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    • 6. 发明申请
    • FILM-FORMING MATERIAL AND METHOD OF FORMING PATTERN
    • 成膜材料和形成图案的方法
    • US20090134119A1
    • 2009-05-28
    • US11997300
    • 2006-08-24
    • Shogo MatsumaruHideo HadaFujikawa ShigenoriToyoki Kunitake
    • Shogo MatsumaruHideo HadaFujikawa ShigenoriToyoki Kunitake
    • C23F1/02
    • H01L21/0273C09D183/04G03F7/0755G03F7/40H01L21/31138H01L21/31144
    • A film-forming material that is capable of forming, at a low temperature, a film having a high degree of etching resistance and a high etching selectivity ratio relative to an organic film, as well as a method of forming a pattern that uses the film-forming material. The film-forming material includes a metal compound (W) capable of generating a hydroxyl group upon hydrolysis, and a solvent (S) in which the metal compound is dissolved, wherein the solvent (S) includes a solvent (S1) with a boiling point of at least 155° C. that contains no functional groups that react with the metal compound (W). The method of forming a pattern includes the steps of: coating a pattern, which has been formed on top of an organic film of a laminate that includes a substrate and the organic film, using the above film-forming material, and then conducting etching of the organic film using the pattern as a mask.
    • 能够在低温下形成相对于有机膜具有高耐蚀刻性和高蚀刻选择比的膜的成膜材料以及形成使用该膜的图案的方法 形成材料。 成膜材料包括水解时能够产生羟基的金属化合物(W)和其中溶解有金属化合物的溶剂(S),其中溶剂(S)包括沸腾的溶剂(S1) 至少155℃,不含与金属化合物(W)反应的官能团。 形成图案的方法包括以下步骤:使用上述成膜材料涂覆已经形成在包括基材和有机膜的层压体的有机膜的顶部上的图案,然后进行蚀刻 使用该图案作为掩模的有机膜。
    • 7. 发明授权
    • Film-forming material and method of forming pattern
    • 成膜材料及其形成方法
    • US08101013B2
    • 2012-01-24
    • US11997300
    • 2006-08-24
    • Shogo MatsuMaruHideo HadaShingenori FujikawaToyoki Kunitake
    • Shogo MatsuMaruHideo HadaShingenori FujikawaToyoki Kunitake
    • C09D5/00C09K13/00
    • H01L21/0273C09D183/04G03F7/0755G03F7/40H01L21/31138H01L21/31144
    • A film-forming material that is capable of forming, at a low temperature, a film having a high degree of etching resistance and a high etching selectivity ratio relative to an organic film, as well as a method of forming a pattern that uses the film-forming material. The film-forming material includes a metal compound (W) capable of generating a hydroxyl group upon hydrolysis, and a solvent (S) in which the metal compound is dissolved, wherein the solvent (S) includes a solvent (S1) with a boiling point of at least 155° C. that contains no functional groups that react with the metal compound (W). The method of forming a pattern includes the steps of: coating a pattern, which has been formed on top of an organic film of a laminate that includes a substrate and the organic film, using the above film-forming material, and then conducting etching of the organic film using the pattern as a mask.
    • 能够在低温下形成相对于有机膜具有高耐蚀刻性和高蚀刻选择比的膜的成膜材料以及形成使用该膜的图案的方法 形成材料。 成膜材料包括水解时能够产生羟基的金属化合物(W)和其中溶解有金属化合物的溶剂(S),其中溶剂(S)包括沸腾的溶剂(S1) 至少155℃,不含与金属化合物(W)反应的官能团。 形成图案的方法包括以下步骤:使用上述成膜材料涂覆已经形成在包括基材和有机膜的层压体的有机膜的顶部上的图案,然后进行蚀刻 使用该图案作为掩模的有机膜。
    • 9. 发明申请
    • METHOD FOR MANUFACTURING STRUCTURE, AND STRUCTURE
    • 制造结构和结构的方法
    • US20090087625A1
    • 2009-04-02
    • US12202972
    • 2008-09-02
    • Shigenori FujikawaToyoki KunitakeHiromi TakemotoMari KoizumiHideo HadaSanae Furuya
    • Shigenori FujikawaToyoki KunitakeHiromi TakemotoMari KoizumiHideo HadaSanae Furuya
    • B32B3/10B05D1/36
    • B81C1/00111Y10S977/70Y10S977/84Y10S977/89Y10S977/892Y10T428/24802
    • A method of producing a structure, including: a composite film formation step that forms a composite film composed of a coating film and an organic film or inorganic film on top of a substrate by conducting Steps (1) to (3) below: (1) forming the coating film composed of a metal layer or a metal oxide layer on the surface of a template provided on top of the substrate, (2) forming the organic film or inorganic film on the surface of the coating film, and (3) removing a portion of the organic film or inorganic film and the coating film; a second coating film formation step that forms a second coating film composed of a metal layer or a metal oxide layer on the surface of the composite film; a coating step that, following formation of the second coating film, forms an organic coating film on the substrate that covers the surface of the substrate; a removal step that removes a portion of the second coating film, the side surfaces of which are at least partially supported by the organic coating film; and a structure formation step that forms a structure composed of a metal layer or metal oxide layer on the substrate by removing all residues left on the substrate except for the coating film and the second coating film.
    • 一种制造结构的方法,包括:通过进行下述步骤(1)至(3),在基板的顶部上形成由涂膜和有机膜或无机膜构成的复合膜的复合膜形成步骤:(1 ),在设置在基板顶部的模板表面上形成由金属层或金属氧化物层构成的涂膜,(2)在涂膜的表面形成有机膜或无机膜,(3) 去除一部分有机膜或无机膜和涂膜; 第二涂膜形成步骤,在复合膜的表面上形成由金属层或金属氧化物层构成的第二涂膜; 涂覆步骤,在形成第二涂膜之后,在覆盖基材表面的基材上形成有机涂膜; 去除步骤,其去除第二涂膜的一部分,其侧表面至少部分地由有机涂膜支撑; 以及结构形成步骤,通过去除除了涂膜和第二涂膜之外的残留在基板上的残留物,在基板上形成由金属层或金属氧化物层构成的结构。