及用于检测高度的高度检测系统样本被放置在桌子上，而样品被电子束照射。高度检测系统还包括照明系统，收集系统，第一和第二检测器，被配置为在样本被电子束照射的同时从第一和第二检测器接收输出信号并从输出产生比较信号的装置信号，其中比较信号响应于样本的高度。

94. 发明申请

US20080067381A1 Semiconductor wafer inspection tool and semiconductor wafer inspection method 失效
标题翻译：半导体晶圆检查工具和半导体晶圆检查方法
公开(公告)号：US20080067381A1
公开(公告)日：2008-03-20
申请号：US11808247
申请日：2007-06-07
申请人： Takashi Hiroi , Kenji Tanimoto , Yuko Sasaki , Hiroshi Makino
发明人： Takashi Hiroi , Kenji Tanimoto , Yuko Sasaki , Hiroshi Makino
IPC分类号： G21K7/00
CPC分类号： H01J37/20 , G01R31/307 , H01J37/222 , H01J37/244 , H01J37/28 , H01J2237/2008 , H01J2237/20235 , H01J2237/20292 , H01J2237/221 , H01J2237/24564 , H01J2237/24592 , H01J2237/28
摘要： A semiconductor wafer inspection tool and a semiconductor wafer inspection method capable of conducting an inspection under appropriate conditions in any one of an NVC (Negative Voltage Contrast) mode and a PVC (Positive Voltage Contrast) mode is provided. Primary electrons 2 are irradiated onto a wafer to be inspected 6 and the irradiation position thereof is scanned in an XY direction. Secondary electrons (or reflected electrons) 10 from the wafer to be inspected 6 are controlled by a charge control electrode 5 and detected by a sensor 11. An image processor converts a detection signal from the sensor 11 to a detected image, compares the detected image with a predetermined reference image, judges defects, an overall control section 14 selects inspection conditions from recipe information for each wafer to be inspected 6 and sets a voltage to be applied to the charge control electrode 5. A Z stage 8 sets the distance between the wafer to be inspected 6 and the charge control electrode 5 according to this voltage.
摘要翻译：提供能够在适当条件下进行NVC（负电压对比度）模式和PVC（正电压对比度）模式中的任一种的半导体晶片检查工具和半导体晶片检查方法。将一次电子2照射到要检查的晶片6上，并且其XY照射位置被扫描。来自待检查晶片的二次电子（或反射电子）10由电荷控制电极5控制，并由传感器11检测。图像处理器将来自传感器11的检测信号转换为检测图像，将检测到的图像与预定参考图像进行比较，判断缺陷，总体控制部14从每个被检查晶片的配方信息中选择检查条件6，施加到充电控制电极5的电压。 Z级8根据该电压设定待检查晶片6与充电控制电极5之间的距离。

95. 发明申请

US20080056559A1 Pattern Inspection Method And Apparatus 有权
标题翻译：图案检验方法及装置
公开(公告)号：US20080056559A1
公开(公告)日：2008-03-06
申请号：US11931856
申请日：2007-10-31
申请人： Takashi Hiroi , Masahiro Watanabe , Chie Shishido , Aritoshi Sugimoto , Maki Tanaka , Hiroshi Miyai , Asahiro Kuni , Yasuhiko Nara
发明人： Takashi Hiroi , Masahiro Watanabe , Chie Shishido , Aritoshi Sugimoto , Maki Tanaka , Hiroshi Miyai , Asahiro Kuni , Yasuhiko Nara
IPC分类号： G06K9/00
CPC分类号： G01N21/9501 , G01N21/956 , G01N2021/8854 , G01N2021/8861 , G01N2021/8864 , G01R31/311 , G03F1/86 , G06T1/0007 , G06T7/0002 , G06T7/001 , G06T2200/24 , G06T2207/10061 , G06T2207/30148 , H01J37/222 , H01J37/265 , H01J37/28 , H01J2237/221 , H01J2237/24592 , H01J2237/28
摘要： An apparatus for processing a defect candidate image, including: a scanning electron microscope for taking an enlarged image of a specimen by irradiating and scanning a converged electron beam onto the specimen and detecting charged particles emanated from the specimen by the irradiation; an image processor for processing the image taken by the scanning electron microscope to detect defect candidates on the specimen and classify the detected defect candidates into one of plural classes; a memory for storing output from the image processor including images of the detected defect candidates; and a display unit which displays information stored in the memory and an indicator, wherein the display unit displays a distribution of the detected and classified defect candidates in a map format by distinguishing by the classified class, and the display unit also displays an image of a defect candidate stored in the memory together with the map which is indicated on the map by the indicator.
摘要翻译：一种用于处理缺陷候选图像的装置，包括：扫描电子显微镜，用于通过照射和扫描聚集的电子束到样品上并通过照射检测从样品发出的带电粒子，从而获取样本的放大图像; 用于处理由扫描电子显微镜拍摄的图像以检测样本上的缺陷候选的图像处理器，并将检测到的缺陷候选分类为多个等级之一; 用于存储来自图像处理器的输出的存储器，包括检测到的缺陷候选的图像; 以及显示单元，其显示存储在存储器中的信息和指示器，其中，所述显示单元通过由所述分类的类区分来以地图格式显示所检测和分类的缺陷候选的分布，并且所述显示单元还显示图像存储在存储器中的缺陷候选者以及由指示符在地图上指示的地图。

96. 发明授权

US07329889B2 Electron beam apparatus and method with surface height calculator and a dual projection optical unit 失效
标题翻译：具有表面高度计算器和双投影光学单元的电子束装置和方法
公开(公告)号：US07329889B2
公开(公告)日：2008-02-12
申请号：US11180672
申请日：2005-07-14
申请人： Masahiro Watanabe , Takashi Hiroi , Maki Tanaka , Hiroyuki Shinada , Yasutsugu Usami
发明人： Masahiro Watanabe , Takashi Hiroi , Maki Tanaka , Hiroyuki Shinada , Yasutsugu Usami
IPC分类号： G01N21/86
CPC分类号： H01J37/3174 , B82Y10/00 , B82Y40/00 , H01J37/20 , H01J37/21 , H01J37/222 , H01J37/226 , H01J37/265 , H01J37/28 , H01J37/304 , H01J2237/20235 , H01J2237/20292 , H01J2237/216 , H01J2237/2445 , H01J2237/24578 , H01J2237/2482 , H01J2237/2487 , H01J2237/2814 , H01J2237/2817 , H01J2237/2826 , H01J2237/304 , H01J2237/3175
摘要： An electron beam apparatus including a table which mounts a specimen and is movable in three dimensional directions, an electron beam optical system irradiating an electron beam onto a specimen and for detecting a secondary electron emanated from the specimen by the irradiation of the electron beam, and a surface height detection system for detecting height of the surface of the specimen mounted on the table. A focus control system controls a relative position between a focus position of the electron optical system and the table in accordance with information of the height, and an image processing system obtains an image from the detected secondary electron and processes the obtained image to detect a defect on the surface of the specimen.
摘要翻译：一种电子束装置，包括安装试件并可在三维方向上移动的工作台，将电子束照射到试样上并通过照射电子束来检测从试样发出的二次电子的电子束光学系统;以及表面高度检测系统，用于检测安装在桌子上的样本的表面的高度。焦点控制系统根据高度信息来控制电子光学系统的焦点位置与桌子之间的相对位置，并且图像处理系统从检测到的二次电子中获取图像并处理所获得的图像以检测缺陷在样品的表面。

97. 发明申请

US20080002876A1 METHOD AND ITS APPARATUS FOR INSPECTING A PATTERN 审中-公开
标题翻译：用于检查图案的方法及其装置
公开(公告)号：US20080002876A1
公开(公告)日：2008-01-03
申请号：US11853500
申请日：2007-09-11
申请人： Takashi Hiroi , Masahiro Watanabe , Maki Tanaka , Asahiro Kuni , Chie Shishido , Hiroshi Miyai , Yasuhiko Nara , Mitsunobu Isobe
发明人： Takashi Hiroi , Masahiro Watanabe , Maki Tanaka , Asahiro Kuni , Chie Shishido , Hiroshi Miyai , Yasuhiko Nara , Mitsunobu Isobe
IPC分类号： G06K9/00
CPC分类号： G06T7/001 , G06T2207/30148
摘要： In a pattern inspecting apparatus, images of places which can be expected to be the same pattern are compared with one another. However, a comparison of images obtained by different stage scans and the occurrence of a place capable of being inspected only once lead to a deterioration in the performance of detecting various error defects and an area incapable of being inspected, respectively. For solving this problem, defects detected in a high sensitivity condition are regarded as defect candidates and a critical threshold value, used as a boundary to detect a smaller value as a defect, of a defect candidate portion is obtained by an image processing circuit or an image of the defect candidate portion is obtained by processing with software. Further, the critical threshold value thus obtained is compared with plural threshold values, thereby permitting plural inspection results to be obtained in a single inspection.
摘要翻译：在图案检查装置中，将可以预期相同图案的位置的图像彼此进行比较。然而，通过不同阶段扫描获得的图像和仅能够被检查的位置的发生的比较分别导致检测各种错误缺陷的性能和不能被检查的区域的劣化。为了解决这个问题，在高灵敏度条件下检测到的缺陷被认为是缺陷候选，并且通过图像处理电路或图像处理电路获得用作检测缺陷候选部分的较小值作为缺陷的边界的临界阈值通过软件处理获得缺陷候选部分的图像。此外，将如此获得的临界阈值与多个阈值进行比较，从而允许在单次检查中获得多个检查结果。

98. 发明授权

US07269280B2 Method and its apparatus for inspecting a pattern 有权
标题翻译：检查图案的方法及其装置
公开(公告)号：US07269280B2
公开(公告)日：2007-09-11
申请号：US10062632
申请日：2002-02-05
申请人： Takashi Hiroi , Masahiro Watanabe , Maki Tanaka , Asahiro Kuni , Chie Shishido , Hiroshi Miyai , Yasuhiko Nara , Mitsunobu Isobe
发明人： Takashi Hiroi , Masahiro Watanabe , Maki Tanaka , Asahiro Kuni , Chie Shishido , Hiroshi Miyai , Yasuhiko Nara , Mitsunobu Isobe
IPC分类号： G06K9/00
CPC分类号： G06T7/001 , G06T2207/30148
摘要： In a pattern inspecting apparatus, images of places which can be expected to be the same pattern are compared with one another. However, a comparison of images obtained by different stage scans and the occurrence of a place capable of being inspected only once lead to a deterioration in the performance of detecting various error defects and an area incapable of being inspected, respectively. For solving this problem, defects detected in a high sensitivity condition are regarded as defect candidates and a critical threshold value, used as a boundary to detect a smaller value as a defect, of a defect candidate portion is obtained by an image processing circuit or an image of the defect candidate portion is obtained by processing with software. Further, the critical threshold value thus obtained is compared with plural threshold values, thereby permitting plural inspection results to be obtained in a single inspection.
摘要翻译：在图案检查装置中，将可以预期相同图案的位置的图像彼此进行比较。然而，通过不同阶段扫描获得的图像和仅能够被检查的位置的发生的比较分别导致检测各种错误缺陷的性能和不能被检查的区域的劣化。为了解决这个问题，在高灵敏度条件下检测到的缺陷被认为是缺陷候选，并且通过图像处理电路或图像处理电路获得用作检测缺陷候选部分的较小值作为缺陷的边界的临界阈值通过软件处理获得缺陷候选部分的图像。此外，将如此获得的临界阈值与多个阈值进行比较，从而允许在单次检查中获得多个检查结果。

99. 发明授权

US07263216B2 Pattern inspecting method and apparatus thereof, and pattern inspecting method on basis of electron beam images and apparatus thereof 有权
标题翻译：图案检查方法和装置，以及基于电子束图像的图案检查方法及其装置
公开(公告)号：US07263216B2
公开(公告)日：2007-08-28
申请号：US10637488
申请日：2003-08-11
申请人： Chie Shishido , Yuji Takagi , Shuji Maeda , Takanori Ninomiya , Takashi Hiroi , Masahiro Watanabe , Hideaki Doi
发明人： Chie Shishido , Yuji Takagi , Shuji Maeda , Takanori Ninomiya , Takashi Hiroi , Masahiro Watanabe , Hideaki Doi
IPC分类号： G06K9/00
CPC分类号： G06T7/001 , G06T5/006 , G06T2207/10061 , G06T2207/30148 , H01J37/226 , H01J37/28 , H01J2237/2448 , H01J2237/24592 , H01J2237/2482 , H01J2237/2806 , H01J2237/2817
摘要： A pattern inspecting method and apparatus for inspecting a defect or defective candidate of patterns on a sample includes picking up an image of a sample by shifting a sampling position on the sample, measuring geometric distortion in an image of a standard sample, beforehand, and defining a size for which the measured geometric distortion is neglectable, obtaining a first image of the sample and a second image to be compared with the first image, dividing the first image and the second stage into images of a division unit having a size not greater than the defined size, comparing a divided image of the first image with a divided image of the second image, and for calculating a difference in gradation values between both of the divided images. The defect or the defect candidate of the sample is extracted in accordance with the difference in the gradation values.
摘要翻译：用于检查样本上的图案的缺陷或缺陷候选的图案检查方法和装置包括：通过移动样本上的采样位置，预先测量标准样本的图像中的几何失真，并定义测量的几何失真可忽略的尺寸，获得样本的第一图像和要与第一图像比较的第二图像，将第一图像和第二阶段划分为尺寸不大于的尺寸的分割单元的图像定义的尺寸，将第一图像的分割图像与第二图像的分割图像进行比较，并且用于计算两个分割图像之间的灰度值差。根据灰度值的差异提取样本的缺陷或缺陷候选。

100. 发明授权

US07260256B2 Method and system for inspecting a pattern 失效
标题翻译：检查图案的方法和系统
公开(公告)号：US07260256B2
公开(公告)日：2007-08-21
申请号：US09571938
申请日：2000-05-16
申请人： Takashi Hiroi , Maki Tanaka , Masahiro Watanabe , Asahiro Kuni , Hiroyuki Shinada , Mari Nozoe , Aritoshi Sugimoto , Chie Shishido
发明人： Takashi Hiroi , Maki Tanaka , Masahiro Watanabe , Asahiro Kuni , Hiroyuki Shinada , Mari Nozoe , Aritoshi Sugimoto , Chie Shishido
IPC分类号： G06K9/00
CPC分类号： G06T7/001 , G06T2207/10056 , G06T2207/30148
摘要： The present invention relates to detection of defects with simple specification of the coordinates, in the inspection of an object having a plurality of patterns in which a portion having the two-dimensional repetition and portions having the repetition only in the X direction and in the Y direction are mixedly present. The cross comparison between a notice point and comparison points, for example which are repetitive pitches away from the notice point, is carried out, and only the portion having the difference which can be found out with any of the comparison points is extracted as a defect candidate, which results in that the portion having the two-dimensional repetition as well as the portion having the repetition only in the X direction or in the Y direction can be inspected. As a result, while the portion, such as an isolated point, having no repetition both in the X direction and in the Y direction is extracted as the defect candidate, the defect candidate is not treated as the defect in the case where the defect candidate of interest occurs regularly in a plurality of objects to be inspected, so that such a defect candidate is excluded to extract only a true defect.
摘要翻译：本发明涉及通过简单的坐标指定来检测缺陷，在检查具有多个图案的物体时，其中具有二维重复的部分和仅在X方向上重复的部分和Y 方向混合存在。执行通知点和比较点之间的交叉比较，例如，距离通知点的重复间距是比较点，并且只有具有任何比较点可以找出的具有差异的部分被提取为缺陷候选，这导致可以检查具有二维重复的部分以及仅在X方向或Y方向上具有重复的部分。结果，虽然提取了在X方向和Y方向上都没有重复的诸如孤立点的部分作为缺陷候选，但是在缺陷候选者的情况下，缺陷候选不被视为缺陷感兴趣的事件定期发生在要检查的多个对象中，因此排除这样的缺陷候选者仅提取真实的缺陷。

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