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91. 发明专利

JP2012039076A Stacked chip package and manufacturing method therefor 有权
标题翻译：堆叠芯片包装及其制造方法
公开(公告)号：JP2012039076A
公开(公告)日：2012-02-23
申请号：JP2011082202
申请日：2011-04-01
申请人： Headway Technologies Inc , Sae Magnetics(H.K.)Ltd , ヘッドウェイテクノロジーズインコーポレイテッド , 新科實業有限公司SAE Magnetics(H.K.)Ltd.
发明人： SASAKI YOSHITAKA , ITO HIROYUKI , IKEJIMA HIROSHI , IIJIMA ATSUSHI
IPC分类号： H01L25/065 , H01L25/07 , H01L25/10 , H01L25/11 , H01L25/18
CPC分类号： H01L25/50 , H01L23/5382 , H01L24/01 , H01L25/0657 , H01L2225/06527 , H01L2225/06551 , H01L2924/07802 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To easily change some of a plurality of signals corresponding to semiconductor chips which are on the same layer as that of a plurality of stacked chip packages in every stacked chip package, when the plurality of the stacked chip packages are stacked and electrically connected to each other.SOLUTION: A stacked chip package has a body 2 and a wiring 3 including a plurality of wires W arranged at side faces of the body 2. The body 2 has a plurality of first terminals 4 which are arranged on a top face of a principal part 2M including a plurality of layer parts and are connected to the wiring 3, and a plurality of second terminals 5 which are arranged on a bottom face of the principal part 2M and are connected to the wiring 3. The plurality of the second terminals 5 are arranged at such a position as to overlap on the plurality of the first terminals 4 when viewed in the direction orthogonal to the top face of the body 2M. A plurality of pairs of the first terminals 4 and the second terminals 5 which are electrically connected include a plurality of pairs of the first terminals 4 and the second terminals 5 which are arranged at such a position as not to overlap each other.
摘要翻译：要解决的问题：为了容易地改变与每个堆叠芯片封装中的多个堆叠芯片封装相同的层与半导体芯片相对应的多个信号中的一些，当多个堆叠的芯片封装彼此堆叠并电连接。解决方案：堆叠式芯片封装具有主体2和布线3，布线3包括布置在主体2的侧面的多个布线W.主体2具有多个第一端子4，第一端子4布置在包括多个层部分并连接到布线3的主体部分2M以及布置在主体部分2M的底面上并连接到布线3的多个第二端子5.多个第二部分端子5设置在与主体2M的上表面正交的方向上观察时在多个第一端子4上重叠的位置。电连接的多对第一端子4和第二端子5包括布置在彼此不重叠的位置的多对第一端子4和第二端子5。版权所有（C）2012，JPO＆INPIT

92. 发明专利

JP2012023332A Layered chip package and method of manufacturing same 有权
标题翻译：层状芯片包装及其制造方法
公开(公告)号：JP2012023332A
公开(公告)日：2012-02-02
申请号：JP2011010371
申请日：2011-01-21
申请人： Headway Technologies Inc , Sae Magnetics (Hk) Ltd , ヘッドウェイテクノロジーズインコーポレイテッド , 新科實業有限公司SAE Magnetics(H.K.)Ltd.
发明人： SASAKI YOSHITAKA , ITO HIROYUKI , IKEJIMA HIROSHI , IIJIMA ATSUSHI
IPC分类号： H01L25/065 , H01L23/52 , H01L25/07 , H01L25/18
CPC分类号： H01L23/522 , H01L21/563 , H01L21/6835 , H01L23/544 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/24 , H01L24/25 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/82 , H01L24/83 , H01L24/92 , H01L24/94 , H01L24/95 , H01L24/96 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L25/50 , H01L2221/68327 , H01L2223/54406 , H01L2223/54433 , H01L2223/54453 , H01L2224/0231 , H01L2224/02311 , H01L2224/02313 , H01L2224/02321 , H01L2224/02371 , H01L2224/02375 , H01L2224/02379 , H01L2224/02381 , H01L2224/0239 , H01L2224/0345 , H01L2224/0346 , H01L2224/0401 , H01L2224/04026 , H01L2224/05008 , H01L2224/05644 , H01L2224/05647 , H01L2224/1146 , H01L2224/13144 , H01L2224/16148 , H01L2224/24011 , H01L2224/24146 , H01L2224/245 , H01L2224/2746 , H01L2224/29111 , H01L2224/29144 , H01L2224/2919 , H01L2224/32148 , H01L2224/81121 , H01L2224/8113 , H01L2224/81191 , H01L2224/81193 , H01L2224/81203 , H01L2224/81815 , H01L2224/82005 , H01L2224/821 , H01L2224/82101 , H01L2224/82106 , H01L2224/83005 , H01L2224/8313 , H01L2224/83191 , H01L2224/83193 , H01L2224/83203 , H01L2224/83815 , H01L2224/8385 , H01L2224/9202 , H01L2224/92244 , H01L2224/94 , H01L2224/95001 , H01L2224/96 , H01L2224/97 , H01L2225/06551 , H01L2225/06565 , H01L2225/1058 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01037 , H01L2924/0105 , H01L2924/01058 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2224/81 , H01L2224/83 , H01L2224/82 , H01L2924/00 , H01L2221/68304
摘要： PROBLEM TO BE SOLVED: To provide a package that can achieve a function equal to the case where the package does not include a semiconductor chip that does not function normally even if the package includes such a semiconductor chip that does not function normally.SOLUTION: A layered chip package 1 includes a main body 2 and wiring 3, the wiring 3 including a plurality of wires W disposed on a side surface 2c of the main body 2. The main body 2 includes a main part 2M including a plurality of layer portions 10 and a plurality of terminals 4 that are disposed on at least either one of the upper or lower surface of the main part 2M and are connected with a plurality of wires W. Each of the layer portions 10 includes a semiconductor chip, and a plurality of electrodes 32 that are electrically connected to the plurality of wires W. The plurality of electrodes 32 include a plurality of first electrodes 32A that are intended to establish electrical connection to the semiconductor chip, and a plurality of second electrodes 32B that are not in contact with the semiconductor chip. In at least one of the layer portions 10, the plurality of first electrodes 32A are in contact with and electrically connected to the semiconductor chip.
摘要翻译：要解决的问题：为了提供能够实现与包装不包括半功率正常的半导体芯片的情况相同的功能的封装，即使封装包括不能正常工作的这种半导体芯片。解决方案：层叠芯片封装1包括主体2和布线3，布线3包括设置在主体2的侧表面2c上的多根布线W.主体2包括主体2，主体2包括多个层部分10和多个端子4，其设置在主要部分2M的上表面或下表面中的至少一个上，并且与多条导线W连接。每个层部分10包括半导体多个电极32与多个电线W电连接。多个电极32包括用于建立与半导体芯片的电连接的多个第一电极32A和多个第二电极32B 不与半导体芯片接触。在层部10中的至少一个中，多个第一电极32A与半导体芯片接触并电连接。版权所有（C）2012，JPO＆INPIT

93. 发明专利

JP2012022768A Heat-assisted magnetic recording head and manufacturing method thereof 有权
标题翻译：热辅助磁记录头及其制造方法
公开(公告)号：JP2012022768A
公开(公告)日：2012-02-02
申请号：JP2011157797
申请日：2011-07-19
申请人： Headway Technologies Inc , ヘッドウェイテクノロジーズインコーポレイテッド
发明人： YUCHEN ZHOU , JIN XUHUI , TAKANO KENICHI , MORIS DOVEK , TOBIAS MALESKI , SCHRECK ERHARD , JOE SMITH
IPC分类号： G11B5/31 , G11B5/02
CPC分类号： G11B5/314 , G11B5/1278 , G11B5/3116 , G11B5/6088 , G11B2005/0021
摘要： PROBLEM TO BE SOLVED: To provide a TAMR head suitable for high density recording.SOLUTION: A TAMR head of the present invention comprises a main magnetic pole layer, an optical waveguide, a plasmon antenna and a magnetic layer. The main magnetic pole layer generates a recording magnetic field extending into a magnetic recording medium during a recording operation. The plasmon antenna comprises a magnetic core for forming a first side face facing the main magnetic pole layer and a plasmon generating layer which converges toward a pointed end which covers the magnetic core and faces the optical waveguide and generates a second and a third side faces. The plasmon generating layer generates an edge plasmon mode near the pointed end when associated with the electromagnetic radiation from the optical waveguide. The magnetic layer is magnetically connected to the magnetic core and is positioned between the plasmon generating layer and an air bearing surface. The magnetic layer guides the magnetic flux from the main magnetic pole layer and the energy of the edge plasmon mode to a local region in the magnetic recording medium and the local region is heated to reduce the coercive force and the magnetic anisotropy.
摘要翻译：要解决的问题：提供适合于高密度记录的TAMR头。解决方案：本发明的TAMR头包括主磁极层，光波导，等离子体激元和磁性层。主磁极层在记录操作期间产生延伸到磁记录介质中的记录磁场。等离子体激元天线包括用于形成面对主磁极层的第一侧面的磁芯和等离子体发生层，该等离子体发生层朝向覆盖磁芯并朝向光波导的尖端会聚并产生第二和第三侧面。当与来自光波导的电磁辐射相关联时，等离子体激元产生层在尖端附近产生边缘等离子体模式。磁性层磁性地连接到磁芯并位于等离子体发生层和空气轴承表面之间。磁性层将来自主磁极层的磁通量和边缘等离子体模式的能量引导到磁记录介质中的局部区域，并且加热局部区域以降低矫顽力和磁各向异性。版权所有（C）2012，JPO＆INPIT

94. 发明专利

JP2011238345A Thermally assisted magnetic recording head and thermally assisted magnetic recording method 有权
标题翻译：热辅助磁记录头和热辅助磁记录方法
公开(公告)号：JP2011238345A
公开(公告)日：2011-11-24
申请号：JP2011106276
申请日：2011-05-11
申请人： Headway Technologies Inc , ヘッドウェイテクノロジーズインコーポレイテッド
发明人： TAKANO KENICHI , JOE SMITH , SCHRECK ERHARD
IPC分类号： G11B5/31 , G11B5/02
CPC分类号： G11B5/3116 , G11B5/1278 , G11B5/314 , G11B2005/0021
摘要： PROBLEM TO BE SOLVED: To provide a TAMR head capable of improving recording density.SOLUTION: A TAMR head includes: a main magnetic pole 21 that extends vertically with respect to a recording surface of magnetic recording media and has a reading surface 21LS flattened so as to be perpendicular to the recording surface; and a plasmon generator provided in parallel to the reading surface 21LS with an interval of a first distance. The main magnetic pole 21 has an ABS that extends up to an edge 21EG at a second distance of 50 nm or smaller from the reading surface 21LS. The main magnetic pole 21 has a trailing surface 21TS that moves away from the recording surface with an angle of 30 degrees or more and 70 degrees or less with respect to the ABS from the edge 21EG.
摘要翻译：要解决的问题：提供能够提高记录密度的TAMR头。解决方案：TAMR头包括：主磁极21，其相对于磁记录介质的记录表面垂直延伸，并且具有与记录表面垂直的读取表面21LS平坦化; 以及以第一距离的间隔平行于读取表面21LS设置的等离子体激元发生器。主磁极21具有从读取面21LS向第二距离延伸到边缘21EG的距离为50nm以下的ABS。主磁极21具有相对于ABS从边缘21EG以30度以上且70度以下的角度离开记录面的后表面21TS。版权所有（C）2012，JPO＆INPIT

95. 发明专利

JP2011151365A Method of manufacturing layered chip package 有权
标题翻译：制造分层芯片包装的方法
公开(公告)号：JP2011151365A
公开(公告)日：2011-08-04
申请号：JP2010256977
申请日：2010-11-17
申请人： Headway Technologies Inc , Sae Magnetics (Hk) Ltd , ヘッドウェイテクノロジーズインコーポレイテッド , 新科實業有限公司SAE Magnetics(H.K.)Ltd.
发明人： SASAKI YOSHITAKA , ITO HIROYUKI , IIJIMA ATSUSHI
IPC分类号： H01L25/10 , H01L25/11 , H01L25/18
CPC分类号： H01L21/76898 , H01L21/563 , H01L21/6835 , H01L23/544 , H01L24/02 , H01L24/24 , H01L24/25 , H01L24/29 , H01L24/32 , H01L24/74 , H01L24/82 , H01L24/83 , H01L24/92 , H01L24/94 , H01L24/95 , H01L24/96 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2221/68327 , H01L2223/54406 , H01L2223/54433 , H01L2223/54453 , H01L2224/02311 , H01L2224/02313 , H01L2224/02321 , H01L2224/02371 , H01L2224/02375 , H01L2224/02379 , H01L2224/02381 , H01L2224/0239 , H01L2224/24011 , H01L2224/24145 , H01L2224/24146 , H01L2224/245 , H01L2224/2919 , H01L2224/32148 , H01L2224/82005 , H01L2224/821 , H01L2224/82101 , H01L2224/82106 , H01L2224/83005 , H01L2224/8385 , H01L2224/9202 , H01L2224/92244 , H01L2224/94 , H01L2224/95001 , H01L2224/96 , H01L2224/97 , H01L2225/06551 , H01L2225/06565 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2224/82 , H01L2924/00 , H01L2221/68304
摘要： PROBLEM TO BE SOLVED: To inexpensively mass-produce a layered chip package arranged with wiring on a side surface of a body in a short time. SOLUTION: The layered chip package includes a body, and wiring including a plurality of wires disposed on a side surface of the body. The body includes a plurality of stacked semiconductor chips, and a plurality of electrodes that electrically connect the semiconductor chips to the wires. The method of manufacturing the layered chip package includes steps of: fabricating a fundamental structure 120 that includes a plurality of arranged pre-separation bodies 2P and a plurality of holes formed between two adjacent pre-separation bodies 2P for accommodating a plurality of preliminary wires 143; forming the preliminary wires 143 in the plurality of holes by a plating method; and cutting the fundamental structure 120 so that the plurality of pre-separation bodies 2P are separated from one another and the preliminary wires 143 are split into two sets of wires of two different bodies. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了在短时间内廉价地大量生产在身体的侧表面上布置有布线的层状芯片封装。解决方案：层状芯片封装包括主体，以及包括布置在主体的侧表面上的多根导线的布线。主体包括多个堆叠的半导体芯片，以及将半导体芯片电连接到导线的多个电极。制造层状芯片封装的方法包括以下步骤：制造基本结构120，其包括多个布置的预分离体2P和在两个相邻的预分离体2P之间形成的多个孔，用于容纳多条初级线143 ; 通过电镀法在多个孔中形成预备线143; 并且切割基本结构120，使得多个预分离体2P彼此分离，并且预备线143被分成两组不同的主体的两组线。版权所有（C）2011，JPO＆INPIT

96. 发明专利

JP2011146729A Magnetic tunnel junction element 有权
标题翻译：磁性隧道结构元件
公开(公告)号：JP2011146729A
公开(公告)日：2011-07-28
申请号：JP2011041736
申请日：2011-02-28
申请人： Applied Spintronics Inc , Headway Technologies Inc , アプライドスピントロニクスインコーポレイテッドApplied Spintronics Inc. , ヘッドウェイテクノロジーズインコーポレイテッド
发明人： HORNG CHENG TZONG , HONG LIUBO , TONG RU-YING , CHEN YU-HSIA
IPC分类号： G11B5/39 , H01L43/08 , G11C11/15 , G11C11/16 , H01F10/30 , H01F10/32 , H01F41/18 , H01F41/30 , H01L21/8246 , H01L27/105 , H01L43/10 , H01L43/12
CPC分类号： B82Y25/00 , B82Y40/00 , G11C11/161 , H01F10/30 , H01F10/3272 , H01F10/3295 , H01F41/307 , H01L43/08 , H01L43/12
摘要： PROBLEM TO BE SOLVED: To provide a magnetic tunnel junction element exerting a better magnetization characteristic, coping with the need for high recording density and high integration, and having a high reliability. SOLUTION: An MTJ (magnetic tunnel junction) element includes in sequence: a lower magnetic shield layer 110 including NiFe and performing as a base body having a planarized upper surface; a covering layer 125 including Ta and with its surface layer made amorphous by a sputter etching process; a seed layer 140; a pinning layer 50; a pinned layer 60; a tunnel barrier layer 70 with an Al film oxidation treated; a magnetization free layer 80; a cap layer 90; and an upper magnetic shield layer 100 including NiFe and to be a current pathway for passing sense current in the direction orthogonal to a lamination layer together with the lower magnetic shield layer 110. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供具有更好的磁化特性的磁性隧道结元件，以应对高记录密度和高集成度的需要，并且具有高可靠性。解决方案：MTJ（磁性隧道结）元件依次包括：包括NiFe的下磁屏蔽层110，并且作为具有平坦化的上表面的基体执行; 包括Ta的覆盖层125，并且其表面层通过溅射蚀刻工艺制成非晶体; 种子层140; 钉扎层50; 钉扎层60; 具有Al膜氧化处理的隧道势垒层70; 无磁化层80; 盖层90; 以及包含NiFe的上磁屏蔽层100，并且作为用于使传感电流与下磁屏蔽层110一起在与层叠层正交的方向上通过的电流通路。（C）2011，JPO＆INPIT

97. 发明专利

JP2011134428A Heat-assisted magnetic recording head with internal mirror 有权
标题翻译：热辅助磁记录头与内镜
公开(公告)号：JP2011134428A
公开(公告)日：2011-07-07
申请号：JP2010161422
申请日：2010-07-16
申请人： Headway Technologies Inc , ヘッドウェイテクノロジーズインコーポレイテッド
发明人： ARAKI HIRONORI , SASAKI YOSHITAKA , ITO HIROYUKI , TANEMURA SHIGEKI , ISHIZAKI KAZUO , HORINAKA TAKEHIRO
IPC分类号： G11B5/31
CPC分类号： G11B5/314 , G11B5/6088 , G11B2005/001 , G11B2005/0021 , Y10T29/49032
摘要： PROBLEM TO BE SOLVED: To prevent reduction in utilizing efficiency of light caused by an internal mirror. SOLUTION: A heat-assisted magnetic recording head has an internal mirror 30 that includes a reflecting film support body 27 and a reflecting film 35. The internal mirror 30 reflects light that comes from above a waveguide 26 so that the reflected light travels through the waveguide 26 toward a medium facing surface. The reflecting film support body 27 includes first and second inclined surfaces 272a and 272b. The reflecting film 35 includes first and second portions 351 and 352 that are located on the first and second inclined surfaces 272a and 272b, respectively. The step of forming the reflecting film support body 27 includes two-taper etching for an initial support body. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了防止由内部反射镜引起的光的利用效率的降低。解决方案：热辅助磁记录头具有包括反射膜支撑体27和反射膜35的内反射镜30.内反射镜30反射来自波导26上方的光，使得反射光行进通过波导26朝向面向介质的表面。反射膜支撑体27包括第一和第二倾斜表面272a和272b。反射膜35包括分别位于第一和第二倾斜表面272a和272b上的第一和第二部分351和352。形成反射膜支撑体27的步骤包括用于初始支撑体的双锥度蚀刻。版权所有（C）2011，JPO＆INPIT

98. 发明专利

JP2011097009A Composite layered chip package and method of manufacturing the same 有权
标题翻译：复合层状芯片包装及其制造方法
公开(公告)号：JP2011097009A
公开(公告)日：2011-05-12
申请号：JP2010109889
申请日：2010-05-12
申请人： Headway Technologies Inc , Sae Magnetics (Hk) Ltd , ヘッドウェイテクノロジーズインコーポレイテッド , 新科實業有限公司SAE Magnetics(H.K.)Ltd.
发明人： SASAKI YOSHITAKA , ITO HIROYUKI , IKEJIMA HIROSHI , IIJIMA ATSUSHI
IPC分类号： H01L25/065 , H01L25/07 , H01L25/10 , H01L25/11 , H01L25/18
CPC分类号： H01L24/96 , H01L21/6835 , H01L23/3171 , H01L24/06 , H01L24/16 , H01L24/25 , H01L24/29 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2221/68359 , H01L2224/0401 , H01L2224/04105 , H01L2224/05553 , H01L2224/05647 , H01L2224/12105 , H01L2224/13099 , H01L2224/18 , H01L2224/32145 , H01L2224/73267 , H01L2224/92244 , H01L2225/06513 , H01L2225/06551 , H01L2225/1035 , H01L2225/1064 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/078 , H01L2924/07802 , H01L2924/14 , H01L2924/18162 , H01L2924/30105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a layered chip package having functions equal to those of a layered chip package that does not include a semiconductor chip which does not operate normally even when including a semiconductor chip which does not operate normally. SOLUTION: A composite layered chip package 1 includes stacked subpackages 1A, 1B. Each of the stacked subpackage 1A, 1B includes a body 2, and wiring 3 disposed on a side of the body 2. The body 2 has a main part 2M that includes at least one first-type layer portion 10A. The body 2 of the lower subpackage has a plurality of first terminals 4 that are arranged on the upper surface of the main part 2M, while the body 2 of the upper subpackage has a plurality of second terminals that are arranged on the lower surface of the main part 2M. The main part 2M of at least one of the subpackages includes at least one second-type layer portion 10B. The layer portion 10A includes a conforming semiconductor chip, while the layer portion 10B includes a defective semiconductor chip. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有与不包括不能正常工作的半导体芯片的分层芯片封装的功能相同的分层芯片封装，即使当包括不正常工作的半导体芯片时。解决方案：复合分层芯片封装1包括堆叠的子封装1A，1B。堆叠的子组件1A，1B中的每一个包括主体2和布置在主体2的侧面上的布线3.主体2具有包括至少一个第一类型部分10A的主要部分2M。下部分组件的主体2具有设置在主体部2M的上表面上的多个第一端子4，上部副部件的主体2具有多个第二端子，该第二端子配置在主要部分2M。至少一个子包的主要部分2M包括至少一个第二类型层部分10B。层部分10A包括一致的半导体芯片，而层部分10B包括有缺陷的半导体芯片。版权所有（C）2011，JPO＆INPIT

99. 发明专利

JP2011023104A Method for forming recording magnetic pole 有权
标题翻译：形成记录磁场的方法
公开(公告)号：JP2011023104A
公开(公告)日：2011-02-03
申请号：JP2010163310
申请日：2010-07-20
申请人： Headway Technologies Inc , ヘッドウェイテクノロジーズインコーポレイテッド
发明人： CHEN CHAO-PENG , CHUDASAMA JAS , LAM SITUAN , RIN KENRITSU
IPC分类号： G11B5/31
CPC分类号： C25D5/022 , C25D5/18 , C25D7/001 , G11B5/1278 , G11B5/3116 , G11B5/3163
摘要： PROBLEM TO BE SOLVED: To provide a method for forming a recording magnetic pole, which prevents a void from being generated in forming the recording magnetic pole using electroplating. SOLUTION: In order to form a recording pole of a perpendicular magnetic recording head, a mold forming layer is first formed on a base, and an opening is formed in the mold forming layer. After formation of a seed layer in the opening, an auxiliary layer is formed on the seed layer. The base including the seed layer and the auxiliary layer formed in the opening is dipped in an electroplating solution, and activated by supplying a current or a voltage to the electroplating solution to remove the auxiliary layer. In the electroplating solution used for removing the auxiliary layer, an electroplated film of a magnetic material is grown in the opening by using electroplating. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于形成记录磁极的方法，其防止在使用电镀形成记录磁极时产生空隙。解决方案：为了形成垂直磁记录头的记录极，首先在基底上形成模具形成层，并且在成型层中形成开口。在开口中形成种子层之后，在种子层上形成辅助层。将包括种子层和在开口中形成的辅助层的基底浸入电镀溶液中，并通过向电镀溶液提供电流或电压以除去辅助层而被激活。在用于去除辅助层的电镀溶液中，通过使用电镀在开口中生长磁性材料的电镀膜。版权所有（C）2011，JPO＆INPIT

100. 发明专利

JP2011023093A Heat-assisted magnetic recording head with laser diode fixed to slider 有权
标题翻译：热辅助磁记录头，激光二极管固定在滑块上
公开(公告)号：JP2011023093A
公开(公告)日：2011-02-03
申请号：JP2010019274
申请日：2010-01-29
申请人： Headway Technologies Inc , ヘッドウェイテクノロジーズインコーポレイテッド
发明人： SASAKI YOSHITAKA , ITO HIROYUKI , TANEMURA SHIGEKI , ARAKI HIRONORI
IPC分类号： G11B5/31 , G11B5/02 , G11B5/60
CPC分类号： G11B5/314 , G11B5/4866 , G11B2005/001 , G11B2005/0021
摘要： PROBLEM TO BE SOLVED: To provide a heat-assisted magnetic recording head that allows easy alignment of laser light with a waveguide while using an edge-emitting laser diode as the light source for emitting light that is used for generating near-field light.
SOLUTION: A heat-assisted magnetic recording head 200 includes a slider 201, an edge-emitting laser diode 202 fixed to the slider 201, and an external mirror 203 provided outside the slider 201. The slider 201 includes a magnetic pole, a waveguide, a near-field light generating element, and a substrate. The laser diode 202 includes: an active layer; an emitting end face that lies at an end in a direction parallel to the plane of the active layer and includes an emission part for emitting laser light; and a bottom surface that lies at an end in a direction perpendicular to the plane of the active layer. The laser diode is arranged so that the bottom surface faces the top surface 201c of the slider 201. The external mirror 203 reflects the laser light emitted from the emission part toward the waveguide.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种热辅助磁记录头，其允许在使用边缘发射激光二极管作为用于发射近场的光的光源时容易地对准激光与波导光。解决方案：热辅助磁记录头200包括滑块201，固定到滑块201的边缘发射激光二极管202和设置在滑块201外部的外部反射镜203.滑块201包括磁极，波导，近场光产生元件和衬底。激光二极管202包括：有源层; 位于与有源层的平面平行的方向上的端部的发射端面，并且包括用于发射激光的发射部分; 以及位于与有源层的平面垂直的方向上的端部的底表面。激光二极管被布置成使得底表面面向滑块201的顶表面201c。外反射镜203将从发射部分发射的激光朝向波导反射。版权所有（C）2011，JPO＆INPIT

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