专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2011085086A3 MOISTURE-PROOF EXPANSION CHAMBER FOR EQUALIZING PRESSURE IN SEALED CONCENTRATOR PHOTOVOLTAIC SOLAR MODULES 审中-公开
标题翻译：密封浓缩器光伏太阳能模块中均衡压力的防潮扩展室
公开(公告)号：WO2011085086A3
公开(公告)日：2012-03-08
申请号：PCT/US2011020353
申请日：2011-01-06
申请人： SEMPRIUS INC , FURMAN BRUCE , MENARD ETIENNE , BUKOVNIK RUDY , BURROUGHS SCOTT
发明人： FURMAN BRUCE , MENARD ETIENNE , BUKOVNIK RUDY , BURROUGHS SCOTT
IPC分类号： H01L31/052
CPC分类号： H01L31/048 , F24J2/4618 , F24J2/4629 , H01L31/054 , Y02E10/40 , Y02E10/52
摘要： A concentrator-type photovoltaic device includes at least one light receiving module having a plurality of photovoltaic devices therein, and a pressure regulating device comprising a volume-adjustable chamber that is pneumatically coupled to the at least one light receiving module. The volume-adjustable chamber may be configured to expand and contract in response to temperature fluctuations within the at least one light receiving module. The volume-adjustable chamber can be made from a flexible metalized film with a low water vapor transmission rate. In this way the module can remain sealed from water penetration and yet maintain uniform internal pressure during thermal excursions. The volume-adjustable chamber may be combined with a desiccant such that, as air moves into the expansion chamber, it passes over the desiccant, which removes moisture that has penetrated into the sealed module.
摘要翻译：集中器型光伏器件包括其中具有多个光伏器件的至少一个光接收模块，以及压力调节装置，其包括气动耦合到所述至少一个光接收模块的体积可调节室。体积可调节室可以被配置为响应于至少一个光接收模块内的温度波动而膨胀和收缩。体积可调节室可以由具有低水蒸汽透过率的柔性金属化薄膜制成。以这种方式，模块可以保持与水渗透密封，并且在热偏移期间保持均匀的内部压力。体积可调节室可以与干燥剂组合，使得当空气移动到膨胀室中时，其通过干燥剂，其除去已渗透到密封模块中的水分。

2. 发明申请

WO2010091391A3 CONCENTRATOR-TYPE PHOTOVOLTAIC (CPV) MODULES, RECEIVERS AND SUB-RECEIVERS AND METHODS OF FORMING SAME 审中-公开
标题翻译：浓缩型光伏（CPV）模块，接收器和分接收器及其形成方法
公开(公告)号：WO2010091391A3
公开(公告)日：2011-09-29
申请号：PCT/US2010023577
申请日：2010-02-09
申请人： SEMPRIUS INC , MENARD ETIENNE , BOWER CHRISTOPHER , BURROUGHS SCOTT , CARR JOE , CONNER BOB , DETS SERGIY , FURMAN BRUCE , MEITL MATTHEW , SULLIVAN MICHAEL
发明人： MENARD ETIENNE , BOWER CHRISTOPHER , BURROUGHS SCOTT , CARR JOE , CONNER BOB , DETS SERGIY , FURMAN BRUCE , MEITL MATTHEW , SULLIVAN MICHAEL
IPC分类号： H01L31/052
CPC分类号： G02B19/0076 , G02B3/0056 , G02B19/0014 , G02B19/0042 , H01L31/0232 , H01L31/02325 , H01L31/0543 , H01L31/0547 , Y02E10/52
摘要： CPV modules include a back plate having an array of 1mm2 or smaller solar cells thereon. A backplane interconnect network is also provided on the back plate. This backplane interconnect network operates to electrically connect the array of solar cells together. A front plate, which is spaced-apart from the back plate, is provided. This front plate includes an array of primary lenses thereon that face the array of solar cells. The front plate can be configured to provide a greater than 1000X lens-to-cell light concentration to the array of solar cells. To achieve this 1000X lens-to-cell light concentration, the primary lenses can be configured as plano-convex lenses having a lens sag of less than about 4 mm. An array of secondary optical elements may also be provided, which extend between the array of primary lenses and the array of solar cells.
摘要翻译： CPV模块包括其上具有1mm 2或更小的太阳能电池阵列的背板。背板互连网络也设置在背板上。该背板互连网络用于将太阳能电池阵列电连接在一起。提供了与背板间隔开的前板。该前板包括面向太阳能电池阵列的主镜阵列。前板可以被配置为向太阳能电池阵列提供大于1000X的透镜到单元的光浓度。为了实现这种1000X透镜到单元的光浓度，主透镜可以被配置为具有小于约4mm的透镜凹陷的平凸透镜。还可以提供在主要透镜阵列和太阳能电池阵列之间延伸的次级光学元件阵列。

3. 发明申请

WO2012018997A2 MATERIALS AND PROCESSES FOR RELEASING PRINTABLE COMPOUND SEMICONDUCTOR DEVICES 审中-公开
标题翻译：用于释放可打印化合物半导体器件的材料和工艺
公开(公告)号：WO2012018997A2
公开(公告)日：2012-02-09
申请号：PCT/US2011046575
申请日：2011-08-04
申请人： SEMPRIUS INC , MEITL MATTHEW , BOWER CHRISTOPHER , MENARD ETIENNE , CARTER JAMES , GRAY ALLEN , BONAFEDE SALVATORE
发明人： MEITL MATTHEW , BOWER CHRISTOPHER , MENARD ETIENNE , CARTER JAMES , GRAY ALLEN , BONAFEDE SALVATORE
IPC分类号： H01L21/46
CPC分类号： H01L21/306 , H01L21/02395 , H01L21/02461 , H01L21/02546 , H01L21/02549 , H01L21/02664 , H01L21/30612 , H01L21/7813 , H01L23/053 , H01L23/28 , H01L31/02168 , H01L31/048 , H01L31/184 , H01L31/1844 , H01L31/1892 , H01L2924/0002 , Y02E10/544 , H01L2924/00
摘要： A method of fabricating transferable semiconductor devices includes providing a release layer including indium aluminum phosphide on a substrate, and providing a support layer on the release layer. The support layer and the substrate include respective materials, such as arsenide-based materials, such that the release layer has an etching selectivity relative to the support layer and the substrate. At least one device layer is provided on the support layer. The release layer is selectively etched without substantially etching the support layer and the substrate. Related structures and methods are also discussed.
摘要翻译：制造可转移半导体器件的方法包括在衬底上提供包括磷化铟铝的释放层，并且在释放层上提供支撑层。支撑层和衬底包括相应的材料，例如砷化物基材料，使得释放层相对于支撑层和衬底具有蚀刻选择性。在支撑层上提供至少一个器件层。选择性地蚀刻释放层而基本上不蚀刻支撑层和衬底。还讨论了相关的结构和方法。

4. 发明申请

WO2012018544A2 APPARATUS AND PROCESS FOR PRODUCING PLANO-CONVEX SILICONE-ON-GLASS LENS ARRAYS 审中-公开
标题翻译：用于生产平面玻璃硅玻璃透镜阵列的装置和工艺
公开(公告)号：WO2012018544A2
公开(公告)日：2012-02-09
申请号：PCT/US2011044833
申请日：2011-07-21
申请人： SEMPRIUS INC , MEITL MATTHEW , BUKOVNIK RUDOLPH , MENARD ETIENNE , WAGNER WOLFGANG , KNEEBURG DAVID , MARK JIMMY
发明人： MEITL MATTHEW , BUKOVNIK RUDOLPH , MENARD ETIENNE , WAGNER WOLFGANG , KNEEBURG DAVID , MARK JIMMY
IPC分类号： B29C33/62
CPC分类号： G02B3/0031 , B29C33/3842 , B29C33/58 , B29C33/62 , G02B3/0025 , G02B3/0056
摘要： Coating a machined mold with a flowable, hardenable polymer coating produces an optically-smooth finish and maintains sharpness in upward-pointing features. These procedures produce molds for highly efficient plano-convex silicone-on-glass lens arrays in a fast and inexpensive manner in which an end-mill defines the shape of a lens, and the coating produces its smoothness. End-mill machining and coating lens-shaped features in plates that have movable pins produce molds with eject features disposed inside features that form templates for lens elements without significantly reducing optical performance. Additionally, machining and coating plates that have movable inserts produce molds for lens arrays with reduced volume and one or several rings in each lens element.
摘要翻译：用可流动的可硬化聚合物涂层涂覆加工的模具产生光学光滑的表面，并保持向上指向特征的清晰度。这些程序以快速和便宜的方式为高效平凸硅硅玻璃透镜阵列生产模具，其中端铣刀限定透镜的形状，并且涂层产生其平滑度。端铣加工和具有可移动销的板中的透镜形状特征在具有布置在特征内的弹出特征的模具中，其形成用于透镜元件的模板，而不显着降低光学性能。此外，具有可移动嵌件的机械加工和涂布板可以产生具有减小体积的透镜阵列的模具和每个透镜元件中的一个或几个环。

5. 发明申请

WO2010111601A3 METHODS OF FORMING PRINTABLE INTEGRATED CIRCUIT DEVICES AND DEVICES FORMED THEREBY 审中-公开
标题翻译：形成可打印集成电路设备的方法及其形成的设备
公开(公告)号：WO2010111601A3
公开(公告)日：2011-01-20
申请号：PCT/US2010028844
申请日：2010-03-26
申请人： SEMPRIUS INC , BOWER CHRISTOPHER , MENARD ETIENNE , MEITL MATTHEW , CARR JOSEPH
发明人： BOWER CHRISTOPHER , MENARD ETIENNE , MEITL MATTHEW , CARR JOSEPH
IPC分类号： H01L21/77 , H01L21/84
CPC分类号： H01L27/1266 , H01L21/3065 , H01L21/32055 , H01L21/76834 , H01L21/76877 , H01L21/84 , H01L27/1214 , H01L27/1222 , H01L27/124 , H01L27/1248 , H01L29/78666
摘要： Methods of forming integrated circuit devices include forming a sacrificial layer on a handling substrate and forming a semiconductor active layer on the sacrificial layer. A step is performed to selectively etch through the semiconductor active layer and the sacrificial layer in sequence to define an semiconductor-on-insulator (SOI) substrate, which includes a first portion of the semiconductor active layer. A multi-layer electrical interconnect network may be formed on the SOI substrate. This multi-layer electrical interconnect network may be encapsulated by an inorganic capping layer that contacts an upper surface of the first portion of the semiconductor active layer. A step can be performed to selectively etch through the capping layer and the first portion of the semiconductor active layer to thereby expose the sacrificial layer. The sacrificial layer may be selectively removed from between the first portion of the semiconductor active layer and the handling substrate to thereby define a suspended integrated circuit chip encapsulated by the capping layer.
摘要翻译：形成集成电路器件的方法包括在处理衬底上形成牺牲层并在牺牲层上形成半导体活性层。执行步骤以依次选择性地蚀刻半导体有源层和牺牲层以限定绝缘体上半导体（SOI）衬底，其包括半导体有源层的第一部分。可以在SOI衬底上形成多层电互连网络。该多层电互连网络可以由与半导体有源层的第一部分的上表面接触的无机覆盖层封装。可以执行步骤以选择性地蚀刻通过覆盖层和半导体有源层的第一部分，从而暴露牺牲层。可以从半导体有源层的第一部分和处理衬底之间选择性地去除牺牲层，从而限定由封盖层封装的悬浮集成电路芯片。

6. 发明申请

WO2011034586A3 HIGH-YIELD FABRICATION OF LARGE-FORMAT SUBSTRATES WITH DISTRIBUTED, INDEPENDENT CONTROL ELEMENTS 审中-公开
标题翻译：具有分布式独立控制元件的大型基板的高效制造
公开(公告)号：WO2011034586A3
公开(公告)日：2011-09-09
申请号：PCT/US2010002519
申请日：2010-09-16
申请人： SEMPRIUS INC , BOWER CHRISTOPHER , MENARD ETIENNE , HAMER JOHN , COK RONALD S
发明人： BOWER CHRISTOPHER , MENARD ETIENNE , HAMER JOHN , COK RONALD S
IPC分类号： H01L27/32
CPC分类号： H01L27/3255 , G01R31/28 , H01L27/3225 , H01L27/3248 , H01L27/3276 , H01L2227/323
摘要： A large-format substrate with distributed control elements is formed by providing a substrate and a wafer, the wafer having a plurality of separate, independent chiplets formed thereon; imaging the wafer and analyzing the wafer image to determine which of the chiplets are defective; removing the defective chiplet(s) from the wafer leaving remaining chiplets in place on the wafer; printing the remaining chiplet(s) onto the substrate forming empty chiplet location(s); and printing additional chiplet(s) from the same or a different wafer into the empty chiplet location(s).
摘要翻译：具有分布式控制元件的大格式基板通过提供基板和晶片形成，晶片具有形成在其上的多个独立的独立小芯片; 对晶片成像并分析晶片图像以确定哪些小芯片是有缺陷的; 从晶片上除去有缺陷的小芯片，剩下的小芯片就位于晶片上; 将剩余的小瓶印刷到形成空的小瓶位置的基底上; 以及从相同或不同的晶片将另外的一个或多个微芯片打印到空的小瓶位置。

7. 发明申请

WO2008055054A2 DEVICES AND METHODS FOR PATTERN GENERATION BY INK LITHOGRAPHY 审中-公开
标题翻译：用于通过油墨光刻产生图案的装置和方法
公开(公告)号：WO2008055054A2
公开(公告)日：2008-05-08
申请号：PCT/US2007082633
申请日：2007-10-26
申请人： UNIV ILLINOIS , ROGERS JOHN A , MENARD ETIENNE
发明人： ROGERS JOHN A , MENARD ETIENNE
IPC分类号： G03B27/04 , G03C5/00
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00 , G03F1/50 , H01L51/0017
摘要： The present invention provides methods, devices and device components for fabricating patterns on substrate surfaces, particularly patterns comprising structures having microsized and/or nanosized features of selected lengths in one, two or three dimensions and including relief and recess features with variable height, depth or height and depth. Composite patterning devices comprising a plurality of polymer layers each having selected mechanical and thermal properties and physical dimensions provide high resolution patterning on a variety of substrate surfaces and surface morphologies. Gray-scale ink lithography photomasks for gray-scale pattern generation or molds for generating embossed relief features on a substrate surface are provided. The particular shape of the fabricated patterned can be manipulated by varying the three-dimensional recess pattern on an elastomeric patterning device which is brought into conformal contact with a substrate to localize patterning agent to the recess portion of the pattern.
摘要翻译：本发明提供用于在衬底表面上制造图案的方法，装置和设备部件，具体地说图案包括具有在一维，二维或三维中具有选定长度的微细化和/或纳米化特征的结构，并包括具有可变高度，深度或高度和深度。包含多个聚合物层的复合图案形成装置各自具有选定的机械和热性能以及物理尺寸，从而在各种衬底表面和表面形态上提供高分辨率图案。提供用于灰度图案生成的灰度油墨光刻光掩模或用于在衬底表面上产生浮雕浮雕特征的模具。所制造的图案的特定形状可以通过改变弹性图案形成装置上的三维凹陷图案来操纵，所述弹性图案形成装置与衬底保形接触以将图案形成剂定位到图案的凹陷部分。

8. 发明申请

WO2005122285A3 METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICONDUCTOR ELEMENTS 审中-公开
标题翻译：用于制作和组装可印刷的半导体元件的方法和装置
公开(公告)号：WO2005122285A3
公开(公告)日：2007-08-30
申请号：PCT/US2005019354
申请日：2005-06-02
申请人： UNIV ILLINOIS , NUZZO RALPH G , ROGERS JOHN A , MENARD ETIENNE , LEE KEON JAE , KHANG DAHL-YOUNG , SUN YUGANG , MEITL MATTHEW , ZHU ZHENGTAO
发明人： NUZZO RALPH G , ROGERS JOHN A , MENARD ETIENNE , LEE KEON JAE , KHANG DAHL-YOUNG , SUN YUGANG , MEITL MATTHEW , ZHU ZHENGTAO
IPC分类号： H01L21/00 , B81C1/00 , H01L21/20 , H01L21/30 , H01L21/326 , H01L21/4763 , H01L21/77 , H01L23/48 , H01L27/01 , H01L29/06 , H01L29/08 , H01L29/786 , H01L31/0312 , H01L31/18
CPC分类号： H01L23/02 , B81C2201/0185 , B82Y10/00 , H01L21/02521 , H01L21/02603 , H01L21/02628 , H01L21/308 , H01L21/322 , H01L21/6835 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/29 , H01L24/32 , H01L24/80 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0753 , H01L27/1285 , H01L27/1292 , H01L29/04 , H01L29/06 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/12 , H01L29/76 , H01L29/78603 , H01L29/78681 , H01L29/78696 , H01L31/0392 , H01L31/03926 , H01L31/1804 , H01L31/1864 , H01L31/1896 , H01L33/007 , H01L33/0079 , H01L33/32 , H01L2221/68368 , H01L2221/68381 , H01L2224/03 , H01L2224/0332 , H01L2224/0345 , H01L2224/03614 , H01L2224/0362 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/05644 , H01L2224/05666 , H01L2224/08225 , H01L2224/2919 , H01L2224/32225 , H01L2224/80 , H01L2224/80006 , H01L2224/80121 , H01L2224/80862 , H01L2224/80895 , H01L2224/83 , H01L2224/83005 , H01L2224/83121 , H01L2224/83192 , H01L2224/83193 , H01L2224/8385 , H01L2224/83862 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2924/00012 , H01L2924/01032 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/1305 , H01L2924/1306 , H01L2924/13063 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15159 , H01L2924/15162 , H01L2924/15788 , H01L2924/1579 , Y02E10/547 , Y02P70/521 , Y10S977/707 , Y10S977/724 , H01L2924/00014 , H01L2924/00
摘要： The invention provides methods and devices for fabricating printable semiconductor elements (555) and assembling printable semiconductor elements onto substrate surfaces (330). The present invention also provides stretchable semiconductor structures (760).
摘要翻译：本发明提供了用于制造可印刷半导体元件（555）并将可印刷半导体元件组装到衬底表面（330）上的方法和装置。本发明还提供可拉伸半导体结构（760）。

9. 发明专利

AU2014213748A1 Tracking photovoltaic solar system, and methods for installing or for using such tracking photovoltaic solar system 未知
公开(公告)号：AU2014213748A1
公开(公告)日：2015-07-23
申请号：AU2014213748
申请日：2014-02-05
申请人： MENARD ETIENNE , HELIOSLITE
发明人： MENARD ETIENNE
IPC分类号： F24J2/54 , F24J2/52
摘要： A tracking photovoltaic solar system, and methods for installing or for using such tracking comprising at least a dual axis tracker unit maintaining an array of photovoltaic modules aligned to the sun. Said tracker unit includes :a pair of sub-frames supporting photovoltaic modules, a torque tube supporting said sub-frames rotating around a primary rotation axis, a pole structure fixed and extending vertically above an anchoring basis and being rotatively connected to said longitudinal support, secondary rotating means controlling the orientation of said sub-frames around corresponding secondary rotation axis of said sub- frames, said secondary rotation axis being orthogonal to said primary rotation axis and actuators means for controlling said primary and secondary rotating means. The secondary rotation axis are located at each end of said torque tube, said pole structure being central with regard to said sub-frames and said actuators means of both primary and secondary rotating means are linear.

10. 发明申请

WO2006130721A3 PRINTABLE SEMICONDUCTOR STRUCTURES AND RELATED METHODS OF MAKING AND ASSEMBLING 审中-公开
标题翻译：可制造半导体结构及相关制造和组装方法
公开(公告)号：WO2006130721A3
公开(公告)日：2009-06-25
申请号：PCT/US2006021161
申请日：2006-06-01
申请人： UNIV ILLINOIS , NUZZO RALPH G , ROGERS JOHN A , MENARD ETIENNE , LEE KEON JAE , KHANG DAHL-YOUNG , SUN YUGANG , MEITL MATTHEW , ZHU ZHENGTAO , KO HEUNG CHO , MACK SHAWN
发明人： NUZZO RALPH G , ROGERS JOHN A , MENARD ETIENNE , LEE KEON JAE , KHANG DAHL-YOUNG , SUN YUGANG , MEITL MATTHEW , ZHU ZHENGTAO , KO HEUNG CHO , MACK SHAWN
IPC分类号： H01L21/302 , H01L21/8242 , H01L23/62 , H01R12/00 , H05K3/36
CPC分类号： H01L29/0665 , B82Y10/00 , H01L21/6835 , H01L27/1266 , H01L27/1292 , H01L29/0673 , H01L29/1606 , H01L29/22 , H01L29/66742 , H01L29/7781 , H01L29/78696 , H01L2221/6835 , H01L2221/68354 , H01L2221/68368 , H01L2221/68377 , H01L2924/0002 , H01L2924/1033 , H01L2924/19041 , H01L2924/30105 , H01L2924/3025 , H01L2924/00
摘要： The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.
摘要翻译：本发明提供了用于制造，传输和组装具有选定的物理尺寸，形状，组成和空间取向的高质量可印刷半导体元件的高产率路径。本发明的组合物和方法提供了高精度的记录转印和微米尺寸和/或纳米半导体结构的阵列在包括大面积基底和/或柔性基底的基底上的集成。此外，本发明提供了从诸如散装硅晶片的低成本散装材料制造可印刷的半导体元件的方法，以及能够实现通用和商业上有吸引力的基于印刷的制造平台的智能材料处理策略，以制造广泛的功能性半导体器件。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式