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    • 5. 发明申请
    • THIN FILM TRANSISTOR AND MANUFACTURING METHOD THEREOF
    • 薄膜晶体管及其制造方法
    • US20090261330A1
    • 2009-10-22
    • US12424557
    • 2009-04-16
    • Shunpei YAMAZAKIYasuhiro JINBO
    • Shunpei YAMAZAKIYasuhiro JINBO
    • H01L29/786H01L21/336
    • H01L27/127C23C16/0272C23C16/24H01L27/1214H01L27/1288H01L29/04H01L29/41733H01L29/66765H01L29/78621H01L29/78669H01L29/78678H01L29/78696
    • It is an object to control quality of a microcrystalline semiconductor film or a semiconductor film including crystal grains so that operation characteristics of a semiconductor element typified by a TFT can be improved. It is another object to improve characteristics of a semiconductor element typified by a TFT by controlling a deposition process of a microcrystalline semiconductor film or a semiconductor film including crystal grains. In addition, it is another object to increase on-state current of a thin film transistor and to reduce off-state current of the thin film transistor. In a semiconductor layer including a plurality of crystalline regions in an amorphous structure, generation positions and generation density of crystal nuclei from which the crystalline regions start to grow are controlled, whereby quality of the semiconductor layer is controlled. In addition, after generation of crystal nuclei from which the crystalline regions start to grow in the semiconductor layer, an impurity element serving as a donor is added to the semiconductor layer, whereby crystallinity of the semiconductor layer is increased and the resistivity of the semiconductor layer is reduced.
    • 本发明的目的是控制微晶半导体膜或包含晶粒的半导体膜的质量,从而可以提高由TFT代表的半导体元件的工作特性。 另一个目的是通过控制微晶半导体膜或包括晶粒的半导体膜的沉积工艺来改善由TFT代表的半导体元件的特性。 此外,另一个目的是增加薄膜晶体管的导通电流并且减小薄膜晶体管的截止电流。 在包括非晶结构中的多个结晶区域的半导体层中,控制晶体区域开始生长的晶核的产生位置和发生密度,从而控制半导体层的质量。 此外,在半导体层中产生结晶区域开始生长的晶核之后,在半导体层中添加用作施主的杂质元素,由此半导体层的结晶度增加,半导体层的电阻率 降低了。
    • 6. 发明申请
    • THIN FILM TRANSISTOR, AND DISPLAY DEVICE HAVING THE THIN FILM TRANSISTOR
    • 薄膜晶体管和具有薄膜晶体管的显示器件
    • US20090114921A1
    • 2009-05-07
    • US12258569
    • 2008-10-27
    • Shunpei YAMAZAKIYasuhiro JINBO
    • Shunpei YAMAZAKIYasuhiro JINBO
    • H01L29/04
    • H01L29/4908H01L29/04H01L29/66765H01L29/78609H01L29/78678H01L29/78696
    • The thin film transistor includes a gate insulating film formed over a gate electrode; a microcrystalline semiconductor film including an impurity element which serves as a donor, formed over the gate insulating film; a pair of buffer layers formed over the microcrystalline semiconductor film; a pair of semiconductor films to which an impurity element imparting one conductivity type is added, formed over the pair of buffer layers; and wirings formed over the pair of semiconductor films to which an impurity element imparting one conductivity type is added. The concentration of the impurity element which serves as a donor in the microcrystalline semiconductor film is decreased from the gate insulating film side toward the buffer layers, and the buffer layers do not include the impurity element which serves as a donor at a higher concentration than the detection limit of SIMS.
    • 薄膜晶体管包括形成在栅电极上的栅极绝缘膜; 包括形成在所述栅极绝缘膜上的用作供体的杂质元素的微晶半导体膜; 形成在所述微晶半导体膜上的一对缓冲层; 在一对缓冲层上形成一对添加有赋予一种导电类型的杂质元素的半导体膜; 并且在添加有赋予一种导电类型的杂质元素的一对半导体膜上形成的布线。 作为微晶半导体膜中的供体的杂质元素的浓度从栅极绝缘膜侧朝向缓冲层减少,缓冲层不包含作为供体的杂质元素,其浓度高于 SIMS检测限。