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1. 发明授权

US07010378B2 Component and material traceability control apparatus, control method, control program, and control program memory medium 失效
公开(公告)号：US07010378B2
公开(公告)日：2006-03-07
申请号：US11046589
申请日：2005-01-28
申请人： Satoshi Ohishi , Kazuo Hara , Yoshifumi Morioka , Katsumi Otani , Makoto Kogai
发明人： Satoshi Ohishi , Kazuo Hara , Yoshifumi Morioka , Katsumi Otani , Makoto Kogai
IPC分类号： G06F19/00 , G06F17/30
CPC分类号： G06Q10/06 , H05K3/00 , H05K13/084 , Y10S707/99945 , Y10S707/99948
摘要： The present invention is related to a component and material traceability control apparatus for controlling manufacturing lot identification information of any of a component and material constituting a product manufactured according to a process where a manufacturing apparatus with not less than one component and material reserve unit picks up a needed amount out of the component and material reserved in the component and material reserve unit and manufactures the product, and the component and material traceability control apparatus is equipped with at least a processing unit, a memory unit used as a work area by the processing unit, a manufacturing performance information memory unit, a component and material supply performance information memory unit, and a manufacturing lot trace information memory unit.

2. 发明授权

US07200457B2 Component and material traceability control apparatus, control method, control program, and control program memory medium 有权
标题翻译：组件和材料可追溯性控制装置，控制方法，控制程序和控制程序存储介质
公开(公告)号：US07200457B2
公开(公告)日：2007-04-03
申请号：US11282452
申请日：2005-11-17
申请人： Satoshi Ohishi , Kazuo Hara , Yoshifumi Morioka , Katsumi Otani , Makoto Kogai
发明人： Satoshi Ohishi , Kazuo Hara , Yoshifumi Morioka , Katsumi Otani , Makoto Kogai
IPC分类号： G06F19/00 , G06F17/30
CPC分类号： G06Q10/06 , H05K3/00 , H05K13/084 , Y10S707/99945 , Y10S707/99948
摘要： The present invention is related to a component and material traceability control apparatus for controlling manufacturing lot identification information of any of a component and material constituting a product manufactured according to a process where a manufacturing apparatus with not less than one component and material reserve unit picks up a needed amount out of the component and material reserved in the component and material reserve unit and manufactures the product, and the component and material traceability control apparatus is equipped with at least a processing unit, a memory unit used as a work area by the processing unit, a manufacturing performance information memory unit, a component and material supply performance information memory unit, and a manufacturing lot trace information memory unit.
摘要翻译：本发明涉及一种用于控制构成产品的部件和材料的制造批次识别信息的组件和材料可追溯性控制装置，该组件和材料根据其中具有不少于一个部件和材料储备单元拾取的制造装置的工艺制造从部件和材料备料单元中保留的部件和材料中所需的量，并制造产品，并且部件和材料可追溯性控制装置至少配备有处理单元，通过处理用作工作区的存储单元单元，制造性能信息存储单元，组件和材料供应性能信息存储单元，以及制造批次跟踪信息存储单元。

3. 发明申请

US20060079984A1 Component and material traceability control apparatus, control method, control program, and control program memory medium 有权
标题翻译：组件和材料可追溯性控制装置，控制方法，控制程序和控制程序存储介质
公开(公告)号：US20060079984A1
公开(公告)日：2006-04-13
申请号：US11282452
申请日：2005-11-17
申请人： Satoshi Ohishi , Kazuo Hara , Yoshifumi Morioka , Katsumi Otani , Makoto Kogai
发明人： Satoshi Ohishi , Kazuo Hara , Yoshifumi Morioka , Katsumi Otani , Makoto Kogai
IPC分类号： G06F19/00
CPC分类号： G06Q10/06 , H05K3/00 , H05K13/084 , Y10S707/99945 , Y10S707/99948
摘要： The present invention is related to a component and material traceability control apparatus for controlling manufacturing lot identification information of any of a component and material constituting a product manufactured according to a process where a manufacturing apparatus with not less than one component and material reserve unit picks up a needed amount out of the component and material reserved in the component and material reserve unit and manufactures the product, and the component and material traceability control apparatus is equipped with at least a processing unit, a memory unit used as a work area by the processing unit, a manufacturing performance information memory unit, a component and material supply performance information memory unit, and a manufacturing lot trace information memory unit.
摘要翻译：本发明涉及一种用于控制构成产品的部件和材料的制造批次识别信息的组件和材料可追溯性控制装置，该组件和材料根据其中具有不少于一个部件和材料储备单元拾取的制造装置的工艺制造从部件和材料备料单元中保留的部件和材料中所需的量，并制造产品，并且部件和材料可追溯性控制装置至少配备有处理单元，通过处理用作工作区的存储单元单元，制造性能信息存储单元，组件和材料供应性能信息存储单元，以及制造批次跟踪信息存储单元。

4. 发明申请

US20060020361A1 COMPONENT AND MATERIAL TRACEABILITY CONTROL APPARATUS, CONTROL METHOD, CONTROL PROGRAM, AND CONTROL PROGRAM MEMORY MEDIUM 失效
标题翻译：组件和材料可追溯性控制装置，控制方法，控制程序和控制程序存储介质
公开(公告)号：US20060020361A1
公开(公告)日：2006-01-26
申请号：US11046589
申请日：2005-01-28
申请人： Satoshi Ohishi , Kazuo Hara , Yoshifumi Morioka , Katsumi Otani , Makoto Kogai
发明人： Satoshi Ohishi , Kazuo Hara , Yoshifumi Morioka , Katsumi Otani , Makoto Kogai
IPC分类号： G06F19/00
CPC分类号： G06Q10/06 , H05K3/00 , H05K13/084 , Y10S707/99945 , Y10S707/99948
摘要： The present invention is related to a component and material traceability control apparatus for controlling manufacturing lot identification information of any of a component and material constituting a product manufactured according to a process where a manufacturing apparatus with not less than one component and material reserve unit picks up a needed amount out of the component and material reserved in the component and material reserve unit and manufactures the product, and the component and material traceability control apparatus is equipped with at least a processing unit, a memory unit used as a work area by the processing unit, a manufacturing performance information memory unit, a component and material supply performance information memory unit, and a manufacturing lot trace information memory unit.
摘要翻译：本发明涉及一种用于控制构成产品的部件和材料的制造批次识别信息的组件和材料可追溯性控制装置，该组件和材料根据其中具有不少于一个部件和材料储备单元拾取的制造装置的工艺制造从部件和材料备料单元中保留的部件和材料中所需的量，并制造产品，并且部件和材料可追溯性控制装置至少配备有处理单元，通过处理用作工作区的存储单元单元，制造性能信息存储单元，组件和材料供应性能信息存储单元，以及制造批次跟踪信息存储单元。

5. 发明申请

US20080217753A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20080217753A1
公开(公告)日：2008-09-11
申请号：US12041793
申请日：2008-03-04
申请人： Katsumi Otani
发明人： Katsumi Otani
IPC分类号： H01L23/367 , H01L21/58
CPC分类号： H01L23/3128 , H01L21/565 , H01L23/4334 , H01L23/49816 , H01L23/49827 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/83 , H01L2224/2919 , H01L2224/32225 , H01L2224/451 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2224/83851 , H01L2224/92247 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012 , H01L2224/32245 , H01L2224/48247
摘要： A semiconductor device includes a semiconductor element 1, a thermal conductor 91 located opposite a major surface of the semiconductor element 1, and a mold resin member 6 molding the semiconductor element 1 and at least a part of the thermal conductor 91, wherein at least a part of a top surface of the thermal conductor 91 has an exposed portion exposed from the mold resin member 6, the exposed portion of the thermal conductor 91 has an opening 11, and a periphery of the opening 11 forms a projecting portion 91b projecting toward an opposite side of the semiconductor element 1.
摘要翻译：半导体器件包括半导体元件1，与半导体元件1的主表面相对的热导体91和模制树脂部件6，模制半导体元件1和至少一部分热导体91，其中至少一个热导体91的上表面的一部分具有从模制树脂部件6露出的暴露部分，热导体91的露出部分具有开口11，并且开口11的周边形成突出部分91b，突出部分91b朝向半导体元件1的相对侧。

6. 发明申请

US20110079902A1 SEMICONDUCTOR DEVICE 审中-公开
标题翻译：半导体器件
公开(公告)号：US20110079902A1
公开(公告)日：2011-04-07
申请号：US12847526
申请日：2010-07-30
申请人： Takeshi SAKAMOTO , Katsumi Otani , Kimihito Kuwabara
发明人： Takeshi SAKAMOTO , Katsumi Otani , Kimihito Kuwabara
IPC分类号： H01L23/488 , H01L23/31 , H01L23/48 , H01L23/373
CPC分类号： H01L23/4006 , H01L21/563 , H01L23/367 , H01L23/3677 , H01L23/42 , H01L24/32 , H01L2224/131 , H01L2224/13144 , H01L2224/1329 , H01L2224/133 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/0001 , H01L2924/01019 , H01L2924/01079 , H01L2924/15311 , H01L2924/16152 , H01L2924/00 , H01L2924/00014 , H01L2924/014 , H01L2224/13099
摘要： A semiconductor device has a wiring substrate provided with an external connecting terminal on a lower surface, a semiconductor chip mounted onto an upper surface of the wiring substrate, a cap-shaped heat dissipation member arranged on the upper surface of the wiring substrate so as to cover the semiconductor chip, a fixing pin for fixing the heat dissipation member onto the upper surface of the wiring substrate, and a heat transfer material sandwiched between a lower surface of the heat dissipation member just above the semiconductor chip and the upper surface of the semiconductor chip.
摘要翻译：半导体器件具有在下表面上设置有外部连接端子的布线基板，安装在布线基板的上表面上的半导体芯片，布置在布线基板的上表面上的帽状散热部件，以便覆盖半导体芯片，用于将散热构件固定在布线基板的上表面上的固定销和夹在半导体芯片正上方的散热构件的下表面和半导体的上表面之间的传热材料芯片。

7. 发明授权

US08711561B2 Cooling structure for electronic device 有权
标题翻译：电子设备冷却结构
公开(公告)号：US08711561B2
公开(公告)日：2014-04-29
申请号：US13517190
申请日：2012-01-27
申请人： Subaru Matsumoto , Kou Komori , Daisuke Katayama , Katsumi Otani
发明人： Subaru Matsumoto , Kou Komori , Daisuke Katayama , Katsumi Otani
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/36 , H01L2924/0002 , H01L2924/00
摘要： A heat generating component (3) is mounted on one surface of a circuit board (2). A heat release member (4) is disposed between the one surface and an opposite wall (12) of a housing (1). The heat release member (4) has a plate (41) that extends in a specified direction and is in contact with the heat generating component (3), and fins (42) that project from the plate (41) toward the opposite wall (12). In a region of the opposite wall (12) of the housing overlapping with the heat release member (4), an air inlet (1c) is provided so as to extend in the specified direction. The heat release member (4) is, at both end portions thereof in the specified direction, in contact with the opposite wall (12) via heat-conductive spacers (9), and a gap (8) is formed between the fins (42) and the opposite wall (12).
摘要翻译：发电部件（3）安装在电路板（2）的一个表面上。散热构件（4）设置在壳体（1）的一个表面和相对的壁（12）之间。散热构件（4）具有沿特定方向延伸并与发热部件（3）接触的板（41）和从板（41）向相对壁突出的翅片（42） 12）。在与散热构件（4）重叠的壳体的相对壁（12）的区域中，设置空气入口（1c）以沿指定方向延伸。散热构件（4）在两个端部沿规定方向通过导热间隔件（9）与相对的壁（12）接触，并且在翅片（42）之间形成间隙（8））和相对的壁（12）。

8. 发明授权

US4788680A Method of selecting time slot in time division switching network and apparatus therefor 失效
标题翻译：在时分交换网络中选择时隙的方法及其设备
公开(公告)号：US4788680A
公开(公告)日：1988-11-29
申请号：US15626
申请日：1987-02-17
申请人： Susumu Kikuchi , Katsumi Otani , Takeaki Yamamoto
发明人： Susumu Kikuchi , Katsumi Otani , Takeaki Yamamoto
IPC分类号： H04Q11/04
CPC分类号： H04Q11/0407
摘要： A time slot selecting method applied to a time division switch in a time division switching network having multi-stage tandem connected time division switches. A controller associated with an upstream time division switch selects an outgoing idle time slot for multi-slot information in accordance with a predetermined time slot selecting order in a manner that the number of combinations of time slots selectable by a downstream time division switch becomes large. Thus, the range of selecting time slots by a downstream time division switch becomes broadened while ensuring the sequence integrity of multi-slots in a frame and hence a path blocking rate is reduced.
摘要翻译：一种应用于具有多级串联连接时分开关的时分交换网络中的时分开关的时隙选择方法。与上游时分交换机相关联的控制器按照下行时分交换机选择的时隙的组合数量变大的方式，根据预定的时隙选择顺序选择多时隙信息的输出空闲时隙。因此，通过下行时分交换机的选择时隙的范围变宽，同时确保帧中的多时隙的序列完整性，从而降低路径阻塞率。

9. 发明授权

US07989947B2 Semiconductor device and method of manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07989947B2
公开(公告)日：2011-08-02
申请号：US12041793
申请日：2008-03-04
申请人： Katsumi Otani
发明人： Katsumi Otani
IPC分类号： H01L23/34
CPC分类号： H01L23/3128 , H01L21/565 , H01L23/4334 , H01L23/49816 , H01L23/49827 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/83 , H01L2224/2919 , H01L2224/32225 , H01L2224/451 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2224/83851 , H01L2224/92247 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012 , H01L2224/32245 , H01L2224/48247
摘要： A semiconductor device includes a semiconductor element 1, a thermal conductor 91 located opposite a major surface of the semiconductor element 1, and a mold resin member 6 molding the semiconductor element 1 and at least a part of the thermal conductor 91, wherein at least a part of a top surface of the thermal conductor 91 has an exposed portion exposed from the mold resin member 6, the exposed portion of the thermal conductor 91 has an opening 11, and a periphery of the opening 11 forms a projecting portion 91b projecting toward an opposite side of the semiconductor element 1.
摘要翻译：半导体器件包括半导体元件1，与半导体元件1的主表面相对的热导体91和模制树脂部件6，模制半导体元件1和至少一部分热导体91，其中至少一个热导体91的上表面的一部分具有从模制树脂部件6露出的暴露部分，热导体91的露出部分具有开口11，并且开口11的周边形成突出部分91b 半导体元件1的相对侧。

10. 发明申请

US20120314365A1 COOLING STRUCTURE FOR ELECTRONIC DEVICE 有权
标题翻译：电子设备冷却结构
公开(公告)号：US20120314365A1
公开(公告)日：2012-12-13
申请号：US13517190
申请日：2012-01-27
申请人： Subaru Matsumoto , Kou Komori , Daisuke Katayama , Katsumi Otani
发明人： Subaru Matsumoto , Kou Komori , Daisuke Katayama , Katsumi Otani
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/36 , H01L2924/0002 , H01L2924/00
摘要： A heat generating component (3) is mounted on one surface of a circuit board (2). A heat release member (4) is disposed between the one surface and an opposite wall (12) of a housing (1). The heat release member (4) has a plate (41) that extends in a specified direction and is in contact with the heat generating component (3), and fins (42) that project from the plate (41) toward the opposite wall (12). In a region of the opposite wall (12) of the housing overlapping with the heat release member (4), an air inlet (1c) is provided so as to extend in the specified direction. The heat release member (4) is, at both end portions thereof in the specified direction, in contact with the opposite wall (12) via heat-conductive spacers (9), and a gap (8) is formed between the fins (42) and the opposite wall (12).
摘要翻译：发电部件（3）安装在电路板（2）的一个表面上。散热构件（4）设置在壳体（1）的一个表面和相对的壁（12）之间。散热构件（4）具有沿特定方向延伸并与发热部件（3）接触的板（41）和从板（41）向相对壁突出的翅片（42） 12）。在与散热构件（4）重叠的壳体的相对壁（12）的区域中，设置空气入口（1c）以沿指定方向延伸。散热构件（4）在两个端部沿规定方向通过导热间隔件（9）与相对的壁（12）接触，并且在翅片（42）之间形成间隙（8））和相对的壁（12）。

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