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    • 1. 发明专利
    • Led lamp
    • 点灯
    • JP2012064805A
    • 2012-03-29
    • JP2010208430
    • 2010-09-16
    • Toshiba CorpToshiba Materials Co Ltd東芝マテリアル株式会社株式会社東芝
    • AOKI KATSUAKI
    • H01L33/48H01L33/50
    • PROBLEM TO BE SOLVED: To provide an LED lamp enabling an user to select the luminescent color (a light emission spectrum), an orientation angle (directivity) of light, and lamp design, according to a preference of the user or a use place, in one lamp body.SOLUTION: An LED lamp comprises: a substrate 7; an LED module 2 having an LED chip 8 mounted on the substrate 7; a base body portion 3 on which the LED module 2 is installed; a globe 4a attached to the base body portion 3 so as to cover the LED module 2 with a space; a fluorescent film 9 provided on an inner surface of the globe 4a while separated from the LED chip 8, and absorbing ultraviolet or violet light emitted from the LED chip 8 to emit visible light; a lighting circuit 11 provided in the base body portion 3, and lighting the LED chip 8; and an attaching/detaching mechanism 12 having a mouthpiece 6 electrically connected with the lighting circuit 11, and making the globe 4a and the base body portion 3a attachable and detachable.
    • 要解决的问题:提供一种LED灯,其使得用户能够根据用户的偏好或者一个或多个选择来选择发光颜色(发光光谱),光的取向角(方向性)和灯设计 使用场所,在一个灯体内。 解决方案:LED灯包括:基板7; 具有安装在基板7上的LED芯片8的LED模块2; 安装有LED模块2的基体部3; 附接到基体部分3以以空间覆盖LED模块2的球形体4a; 在与LED芯片8分离的同时设置在灯泡4a的内表面上的荧光膜9,吸收从LED芯片8发出的发出可见光的紫外线或紫色光; 设置在基体部3内的照明电路11,点亮LED芯片8; 以及安装/拆卸机构12,其具有与照明电路11电连接的接口管6,并且使得灯罩4a和基座部分3a可拆卸。 版权所有(C)2012,JPO&INPIT
    • 3. 发明专利
    • Manufacturing method of semiconductor device
    • 半导体器件的制造方法
    • JP2008244144A
    • 2008-10-09
    • JP2007082551
    • 2007-03-27
    • Toshiba Corp株式会社東芝
    • AOKI KATSUAKIKATSUMATA YUTAKAUNOSAWA KEISUKE
    • H01L21/3065
    • H01L21/76816H01L21/31116
    • PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device, capable of forming a hole or a groove having a desired shape in an etching process.
      SOLUTION: The manufacturing method of a semiconductor device enables to form a first hole and a second hole having an aspect ratio lower than that of the first hole on an insulating film formed on a semiconductor substrate. The manufacturing method includes executing a first etching processing for etching the insulating film and a second etching processing for etching the insulating film under a condition where the speed of depositing a deposited layer to be formed on the surface of the insulating film is lower than the speed of the first etching processing.
      COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:提供能够在蚀刻工艺中形成具有期望形状的孔或凹槽的半导体器件的制造方法。 解决方案:半导体器件的制造方法能够形成在半导体衬底上形成的绝缘膜上具有比第一孔低的纵横比的第一孔和第二孔。 该制造方法包括执行用于蚀刻绝缘膜的第一蚀刻处理和用于在绝缘膜的表面上沉积形成的沉积层的速度低于速度的条件下蚀刻绝缘膜的第二蚀刻处理 的第一次蚀刻处理。 版权所有(C)2009,JPO&INPIT
    • 4. 发明专利
    • Dye-sensitized solar cell
    • 透明的太阳能电池
    • JP2013012474A
    • 2013-01-17
    • JP2012126576
    • 2012-06-01
    • Toshiba Corp株式会社東芝Toshiba Materials Co Ltd東芝マテリアル株式会社
    • SASAKI RYOTOAOKI KATSUAKIHAYASE SHUJI
    • H01M14/00H01L31/04
    • Y02E10/542
    • PROBLEM TO BE SOLVED: To provide a dye-sensitized solar cell which is excellent in power generation efficiency and has a power storage effect.SOLUTION: The dye-sensitized solar cell has a structure having a transparent electrode layer on a transparent substrate, a first semiconductor layer which has titanium oxide powder having an average particle diameter of 500 nm or less and a dye, a second semiconductor layer which has tungsten oxide powder having an average particle diameter of 548 nm or less and a dye, an electrolyte composition and a counter electrode having a conductive catalyst layer, which are sequentially laminated, as a cell structure. The first semiconductor layer and the second semiconductor layer can be laminated in a reverse order.
    • 解决问题:提供发电效率优异并具有蓄电效果的染料敏化太阳能电池。 解决方案:染料敏化太阳能电池具有在透明基板上具有透明电极层的结构,具有平均粒径为500nm以下的氧化钛粉末的第一半导体层和染料,第二半导体 作为细胞结构,将具有平均粒径为548nm以下的氧化钨粉末和依次层叠的染料,电解质组合物和具有导电性催化剂层的对置电极层。 可以以相反的顺序层叠第一半导体层和第二半导体层。 版权所有(C)2013,JPO&INPIT
    • 5. 发明专利
    • Method for manufacturing semiconductor device, semiconductor manufacturing apparatus, and semiconductor device
    • 制造半导体器件的方法,半导体器件制造设备和半导体器件
    • JP2008109071A
    • 2008-05-08
    • JP2007070033
    • 2007-03-19
    • Toshiba Corp株式会社東芝
    • KATSUMATA YUTAKAAOKI KATSUAKI
    • H01L21/3065
    • H01L21/31144
    • PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device for adjusting such a deposited state as the deposition quantity or distribution of reaction products, and for adjusting the dimension of line width or in-wafer surface uniformity, and to provide a semiconductor manufacturing apparatus. SOLUTION: This method for manufacturing a semiconductor device includes: successively and selectively dry-etching a thin film arranged on a wafer in a chamber 9; selectively etching a first thin film arranged on the wafer; and removing at least part of reaction products deposited on a member in the chamber facing the wafer by the etching to cause the distribution state of the deposited reaction products to get closer to a uniform state; and then selectively etching a second film. COPYRIGHT: (C)2008,JPO&INPIT
    • 解决的问题:提供一种用于调整作为反应产物的沉积量或分布的沉积状态的半导体器件的制造方法,以及用于调整线宽或晶片内表面均匀性的尺寸,以及 提供半导体制造装置。 解决方案:用于制造半导体器件的方法包括:依次和选择性地干蚀刻设置在腔室9中的晶片上的薄膜; 选择性地蚀刻布置在晶片上的第一薄膜; 以及通过蚀刻去除沉积在面向晶片的腔室中的构件上的反应产物的至少一部分,以使沉积的反应产物的分布状态更接近均匀的状态; 然后选择性地蚀刻第二膜。 版权所有(C)2008,JPO&INPIT
    • 8. 发明专利
    • Led lamp
    • 点灯
    • JP2012064471A
    • 2012-03-29
    • JP2010208431
    • 2010-09-16
    • Toshiba CorpToshiba Materials Co Ltd東芝マテリアル株式会社株式会社東芝
    • AOKI KATSUAKI
    • F21S2/00F21V3/00F21V3/02F21V3/04F21V9/16H01L33/50
    • PROBLEM TO BE SOLVED: To provide an LED lamp endowed with a function of effectively decomposing harmful substance even under indoor visible light of low illuminance.SOLUTION: The LED lamp 1a is provided with an LED module 2 equipped with a substrate 7 and LED chips 8 mounted on the substrate 7, a base body part 3a on which the LED module 2 is installed, a globe 4a attached to the base body part 3a so as to cover the LED module 2 with a space, a fluorescent film 9 fitted on an inner face of the globe 4a separated from the LED chips 8 for emitting white-color light by absorbing ultraviolet or violet color light irradiated from the LED chips 8, a visible-light responsive photocatalyst layer 12 formed on an outer face of the globe 4a, and a lighting circuit 11 fitted inside the base body part 3a for lighting the LED chips 8.
    • 要解决的问题:即使在低照度的室内可见光下,也能够提供具有有效分解有害物质的功能的LED灯。 解决方案:LED灯1a设置有配备有基板7和安装在基板7上的LED芯片8的LED模块2,安装有LED模块2的基体部3a,附接到 基体部分3a以空间覆盖LED模块2,安装在与LED芯片8分离的用于通过吸收紫外线或紫色光照射白色光的LED芯片8的内表面上的荧光膜9 来自LED芯片8,形成在球状体4a的外表面上的可见光响应性光催化剂层12和装配在基体部3a内的照明电路11,用于点亮LED芯片8.版权所有(C) )2012,JPO&INPIT