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    • 4. 发明申请
    • METAL LAYER LAMINATE HAVING ROUGHENED METAL SURFACE LAYER AND METHOD FOR PRODUCING THE SAME
    • 具有粗化金属表面层的金属层叠层及其制造方法
    • US20100190029A1
    • 2010-07-29
    • US12666807
    • 2008-06-09
    • Shiki Ueki
    • Shiki Ueki
    • B32B5/00C25D5/56B05D5/12
    • C23C2/04B32B15/08B32B15/20B32B27/281B32B27/285B32B27/286B32B27/32B32B27/36B32B27/38B32B27/42B32B2307/202B32B2307/206B32B2307/704B32B2457/08C23C28/00H05K3/181H05K3/384H05K3/386H05K2201/0179H05K2201/0358H05K2203/072Y10T428/12993
    • Provided are a metal layer laminate that includes a roughened metal surface layer having a surface profile capable of strongly adhering to resin materials even when the surface roughness is small, and a simple method for producing a metal layer laminate having good adhesion to resin materials such as a resin substrate for a metal layer and an insulating resin film formed on the surface of a metal wiring portion. The metal layer laminate includes a metal layer, a resin thin film, and a roughened metal surface layer, wherein the resin thin film and the roughened metal surface layer are formed on the surface of the metal layer, a fractal-shaped interface structure appears between the resin thin film and the roughened metal surface layer, when the metal layer laminate is cut in a normal direction, and the interface structure has a fractal dimension of 1.05 to 1.50 as calculated using a box counting method with the measurement object region being set to from 50 nm to 5 μm and the box size (pixel size) being set to 1/100 or less of the measurement object region. The metal layer laminate is obtained by a production method including the steps of forming a resin thin film on the surface of a metal layer and subjecting the resin thin film-carrying metal layer to a plating process.
    • 提供一种金属层叠体,其具有即使在表面粗糙度小的情况下也具有能够强烈地附着在树脂材料上的表面轮廓的粗糙金属表面层,以及与树脂材料(例如, 用于金属层的树脂基板和形成在金属布线部分的表面上的绝缘树脂膜。 金属层层叠体包括金属层,树脂薄膜和粗糙化的金属表面层,其中树脂薄膜和粗糙金属表面层形成在金属层的表面上,分形形状的界面结构出现在 树脂薄膜和粗糙金属表面层,当金属层层压板沿正向切割时,并且界面结构的分形维数为1.05至1.50,使用盒计数方法计算,其中测量对象区域设置为 从50nm到5μm,并且盒尺寸(像素尺寸)被设置为测量对象区域的1/100或更小。 通过包括以下步骤的制造方法获得金属层层叠体:在金属层的表面上形成树脂薄膜,对树脂薄膜负载金属层进行电镀处理。