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1. 发明授权

US08960442B2 Wafer storing container 有权
标题翻译：晶圆储存容器
公开(公告)号：US08960442B2
公开(公告)日：2015-02-24
申请号：US14356852
申请日：2011-11-08
申请人： Takaharu Oyama , Chiaki Matsutori , Tsuyoshi Nagashima , Shuichi Inoue , Hiroyuki Shida , Hiroki Yamagishi , Kazumasa Onuki
发明人： Takaharu Oyama , Chiaki Matsutori , Tsuyoshi Nagashima , Shuichi Inoue , Hiroyuki Shida , Hiroki Yamagishi , Kazumasa Onuki
IPC分类号： B65D85/48 , H01L21/673
CPC分类号： H01L21/67383 , H01L21/67386 , Y10S206/832
摘要： Wafer support shelves (10, 10) are each provided with wafer support projections (A, B1, B2) on which parts of the outer margins of a semiconductor wafer (W) are to be placed. In each case, one of the support projections (A, B1, B2) is provided on the far side of the center position of the semiconductor wafer (W), and two of the support projections are provided on the near side of the center of the semiconductor wafer. By means of this structure, in a state in which a lid body (3) is not attached to a wafer extraction/insertion opening (2), the flexure amount of the semiconductor wafers placed on the support projections of multiple locations in the wafer support shelves can be reduced with a minimal number of projections, so that a hindrance is not created to an operation such as extraction by a robot arm.
摘要翻译：晶片支撑架（10,10）各自设置有晶片支撑突起（A，B1，B2），半导体晶片（W）的外边缘的一部分将被放置在其上。在每种情况下，支撑突起（A，B1，B2）中的一个设置在半导体晶片（W）的中心位置的远侧，并且两个支撑突起设置在半导体晶片。通过这种结构，在盖体（3）未安装在晶片拔出/插入口（2）的状态下，放置在晶片支撑体中的多个位置的支撑突起上的半导体晶片的挠曲量可以以最少数量的突起来减少搁架，从而不会对诸如由机器人臂提取的操作产生障碍。

2. 发明授权

US09387960B2 Substrate storing container 有权
标题翻译：基材储存容器
公开(公告)号：US09387960B2
公开(公告)日：2016-07-12
申请号：US14131120
申请日：2012-07-03
申请人： Tsuyoshi Nagashima , Shuichi Inoue , Takaharu Oyama , Chiaki Matsutori , Kazumasa Ohnuki , Hiroyuki Shida , Hiroki Yamagishi
发明人： Tsuyoshi Nagashima , Shuichi Inoue , Takaharu Oyama , Chiaki Matsutori , Kazumasa Ohnuki , Hiroyuki Shida , Hiroki Yamagishi
IPC分类号： B65D43/02 , H01L21/673
CPC分类号： B65D43/02 , H01L21/67373
摘要： A substrate storing container includes: a container body for storing semiconductor wafers; a door that is fitted to the front of the container body; and a locking mechanism locking the door. The locking mechanism includes: a rotary driver that is supported by the door and operated from a cover plate side; and a locking bar that vertically slides as the rotary driver rotates to bring the distal end into, and out of, a locking hollow of the container body. The rotary driver is separated into first and second rotary drivers. The first and second rotary drivers are formed with first and second cam portions, respectively. The first and second cam portions are made to support the proximal end of the locking bar therebetween so that the locking bar can sway in the thickness direction of the door.
摘要翻译：基板收容容器包括：容纳半导体晶片的容器本体; 安装在容器主体前部的门; 以及锁定机构。锁定机构包括：旋转驱动器，其由门支撑并从盖板侧操作; 以及随着旋转驱动器旋转而垂直滑动以使远端进入和离开容器主体的锁定中空的锁定杆。旋转驱动器分离成第一和第二旋转驱动器。第一和第二旋转驱动器分别形成有第一和第二凸轮部分。第一和第二凸轮部分被制成以支撑其间的锁定杆的近端，使得锁定杆可以在门的厚度方向上摆动。

3. 发明申请

US20140138279A1 SUBSTRATE STORING CONTAINER 有权
标题翻译：基座储存容器
公开(公告)号：US20140138279A1
公开(公告)日：2014-05-22
申请号：US14131120
申请日：2012-07-03
申请人： Tsuyoshi Nagashima , Shuichi Inoue , Takaharu Oyama , Chiaki Matsutori , Kazumasa Ohnuki , Hiroyuki Shida , Hiroki Yamagishi
发明人： Tsuyoshi Nagashima , Shuichi Inoue , Takaharu Oyama , Chiaki Matsutori , Kazumasa Ohnuki , Hiroyuki Shida , Hiroki Yamagishi
IPC分类号： B65D43/02
CPC分类号： B65D43/02 , H01L21/67373
摘要： A substrate storing container includes: a container body for storing semiconductor wafers; a door that is fitted to the front of the container body; and a locking mechanism locking the door. The locking mechanism includes: a rotary driver that is supported by the door and operated from a cover plate side; and a locking bar that vertically slides as the rotary driver rotates to bring the distal end into, and out of, a locking hollow of the container body. The rotary driver is separated into first and second rotary drivers. The first and second rotary drivers are formed with first and second cam portions, respectively. The first and second cam portions are made to support the proximal end of the locking bar therebetween so that the locking bar can sway in the thickness direction of the door.
摘要翻译：基板收容容器包括：容纳半导体晶片的容器本体; 安装在容器主体前部的门; 以及锁定机构。锁定机构包括：旋转驱动器，其由门支撑并从盖板侧操作; 以及随着旋转驱动器旋转而垂直滑动以使远端进入和离开容器主体的锁定中空的锁定杆。旋转驱动器分离成第一和第二旋转驱动器。第一和第二旋转驱动器分别形成有第一和第二凸轮部分。第一和第二凸轮部分被制成以支撑其间的锁定杆的近端，使得锁定杆可以在门的厚度方向上摆动。

4. 发明申请

US20110100870A1 SUPPORTING BODY AND SUBSTRATE STORAGE CONTAINER 有权
标题翻译：支撑体和底座储物容器
公开(公告)号：US20110100870A1
公开(公告)日：2011-05-05
申请号：US12997414
申请日：2009-06-12
申请人： Kazumasa Ohnuki , Hiroyuki Shida , Satoshi Odashima
发明人： Kazumasa Ohnuki , Hiroyuki Shida , Satoshi Odashima
IPC分类号： B65D85/00 , H01L21/673 , F16M13/00
CPC分类号： H01L21/67379 , H01L21/67383
摘要： A separate supporting body for supporting semiconductor wafers of φ450 mm is attached to the inner surface of either side wall of a container body. Each supporting body is formed of a front supporting piece that is projected laterally from a frame and horizontally retains the wafer on, at least, the side part in the front peripheral edge; and a rear supporting piece that is projected laterally from frame and horizontally retains the wafer on, at least, the side part in the rear peripheral edge. Front supporting piece is formed of a projected part that extends from the front of frame toward the front peripheral edge of the semiconductor wafer and a curved part that extends rearwards from projected part along the peripheral edge of the semiconductor wafer.
摘要翻译：用于支撑450mm的半导体晶片的单独的支撑体附接到容器主体的任一侧壁的内表面。每个支撑体由从框架横向突出的前支撑件形成，并且将晶片水平地保持在至少在前周边边缘中的侧部; 以及从框架侧向突出并水平地将晶片保持在至少在后周缘中的侧部的后支撑件。前支撑件由从框架的前部向半导体晶片的前周边延伸的突起部分和从投影部分沿着半导体晶片的周缘向后延伸的弯曲部分形成。

5. 发明授权

US5707500A Vacuum processing equipment, film coating equipment and deposition method 失效
标题翻译：真空加工设备，薄膜涂装设备及沉积方法
公开(公告)号：US5707500A
公开(公告)日：1998-01-13
申请号：US467964
申请日：1995-06-06
申请人： Hideaki Shimamura , Yuji Yoneoka , Shigeru Kobayashi , Satosi Kisimoto , Sunao Matsubara , Hiroyuki Shida , Yukio Tanigaki , Masashi Yamamoto , Susumu Tsuzuku , Eisuke Nishitani , Tokio Kato , Akira Okamoto
发明人： Hideaki Shimamura , Yuji Yoneoka , Shigeru Kobayashi , Satosi Kisimoto , Sunao Matsubara , Hiroyuki Shida , Yukio Tanigaki , Masashi Yamamoto , Susumu Tsuzuku , Eisuke Nishitani , Tokio Kato , Akira Okamoto
IPC分类号： C23C14/54 , H01L21/00 , C23C16/00 , C23F1/02
CPC分类号： H01L21/67109 , C23C14/541 , H01L21/67098
摘要： The present invention relates to vacuum processing equipment for processing a wafer in a vacuum, and film coating or forming equipment and method for forming a film on a wafer wherein radiation measurement and temperature control of the wafer is carried out by using an infrared radiation thermometer. Based upon the radiation measurement, heating and/or cooling of the wafer during processing is carried out.
摘要翻译：本发明涉及在真空中加工晶片的真空处理设备，以及在晶片上形成薄膜的薄膜涂布或成形设备及方法，其中通过使用红外辐射温度计进行晶片的辐射测量和温度控制。基于辐射测量，进行处理期间晶片的加热和/或冷却。

6. 发明授权

US06224676B1 Gas supply apparatus and film forming apparatus 失效
标题翻译：供气装置和成膜装置
公开(公告)号：US06224676B1
公开(公告)日：2001-05-01
申请号：US09451911
申请日：1999-12-01
申请人： Katsunori Nakajima , Hiroyuki Shida , Eiji Setoyama , Koji Ishiguro , Hikaru Saruta
发明人： Katsunori Nakajima , Hiroyuki Shida , Eiji Setoyama , Koji Ishiguro , Hikaru Saruta
IPC分类号： C23C1600
CPC分类号： C23C16/44 , C23C16/52 , H01L21/67017
摘要： According to the present invention, a signal transmission system is arranged in a region surrounded by a gas control means and a plurality of blocks whereby a region between elements constituting a gas supply flow path can be utilized for the region of the signal transmission system thereby to make the occupying space small and miniaturize the apparatus.
摘要翻译：根据本发明，信号传输系统被布置在由气体控制装置和多个块包围的区域中，由此构成气体供应流路的元件之间的区域可以用于信号传输系统的区域，从而使占用空间小，装置小型化。

7. 发明授权

US5815396A Vacuum processing device and film forming device and method using same 失效
标题翻译：真空处理装置及成膜装置及其使用方法
公开(公告)号：US5815396A
公开(公告)日：1998-09-29
申请号：US437683
申请日：1995-05-09
申请人： Hideaki Shimamura , Yuji Yoneoka , Shigeru Kobayashi , Satosi Kisimoto , Sunao Matsubara , Hiroyuki Shida , Yukio Tanigaki , Masashi Yamamoto , Susumu Tsuzuku , Eisuke Nishitani , Tokio Kato , Akira Okamoto
发明人： Hideaki Shimamura , Yuji Yoneoka , Shigeru Kobayashi , Satosi Kisimoto , Sunao Matsubara , Hiroyuki Shida , Yukio Tanigaki , Masashi Yamamoto , Susumu Tsuzuku , Eisuke Nishitani , Tokio Kato , Akira Okamoto
IPC分类号： C23C14/54 , H01L21/00 , G06F11/00 , G06F19/00
CPC分类号： H01L21/67109 , C23C14/541 , H01L21/67098
摘要： The present invention relates to vacuum processing equipment for processing a wafer in a vacuum, and film coating or forming equipment and method for forming a film on a wafer wherein radiation measurement and temperature control of the wafer is carried out by using an infrared radiation thermometer. Based upon the radiation measurement, heating and/or cooling of the wafer during processing is carried out.
摘要翻译：本发明涉及在真空中加工晶片的真空处理设备，以及在晶片上形成薄膜的薄膜涂布或成形设备及方法，其中通过使用红外辐射温度计进行晶片的辐射测量和温度控制。基于辐射测量，进行处理期间晶片的加热和/或冷却。

8. 发明授权

US08627959B2 Substrate storage container 有权
标题翻译：基材储存容器
公开(公告)号：US08627959B2
公开(公告)日：2014-01-14
申请号：US12997414
申请日：2009-06-12
申请人： Kazumasa Ohnuki , Hiroyuki Shida , Satoshi Odashima
发明人： Kazumasa Ohnuki , Hiroyuki Shida , Satoshi Odashima
IPC分类号： B65D85/48 , B65D85/00
CPC分类号： H01L21/67379 , H01L21/67383
摘要： A separate supporting body for supporting semiconductor wafers of φ450 mm is attached to the inner surface of either side wall of a container body. Each supporting body is formed of a front supporting piece that is projected laterally from a frame and horizontally retains the wafer on, at least, the side part in the front peripheral edge; and a rear supporting piece that is projected laterally from frame and horizontally retains the wafer on, at least, the side part in the rear peripheral edge. Front supporting piece is formed of a projected part that extends from the front of frame toward the front peripheral edge of the semiconductor wafer and a curved part that extends rearwards from projected part along the peripheral edge of the semiconductor wafer.
摘要翻译：用于支撑phi450mm的半导体晶片的单独的支撑体附接到容器主体的任一侧壁的内表面。每个支撑体由从框架横向突出的前支撑件形成，并且将晶片水平地保持在至少在前周边边缘中的侧部; 以及从框架侧向突出并水平地将晶片保持在至少在后周缘中的侧部的后支撑件。前支撑件由从框架的前部向半导体晶片的前周边延伸的突起部分和从投影部分沿着半导体晶片的周缘向后延伸的弯曲部分形成。

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